Si 5 33 REVISION D D U A L F REQUENCY C R Y S TA L O SCILLATOR (XO ) (10 M H Z TO 1.4 G H Z ) Features Available with any-frequency output frequencies from 10 MHz to 945 MHz and select frequencies to 1.4 GHz 2 selectable output frequencies ® 3rd generation DSPLL with superior jitter performance 3x better frequency stability than SAW-based oscillators Pin 1 output enable (OE) Internal fixed crystal frequency ensures high reliability and low aging Available CMOS, LVPECL, LVDS, and CML outputs 3.3, 2.5, and 1.8 V supply options Industry-standard 5 x 7 mm package and pinout Pb-free/RoHS-compliant Applications Si5602 Ordering Information: See page 7. SONET/SDH Networking SD/HD video Clock and data recovery FPGA/ASIC clock generation Pin Assignments: See page 6. Description The Si533 dual frequency XO utilizes Silicon Laboratories’ advanced DSPLL® circuitry to provide a low jitter clock at high frequencies. The Si533 is available with any-frequency output frequency from 10 to 945 MHz and select frequencies to 1400 MHz. Unlike a traditional XO, where a different crystal is required for each output frequency, the Si533 uses one fixed crystal to provide a wide range of output frequencies. This IC based approach allows the crystal resonator to provide exceptional frequency stability and reliability. In addition, DSPLL clock synthesis provides superior supply noise rejection, simplifying the task of generating low jitter clocks in noisy environments typically found in communication systems. The Si533 IC based XO is factory configurable for a wide variety of user specifications including frequency, supply voltage, output format, and temperature stability. Specific configurations are factory programmed at time of shipment, thereby eliminating long lead times associated with custom oscillators. (Top View) OE 1 6 VDD FS 2 5 CLK– GND 3 4 CLK+ LVDS/LVPECL/CML Functional Block Diagram V DD Fixed Frequency XO OE Rev. 1.3 4/13 CLK– CLK+ Any-frequency 10–1400 MHz DSPLL® Clock Synthesis FS OE 1 6 VDD FS 2 5 NC GND 3 4 CLK+ CMOS GND Copyright © 2013 by Silicon Laboratories Si533 Si5 33 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Symbol Test Condition Min Typ Max Units VDD 3.3 V option 2.97 3.3 3.63 V 2.5 V option 2.25 2.5 2.75 V 1.8 V option 1.71 1.8 1.89 V Output enabled LVPECL CML LVDS CMOS — — — — 111 99 90 81 121 108 98 88 Tristate mode — 60 75 mA VIH 0.75 x VDD — — V VIL — — 0.5 V –40 — 85 ºC Supply Voltage1 Supply Current IDD Output Enable (OE) and Frequency Select (FS)2 Operating Temperature Range TA mA Notes: 1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details. 2. OE and FS pins include a 17 k pullup resistor to VDD. Table 2. CLK± Output Frequency Characteristics Parameter Nominal Frequency1,2 Initial Accuracy Symbol Test Condition Min Typ Max Units fO LVPECL/LVDS/CML 10 — 945 MHz CMOS 10 — 160 MHz Measured at +25 °C at time of shipping — ±1.5 — ppm –7 –20 –50 — — — +7 +20 +50 ppm Frequency drift over first year — — ±3 ppm Frequency drift over 20 year life — — ±10 ppm fi Temperature Stability1,3 Aging fa Notes: 1. See Section 3. "Ordering Information" on page 7 for further details. 2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz. 3. Selectable parameter specified by part number. 4. Time from powerup or tristate mode to fO. 2 Rev. 1.3 Si533 Table 2. CLK± Output Frequency Characteristics (Continued) Parameter Symbol Total Stability Test Condition Min Typ Max Units Temp stability = ±7 ppm — — ±20 ppm Temp stability = ±20 ppm — — ±31.5 ppm Temp stability = ±50 ppm — — ±61.5 ppm Powerup Time4 tOSC — — 10 ms Settling Time After FS Change tFRQ — — 10 ms Notes: 1. See Section 3. "Ordering Information" on page 7 for further details. 2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz. 3. Selectable parameter specified by part number. 4. Time from powerup or tristate mode to fO. Table 3. CLK± Output Levels and Symmetry Parameter Symbol Test Condition Min Typ Max Units VO mid-level VDD – 1.42 — VDD – 1.25 V VOD swing (diff) 1.1 — 1.9 VPP VSE swing (single-ended) 0.55 — 0.95 VPP VO mid-level 1.125 1.20 1.275 V VOD swing (diff) 0.5 0.7 0.9 VPP 2.5/3.3 V option mid-level — VDD – 1.30 — V 1.8 V option mid-level — VDD – 0.36 — V 2.5/3.3 V option swing (diff) 1.10 1.50 1.90 VPP 1.8 V option swing (diff) 0.35 0.425 0.50 VPP VOH IOH = 32 mA 0.8 x VDD — VDD V VOL IOL = 32 mA — — 0.4 V tR, tF LVPECL/LVDS/CML — — 350 ps CMOS with CL = 15 pF — 1 — ns 45 — 55 % LVPECL Output Option1 LVDS Output Option2 VO CML Output Option2 VOD CMOS Output Option3 Rise/Fall time (20/80%) SYM Symmetry (duty cycle) LVPECL: LVDS: CMOS: VDD – 1.3 V (diff) 1.25 V (diff) VDD/2 Notes: 1. 50 to VDD – 2.0 V. 2. Rterm = 100 (differential). 3. CL = 15 pF Rev. 1.3 3 Si5 33 Table 4. CLK± Output Phase Jitter Parameter Symbol Test Condition Min Typ Max Units Phase Jitter (RMS)1 for FOUT > 500 MHz J 12 kHz to 20 MHz (OC-48) — 0.25 0.40 ps 50 kHz to 80 MHz (OC-192) — 0.26 0.37 ps Phase Jitter (RMS)1 for FOUT of 125 to 500 MHz J 12 kHz to 20 MHz (OC-48) — 0.36 0.50 ps — 0.34 0.42 ps Phase Jitter (RMS) for FOUT of 10 to 160 MHz CMOS Output Only J 12 kHz to 20 MHz (OC-48)2 — 0.62 — ps 50 kHz to 20 MHz2 — 0.61 — ps 50 kHz to 80 MHz (OC-192) 2 Notes: 1. Refer to AN256 for further information. 2. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz, 2 MHz for 10 MHz < FOUT <50 MHz. Table 5. CLK± Output Period Jitter Parameter Period Jitter* Symbol Test Condition Min Typ Max Units JPER RMS — 2 — ps Peak-to-Peak — 14 — ps *Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information. Table 6. CLK± Output Phase Noise (Typical) Offset Frequency (f) 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz 100 MHz 4 120.00 MHz 156.25 MHz 622.08 MHz LVDS LVPECL LVPECL –112 –122 –132 –137 –144 –150 n/a –105 –122 –128 –135 –144 –147 n/a –97 –107 –116 –121 –134 –146 –148 Rev. 1.3 Units dBc/Hz Si533 Table 7. Environmental Compliance The Si533 meets the following qualification test requirements. Parameter Conditions/Test Method Mechanical Shock MIL-STD-883, Method 2002 Mechanical Vibration MIL-STD-883, Method 2007 Solderability MIL-STD-883, Method 2003 Gross & Fine Leak MIL-STD-883, Method 1014 Resistance to Solder Heat MIL-STD-883, Method 2036 Moisture Sensitivity Level J-STD_020, MSL1 Gold over Nickel Contact Pads Table 8. Thermal Characteristics (Typical values TA = 25 ºC, VDD = 3.3 V) Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction to Ambient JA Still Air — 84.6 — °C/W Thermal Resistance Junction to Case JC Still Air — 38.8 — °C/W Ambient Temperature TA –40 — 85 °C Junction Temperature TJ — — 125 °C Table 9. Absolute Maximum Ratings1 Parameter Symbol Rating Units TAMAX 85 ºC Supply Voltage, 1.8 V Option VDD –0.5 to +1.9 V Supply Voltage, 2.5/3.3 V Option VDD –0.5 to +3.8 V Input Voltage (any input pin) VI –0.5 to VDD + 0.3 V Storage Temperature TS –55 to +125 ºC ESD 2500 V TPEAK 260 ºC tP 20–40 seconds Maximum Operating Temperature ESD Sensitivity (HBM, per JESD22-A114) Soldering Temperature (Pb-free profile)2 Soldering Temperature Time @ TPEAK (Pb-free profile)2 Notes: 1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at www.silabs.com/VCXO for further information, including soldering profiles. Rev. 1.3 5 Si5 33 2. Pin Descriptions (Top View) OE 1 6 VDD OE 1 6 VDD FS 2 5 CLK– FS 2 5 NC GND 3 4 CLK+ GND 3 4 CLK CMOS LVDS/LVPECL/CML Pin # Symbol LVDS/LVPECL/CML Function CMOS Function 1 OE* 2 FS* Frequency Select* 0 = First frequency selected 1 = Second frequency selected Frequency Select* 0 = First frequency selected 1 = Second frequency selected 3 GND Electrical and Case Ground Electrical and Case Ground 4 CLK+ Oscillator Output Oscillator Output 5 CLK– Complementary Output No Connection 6 VDD Power Supply Voltage Power Supply Voltage Output Enable* Output Enable* 0 = clock output disabled (outputs tristated) 0 = clock output disabled (outputs tristated) 1 = clock output enabled 1 = clock output enabled *Note: FS and OE include a 17 k pullup resistor to VDD. See Section 3. "Ordering Information" on page 7 for details on frequency value ordering. 6 Rev. 1.3 Si533 3. Ordering Information The Si533 XO supports a variety of options including frequency, temperature stability, output format, and VDD. Specific device configurations are programmed into the Si533 at time of shipment. Configurations can be specified using the Part Number Configuration chart below. Silicon Laboratories provides a web browser-based part number configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool and for further ordering instructions. The Si533 is supplied in an industry-standard, RoHS compliant, 6-pad, 5 x 7 mm package. The Si533 supports output enable (OE) on pin 1. X 533 X D XXXXXX G R R = Tape & Reel Blank = Trays 533 Dual XO Product Family 1st Option Code A B C D E F G H J K M N P Q R S T U V W VDD 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 1.8 1.8 3.3 3.3 3.3 3.3 2.5 2.5 2.5 2.5 1.8 1.8 Operating Temp Range (°C) G –40 to +85 °C Output Format Output Enable Polarity LVPECL High LVDS High CMOS High CML High LVPECL High LVDS High CMOS High CML High CMOS High CML High LVPECL Low LVDS Low CMOS Low CML Low LVPECL Low LVDS Low CMOS Low CML Low CMOS Low CML Low Note: CMOS available to 160 MHz. Device Revision Letter 6-digit Frequency Designator Code Two unique frequencies can be specified within the following bands of frequencies: 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417 MHz. A six digit code will be assigned for the specified combination of frequencies. Codes > 000100 refer to dual XOs programmed with the lower frequency value selected when FS = 0, and the higher value when FS = 1. Six digit codes < 000100 refer to dual XOs programmed with the higher frequency value selected when FS = 0, and the lower value when FS = 1. 2nd Option Code Code Temperature Stability (ppm, max, ±) A 50 B 20 C 7 Total Stablility (ppm, max, ±) 61.5 31.5 20 Example Part Number: 533AB000108DGR is a 5x7mm Dual XO in a 6 pad package. Since the six digit code (000108) is > 000100, f0 is 644.53125 MHz (lower frequency) and f1 is 693.48299 (higher frequency), with a 3.3V supply and LVPECL output. Temperature stability is specified as ± 20 ppm. The part is specified for a -40 to +85 C° ambient temperature range operation and is shipped in tape and reel format. Figure 1. Part Number Convention Rev. 1.3 7 Si5 33 4. Outline Diagram and Suggested Pad Layout Figure 2 illustrates the package details for the Si533. Table 10 lists the values for the dimensions shown in the illustration. Figure 2. Si533 Outline Diagram Table 10. Package Diagram Dimensions (mm) Dimension A b c D D1 e E E1 H L p R aaa bbb ccc ddd eee 8 Min 1.50 1.30 0.50 4.30 6.10 0.55 1.17 1.80 Nom 1.65 1.40 0.60 5.00 BSC 4.40 2.54 BSC 7.00 BSC 6.20 0.65 1.27 — 0.70 REF 0.15 0.15 0.10 0.10 0.05 Rev. 1.3 Max 1.80 1.50 0.70 4.50 6.30 0.75 1.37 2.60 Si533 5. Si533 Mark Specification Figure 3 illustrates the mark specification for the Si533. Table 11 lists the line information. Figure 3. Mark Specification Table 11. Si53x Top Mark Description Line Position 1 1–10 “SiLabs 533” 2 1–10 Si533: Option1 + Option2 + ConfigNum(6) + Temp 3 Description Trace Code Position 1 Pin 1 orientation mark (dot) Position 2 Product Revision (D) Position 3–6 Tiny Trace Code (4 alphanumeric characters per assembly release instructions) Position 7 Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7) Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site Position 10 “+” to indicate Pb-Free and RoHS-compliant Rev. 1.3 9 Si5 33 6. 6-Pin PCB Land Pattern Figure 4 illustrates the 6-pin PCB land pattern for the Si533. Table 12 lists the values for the dimensions shown in the illustration. Figure 4. Si533 PCB Land Pattern Table 12. PCB Land Pattern Dimensions (mm) Dimension Min Max D2 5.08 REF e 2.54 BSC E2 4.15 REF GD 0.84 — GE 2.00 — VD 8.20 REF VE 7.30 REF X 1.70 TYP Y 2.15 REF ZD — 6.78 ZE — 6.30 Notes: 1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification. 2. Land pattern design based on IPC-7351 guidelines. 3. All dimensions shown are at maximum material condition (MMC). 4. Controlling dimension is in millimeters (mm). 10 Rev. 1.3 Si533 DOCUMENT CHANGE LIST Revision 1.0 to Revision 1.1 Updated Table 1, “Recommended Operating Conditions,” on page 2. Device maintains stable operation over –40 to +85 ºC operating temperature range. Supply current specifications updated for revision D. Updated Table 2, “CLK± Output Frequency Characteristics,” on page 2. Added specification for ±20 ppm lifetime stability (±7 ppm temperature stability) XO. Updated Table 3, “CLK± Output Levels and Symmetry,” on page 3. Updated LVDS differential peak-peak swing specifications. Updated Table 4, “CLK± Output Phase Jitter,” on page 4. Updated Table 5, “CLK± Output Period Jitter,” on page 4. Revised period jitter specifications. Updated Table 9, “Absolute Maximum Ratings1,” on page 5 to reflect the soldering temperature time at 260 ºC is 20–40 sec per JEDEC J-STD-020C. Updated 3. "Ordering Information" on page 7. Changed ordering instructions to revision D. Added 5. "Si533 Mark Specification" on page 9. Revision 1.1 to Revision 1.2 Updated 2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3. Added footnotes clarifying max offset frequency test conditions for Table 4 on page 4. Removed the words "Differential Modes: LVPECL/LVDS/CML" in the footnote referring to AN256 in Table 4 on page 4. Added CMOS phase jitter specs to Table 4 on page 4. Updated Table 7 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows. Revised Figure 2 on page 8 to reflect current package outline diagram. Updated Figure 3 and Table 11 on page 9 to reflect specific marking information. Previously, Figure 3 was generic. Updated contact information on page 12. Revision 1.2 to Revision 1.3 Added Table 8, “Thermal Characteristics,” on page 5. Rev. 1.3 11 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW Quality Support and Community www.silabs.com/CBPro www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. 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