Si 5 52 REVISION D D U A L F REQUENCY VOLTAGE - C ON TROLLED C R Y S TA L O SCILLATOR ( V C X O ) 1 0 MH Z TO 1.4 G H Z Features Available with any-rate output frequencies from 10–945 MHz and selected frequencies to 1.4 GHz Two selectable output frequencies 3rd generation DSPLL® with superior jitter performance 3x better frequency stability than SAW-based oscillators Internal fixed crystal frequency ensures high reliability and low aging Available CMOS, LVPECL, LVDS, and CML outputs 3.3, 2.5, and 1.8 V supply options Industry-standard 5 x 7 mm package and pinout Pb-free/RoHS-compliant Applications Si5602 Ordering Information: See page 10. SONET/SDH xDSL 10 GbE LAN/WAN Low-jitter clock generation Optical modules Clock and data recovery Description The Si552 dual-frequency VCXO utilizes Silicon Laboratories’ advanced DSPLL® circuitry to provide a very low jitter clock for all output frequencies. The Si552 is available with any-rate output frequency from 10 to 945 MHz and selected frequencies to 1400 MHz. Unlike traditional VCXOs, where a different crystal is required for each output frequency, the Si552 uses one fixed crystal frequency to provide a wide range of output frequencies. This IC-based approach allows the crystal resonator to provide exceptional frequency stability and reliability. In addition, DSPLL clock synthesis provides superior supply noise rejection, simplifying the task of generating low-jitter clocks in noisy environments typically found in communication systems. The Si552 IC-based VCXO is factory-configurable for a wide variety of user specifications including frequency, supply voltage, output format, tuning slope, and temperature stability. Specific configurations are factory programmed at time of shipment, thereby eliminating the long lead times associated with custom oscillators. Pin Assignments: See page 9. (Top View) VC 1 6 VDD FS 2 5 CLK– GND 3 4 CLK+ Functional Block Diagram VDD CLK- CLK+ Fixed Frequency XO Any-rate 10–1400 MHz DSPLL® Clock Synthesis ADC VC Rev. 1.1 4/13 FS GND Copyright © 2013 by Silicon Laboratories Si552 Si5 52 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Supply Voltage1 Symbol Test Condition Min Typ Max Units VDD 3.3 V option 2.97 3.3 3.63 V 2.5 V option 2.25 2.5 2.75 V 1.8 V option 1.71 1.8 1.89 V Output enabled LVPECL CML LVDS CMOS — — — — 120 108 99 90 130 117 108 98 Tristate mode — 60 75 mA VIH 0.75 x VDD — — V VIL — — 0.5 V –40 — 85 ºC Supply Current Frequency Select IDD (FS)2 Operating Temperature Range TA mA Notes: 1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 10 for further details. 2. FS pin includes a 17 k resistor to VDD. Table 2. VC Control Voltage Input Parameter Control Voltage Tuning Slope 1,2,3 Control Voltage Linearity4 Symbol Test Condition Min Typ Max Units KV 10 to 90% of VDD — 33 45 90 135 180 356 — ppm/V LVC BSL –5 ±1 +5 % Incremental –10 ±5 +10 % Modulation Bandwidth BW 9.3 10.0 10.7 kHz VC Input Impedance ZVC 500 — — k — VDD/2 — V VDD V Nominal Control Voltage Control Voltage Tuning Range VCNOM @ fO VC 0 Notes: 1. Positive slope; selectable option by part number. See Section 3. "Ordering Information" on page 10. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information. 3. KV variation is ±10% of typical values. 4. BSL determined from deviation from best straight line fit with VC ranging from 10 to 90% of VDD. Incremental slope determined with VC ranging from 10 to 90% of VDD. 2 Rev. 1.1 Si552 Table 3. CLK± Output Frequency Characteristics Parameter Nominal Frequency 1,2,3 Symbol Test Condition Min Typ Max Units fO LVDS/CML/LVPECL 10 — 945 MHz CMOS 10 — 160 MHz TA = –40 to +85 °C –20 –50 –100 — — — +20 +50 +100 ppm ±12 — ±375 ppm Frequency drift over first year. — — ±3 ppm Frequency drift over 15 year life. — — ±10 ppm 1,4 Temperature Stability Absolute Pull Range1,4 APR Aging Power up Time5 tOSC — — 10 ms Settling Time After FS Change tFRQ — — 10 ms Notes: 1. See Section 3. "Ordering Information" on page 10 for further details. 2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz. 3. Nominal output frequency set by VCNOM = VDD/2. 4. Selectable parameter specified by part number. 5. Time from power up or tristate mode to fO (to within ±1 ppm of fO). Table 4. CLK± Output Levels and Symmetry Parameter LVPECL Output Option1 LVDS Output Option 2 CML Output Option2 Symbol Test Condition Min Typ Max Units VO mid-level VDD – 1.42 — VDD – 1.25 V VOD swing (diff) 1.1 — 1.9 VPP VSE swing (single-ended) 0.55 — 0.95 VPP VO mid-level 1.125 1.20 1.275 V VOD swing (diff) 0.5 0.7 0.9 VPP 2.5/3.3 V option mid-level — VDD – 1.30 — V 1.8 V option mid-level — VDD – 0.36 — V 2.5/3.3 V option swing (diff) 1.10 1.50 1.90 VPP 1.8 V option swing (diff) 0.35 0.425 0.50 VPP VOH IOH = 32 mA 0.8 x VDD — VDD V VOL IOL = 32 mA — — 0.4 V tR, tF LVPECL/LVDS/CML — — 350 ps CMOS with CL = 15 pF — 1 — ns 45 — 55 % VO VOD CMOS Output Option3 Rise/Fall time (20/80%) Symmetry (duty cycle) SYM LVPECL: LVDS: CMOS: VDD – 1.3 V (diff) 1.25 V (diff) VDD/2 Notes: 1. 50 to VDD – 2.0 V. 2. Rterm = 100 (differential). 3. CL = 15 pF Rev. 1.1 3 Si5 52 Table 5. CLK± Output Phase Jitter Parameter 1,2,3 Phase Jitter (RMS) for FOUT > 500 MHz Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.26 0.26 — — Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.27 0.26 — — Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.32 0.26 — — Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.40 0.27 — — Units ps ps ps ps Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) ps — — 0.49 0.28 — — Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.87 0.33 — — ps Notes: 1. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information. 3. See “AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO” for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Max jitter for LVPECL output with VC=1.65V, VDD=3.3V, 155.52 MHz. 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz, 2 MHz for 10 MHz < FOUT <50 MHz. 4 Rev. 1.1 Si552 Table 5. CLK± Output Phase Jitter (Continued) Parameter Phase Jitter (RMS)1,2,3,4,5 for FOUT of 125 to 500 MHz Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.37 0.33 — — ps Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.37 0.33 0.4 — Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.43 0.34 — — Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.50 0.34 — — Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) — — 0.59 0.35 — — Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 80 MHz (OC-192) Units ps ps ps ps ps — — 1.00 0.39 — — Notes: 1. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information. 3. See “AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO” for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Max jitter for LVPECL output with VC=1.65V, VDD=3.3V, 155.52 MHz. 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz, 2 MHz for 10 MHz < FOUT <50 MHz. Rev. 1.1 5 Si5 52 Table 5. CLK± Output Phase Jitter (Continued) Parameter Phase Jitter (RMS)1,2,5 for FOUT 10 to 160 MHz CMOS Output Only Symbol Test Condition Min Typ Max J Kv = 33 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz — — 0.63 0.62 — — ps Kv = 45 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz — — 0.63 0.62 — — Kv = 90 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz — — 0.67 0.66 — — Kv = 135 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz — — 0.74 0.72 — — Kv = 180 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz — — 0.83 0.8 — — Kv = 356 ppm/V 12 kHz to 20 MHz (OC-48) 50 kHz to 20 MHz Units ps ps ps ps ps — — 1.26 1.2 — — Notes: 1. Refer to AN255, AN256, and AN266 for further information. 2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information. 3. See “AN255: Replacing 622 MHz VCSO devices with the Si550 VCXO” for comparison highlighting power supply rejection (PSR) advantage of Si55x versus SAW-based solutions. 4. Max jitter for LVPECL output with VC=1.65V, VDD=3.3V, 155.52 MHz. 5. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz, 2 MHz for 10 MHz < FOUT <50 MHz. Table 6. CLK± Output Period Jitter Parameter Period Jitter* Symbol Test Condition Min Typ Max Units JPER RMS — 2 — ps Peak-to-Peak — 14 — ps *Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information. 6 Rev. 1.1 Si552 Table 7. CLK± Output Phase Noise (Typical) Offset Frequency 74.25 MHz 491.52 MHz 622.08 MHz 90 ppm/V 45 ppm/V 135 ppm/V LVPECL LVPECL LVPECL –87 –114 –132 –142 –148 –150 n/a –75 –100 –116 –124 –135 –146 –147 –65 –90 –109 –121 –134 –146 –147 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz 100 MHz Units dBc/Hz Table 8. Environmental Compliance The Si552 meets the following qualification test requirements. Parameter Conditions/Test Method Mechanical Shock MIL-STD-883F, Method 2002.3 B Mechanical Vibration MIL-STD-883F, Method 2007.3 A Solderability MIL-STD-883F, Method 203.8 Gross & Fine Leak MIL-STD-883F, Method 1014.7 Resistance to Solvents MIL-STD-883F, Method 2016 Moisture Sensitivity Level J-STD-020, MSL 1 Contact Pads J-STD-020, MSL 1 Table 9. Thermal Characteristics (Typical values TA = 25 ºC, VDD = 3.3 V) Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction to Ambient JA Still Air — 84.6 — °C/W Thermal Resistance Junction to Case JC Still Air — 38.8 — °C/W Ambient Temperature TA –40 — 85 °C Junction Temperature TJ — — 125 °C Rev. 1.1 7 Si5 52 Table 10. Absolute Maximum Ratings1 Parameter Symbol Rating Units TAMAX 85 ºC Supply Voltage, 1.8 V Option VDD –0.5 to +1.9 V Supply Voltage, 2.5/3.3 V Option VDD –0.5 to +3.8 V Input Voltage (any input pin) VI –0.5 to VDD + 0.3 V Storage Temperature TS –55 to +125 ºC ESD 2500 V TPEAK 260 ºC tP 20–40 seconds Maximum Operating Temperature ESD Sensitivity (HBM, per JESD22-A114) Soldering Temperature (Pb-free profile) 2 Soldering Temperature Time @ TPEAK (Pb-free profile)2 Notes: 1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download from www.silabs.com/VCXO for further information, including soldering profiles. 8 Rev. 1.1 Si552 2. Pin Descriptions (Top View) VC 1 6 VDD FS 2 5 CLK– GND 3 4 CLK+ Table 11. Si552 Pin Descriptions Pin Name Type Function 1 VC Analog Input 2 FS* Input 3 GND Ground Electrical and Case Ground 4 CLK+ Output Oscillator Output 5 CLK– (N/A for CMOS) Output Complementary Output (N/C for CMOS) 6 VDD Power Power Supply Voltage Control Voltage Frequency Select: 0 = first frequency selected 1 = second frequency selected *Note: FS includes a 17 k pullup resistor to VDD. See Section 3. "Ordering Information" on page 10 for details on frequency select and OE polarity ordering options. Rev. 1.1 9 Si5 52 3. Ordering Information The Si552 supports a variety of options including frequency, temperature stability, tuning slope, output format, and VDD. Specific device configurations are programmed into the Si552 at time of shipment. Configurations are specified using the Part Number Configuration chart shown below. Silicon Labs provides a web browser-based part number configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool and for further ordering instructions. The Si552 VCXO series is supplied in an industry-standard, RoHS-compliant, lead-free, 6-pad, 5 x 7 mm package. Tape and reel packaging is an ordering option. X 552 X D XXXXXX G R R = Tape & Reel Blank = Trays 552 Dual VCXO Product Family Operating Temp Range (°C) G –40 to +85 °C Device Revision Letter 1st Option Code Code A B C D E F G H J K VDD 3.3 3.3 DD 3.3 3.3 2.5 2.5 2.5 2.5 1.8 1.8 Output Format LVPECL LVDS CMOS CML LVPECL LVDS CMOS CML CMOS CML Notes: CMOS available to 160 MHz. 6-digit Frequency Designator Code Two unique frequencies can be specified within the following bands of frequencies: 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417 MHz. A six digit code will be assigned for the specified combination of frequencies. Codes > 000100 refer to dual XOs programmed with the lower frequency value selected when FS = 0, and the higher value when FS = 1. Six digit codes < 000100 refer to dual XOs programmed with the higher frequency value selected when FS = 0, and the lower value when FS = 1. 2nd Option Code Temperature Stability ± ppm (max) 100 100 50 50 20 50 20 20 20 100 20 Tuning Slope Kv ppm/V (typ) 180 90 180 90 45 135 356 180 135 356 33 Minimum APR (±ppm) for VDD @ 2.5 V 1.8 V 75 25 Note 6 Note 6 125 75 30 25 Note 6 Note 6 75 50 300 235 145 105 104 70 220 155 Note 6 Note 6 Code 3.3 V A 100 B 30 C 150 D 80 E 25 F 100 G 375 H 185 J 130 K 295 M 12 Notes: 1. For best jitter and phase noise performance, always choose the smallest Kv that meets the application’s minimum APR requirements. Unlike SAW-based solutions which require higher higher Kv values to account for their higher temperature dependence, the Si55x series provides lower Kv options to minimize noise coupling and jitter in realworld PLL designs. See AN255 and AN266 for more information. 2. APR is the ability of a VCXO to track a signal over the product lifetime. A VCXO with an APR of ±25 ppm is able to lock to a clock with a ±25 ppm stability over 15 years over all operating conditions. 3. Nominal Pull range (±) = 0.5 x VDD x tuning slope. 4. Nominal Absolute Pull Range (±APR) = Pull range – stability – lifetime aging = 0.5 x VDD x tuning slope – stability – 10 ppm 5. Minimum APR values noted above include worst case values for all parameters. 6. Combination not available. Example Part Number: 552AF000108DGR is a 5x7mm Dual VCXO in a 6 pad package. Since the six digit code (000108) is > 000100, f0 is 644.53125 MHz (lower frequency) and f1 is 693.48299 (higher frequency), with a 3.3V supply and LVPECL output. Temperature stability is specified as ± 50 ppm and the tuning slope is 135 ppm/V. The part is specified for a -40 to +85 C° ambient temperature range operation and is shipped in tape and reel format. Figure 1. Part Number Convention 10 Rev. 1.1 Si552 4. Package Outline and Suggested Pad Layout Figure 2 illustrates the package details for the Si552. Table 12 lists the values for the dimensions shown in the illustration. Figure 2. Si552 Outline Diagram Table 12. Package Diagram Dimensions (mm) Dimension A b c D D1 e E E1 H L p R aaa bbb ccc ddd eee Min 1.50 1.30 0.50 4.30 6.10 0.55 1.17 1.80 Nom 1.65 1.40 0.60 5.00 BSC 4.40 2.54 BSC. 7.00 BSC. 6.20 0.65 1.27 — 0.70 REF 0.15 0.15 0.10 0.10 0.50 Rev. 1.1 Max 1.80 1.50 0.70 4.50 6.30 0.75 1.37 2.60 11 Si5 52 5. 6-Pin PCB Land Pattern Figure 3 illustrates the 6-pin PCB land pattern for the Si552. Table 13 lists the values for the dimensions shown in the illustration. Figure 3. Si552 PCB Land Pattern Table 13. PCB Land Pattern Dimensions (mm) Dimension Min Max D2 5.08 REF e 2.54 BSC E2 4.15 REF GD 0.84 GE 2.00 — — VD 8.20 REF VE 7.30 REF X 1.70 TYP Y 2.15 REF ZD — 6.78 ZE — 6.30 Notes: 1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification. 2. Land pattern design based on IPC-7351 guidelines. 3. All dimensions shown are at maximum material condition (MMC). 4. Controlling dimension is in millimeters (mm). 12 Rev. 1.1 Si552 6. Top Marking 6.1. Si552 Top Marking 6.2. Top Marking Explanation Line Position 1 1–10 “SiLabs”+ Part Family Number, 552 (First 3 characters in part number) 2 1–10 Si552: Option1+Option2+Freq(7)+Temp Si552 w/ 8-digit resolution: Option1+Option2+ConfigNum(6)+Temp 3 Description Trace Code Position 1 Pin 1 orientation mark (dot) Position 2 Product Revision (D) Position 3–6 Tiny Trace Code (4 alphanumeric characters per assembly release instructions) Position 7 Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7) Position 8–9 Calendar Work Week number (1–53), to be assigned by assembly site Position 10 “+” to indicate Pb-Free and RoHS-compliant Rev. 1.1 13 Si5 52 DOCUMENT CHANGE LIST Revision 0.6 to Revision 1.0 Updated Table 4 on page 3. Updated 2.5 V/3.3 V and 1.8 V CML output level specifications. Updated Table 5 on page 4. Removed the words “Differential Modes: LVPECL/LVDS/CML” in the footnote referring to AN256. Added footnotes clarifying max offset frequency test conditions. Added CMOS phase jitter specs. Updated Table 10 on page 8. Separated 1.8 V, 2.5 V/3.3 V supply voltage specifications. Updated and clarified Table 8 on page 7 Added “Moisture Sensitivity Level” and “Contact Pads” rows. Updated 6. "Top Marking" on page 13 to reflect specific marking information (previously, figure was generic). Updated 4. "Package Outline and Suggested Pad Layout" on page 11. Added cyrstal impedance pin in Figure 2 on page 11 and Table 12 on page 11. Reordered spec tables and back matter to conform to data sheet quality conventions. Revision 1.0 to Revision 1.1 14 Added Table 9, “Thermal Characteristics,” on page 7. Rev. 1.1 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. Available for Windows and iOS (CBGo only). www.silabs.com/CBPro Timing Portfolio www.silabs.com/timing SW/HW www.silabs.com/CBPro Quality www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. 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