517CJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN10 2.5x2, 0.5P
CASE 517CJ
ISSUE O
DATE 31 JUL 2012
SCALE 4:1
PIN ONE
REFERENCE
2X
0.10 C
0.10 C
2X
0.05 C
L
A B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
ÎÎ
ÎÎ
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
ÏÏ
ÎÎ
EXPOSED Cu
TOP VIEW
DETAIL B
A
(A3)
A3
MOLD CMPD
A1
ÎÎ
ÏÏ
DIM
A
A1
A3
b
D
E
e
L
L1
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
DETAIL A
1
XXMG
G
5
8X
L
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
0.10
MIN
10
6
e
9X
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
2.50 BSC
2.00 BSC
0.50 BSC
0.70
0.90
0.05
0.15
(Note: Microdot may be in either location)
b
0.10
M
C A B
0.05
M
C
NOTE 3
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
8X
8X
0.30
1.07
PACKAGE
OUTLINE
2.30
1
0.45
0.50 PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON82417E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN10 2.5X2, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON82417E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
31 JUL 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. O
Case Outline Number:
517CJ