RClamp1502B Datasheet

RClamp1502B
Ultra-Low Capacitance TVS
for ESD and CDE Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
‹ Transient protection for high-speed data lines to
RailClamps are ultra low capacitance TVS arrays
designed to protect high speed data interfaces. This
series has been specifically designed to protect sensitive components which are connected to high-speed
data and transmission lines from overvoltage caused
by ESD (electrostatic discharge), CDE (Cable Discharge
Events), and EFT (electrical fast transients).
The RClampTM1502B has a typical capacitance of only
0.60pF (pin 1 to 2). This means it can be used on
circuits operating in excess of 3GHz without signal
attenuation. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). Each device can
be configured to protect 1 bidirectional line or two
unidirectional lines.
These devices are in a small SC-75 (SOT-523) package
and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where
board space is at a premium. The combination of small
size, low capacitance, and high level of ESD protection
makes them a flexible solution for applications such as
Automatic Test Equipment and Infiniband circuits.
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Designed to replace polymer TVS
Protects up to two I/O lines
Ultra-Low capacitance (<1pF)
No insertion loss to >3.0GHz
Low profile (<1mm)
Low leakage current and clamping voltage
Low operating voltage: 15.0V
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SC-75 (SOT-523) package
Lead Finish: Matte Tin
RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking: P6
Packaging: Tape and Reel
Applications
‹
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Dimensions
Automatic Test Equipment
Firewire Ports
GaAs Photodetector Protection
HBT Power Amp Protection
Infiniband Transceiver Protection
Schematic & PIN Configuration
1.60
0.50 BSC
3
0.80
1
1.60
2
1.00
BSC
0.75
SC-75 3L (Top View)
Nominal Dimensions (mm)
Revision 2/3/2009
1
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RClamp1502B
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
200
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
5
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
VESD
15
8
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
Reverse Leakage Current
IR
VRWM = 15V, T=25°C
Pin 1 or Pin 2 to Pin 3
and Between Pins 1 and 2
1
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
Pi n 1 to Pi n 2
32
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20μs
Pin 1 or Pin 2 to Pin 3
36
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20μs
Pi n 1 to Pi n 2
40
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pi n 1 to Pi n 2
0.9
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Pin 1 or Pin 2 to Pin 3
1.5
pF
© 2009 Semtech Corp.
2
Minimum
Typical
Maximum
Units
15
V
16.7
V
0.60
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RClamp1502B
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or PI P
Peak Pulse Power - PPk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
Clamping Voltage vs. Peak Pulse Current
Pin 1 or Pin 2 to Pin 3
100
125
150
40
38
34
Clamping Voltage - VC (V)
Clamping Voltage - VC (V)
75
Clamping Voltage vs. Peak Pulse Current
Pin 1 to Pin 2
36
32
30
28
Waveform
Parameters:
tr = 8μs
td = 20μs
26
36
34
32
30
Waveform
Parameters:
tr = 8μs
td = 20μs
28
26
24
24
0
1
2
3
4
5
6
0
Peak Pulse Current - IPP (A)
2
3
Normalized Capacitance - Cj (pF)
0.8
0.6
0.4
0.2
f = 1 MHz
0
4
© 2009 Semtech Corp.
6
8
10
Reverse Voltage - VR (V)
6
1
f = 1 MHz
0.5
2
5
Line to Line Capacitance
1.2
1
0
4
Junction Capacitance vs. Reverse Voltage
Pin 1 to Pin 2
Line to Ground Capacitance
1.5
1
Peak Pulse Current - IPP (A)
Normalized Capacitance vs. Reverse Voltage
Pin 1 or Pin 2 to Pin 3
Normalized Capacitance - Cj (pF)
50
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
12
14
0
3
5
10
Reverse Voltage - VR (V)
15
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RClamp1502B
PROTECTION PRODUCTS
Typical Characteristics
Insertion Loss S21 (Pin 1 to Pin 2)
CH1 S21
LOG
Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3)
6 dB / REF 0 dB
CH1 S21
3
LOG
6 dB / REF 0 dB
1: .03430 dB
900 MHz
1: .00460 dB
900 MHz
2: .07870 dB
1.8 GHz
2: .02010 dB
1.8 GHz
3: .28040 dB
2.5 GHz
3
0 dB
3: -.08180 dB
2.5 GHz
0 dB
1
2
1
-6 dB
-6 dB
-12 dB
-12 dB
-18 dB
-18 dB
-24 dB
-24 dB
-30 dB
-30 dB
-36 dB
1
MHz
10
MHz
100
MHz
-36 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
1
MHz
START . 030 MHz
10
MHz
100
MHz
2
3
1
GHz GHz
STOP 3000. 000000 MHz
ESD Response (8kV Contact per IEC 61000-4-2)
ESD Response (4kV Contact per IEC 61000-4-2)
Analog Crosstalk
CH1 S21
LOG
START. 030 MHz
© 2009 Semtech Corp.
20 dB /REF 0 dB
STOP 3000. 000000 MHz
4
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RClamp1502B
PROTECTION PRODUCTS
Applications Information
Figure 1. Pin Configuration
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines, but it is recommended it not be used
much beyond 1GHz due to cross talk limitations. The
device is connected as follows:
One data line can be connected to either pin 1 or pin 2
with the other connected to ground. The connection to
ground should be made directly to a ground plane. The
path length should also be kept as short as possible to
minimize parasitic inductance. Pin 3 is not connected.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
© 2009 Semtech Corp.
5
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RClamp1502B
PROTECTION PRODUCTS
Applications Information - Spice Model
RClamp1502B Spice Model
Table 1 - R Clamp1502B Spice Parameters
© 2009 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
A mp
1.23E-14
1.23E-14
BV
Volt
21.8
21.8
VJ
Volt
0.72
0.72
RS
Ohm
2.801
2.801
IB V
Amp
1.0E-3
1.0E-3
CJO
Farad
1.3E-12
1.3E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.033
0.033
N
--
1.1
1.1
EG
eV
1.11
1.11
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RClamp1502B
PROTECTION PRODUCTS
Outline Drawing -SC-75 (SOT-523)
DIMENSIONS
MILLIMETERS
MIN NOM MAX
D
A
DIM
e1
B
3
E
E1
1
2
bxN
bbb
e
A
A2
C A B
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
N
0
aaa
bbb
0.90
0.10
0.75 0.80
0.30
0.20
1.60 1.70
1.60 1.75
0.80 0.85
1.00 BSC
0.50 BSC
0.10 0.22 0.30
(0.40)
3
0°
8°
0.10
0.20
0.60
0.00
0.60
0.15
0.10
1.50
1.45
0.75
aaa C
SEATING PLANE
A1
C
SEE DETAIL A
H
c
GAUGE
PLANE
0.25
01
L
(L1)
SIDE VIEW
DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B-
TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern -SC-75 (SOT-523)
X
Y
Z
C
DIM
C
P
p1
G
X
Y
Z
G
Y
DIMENSIONS
INCHES
MILLIMETERS
(.055)
.039
.020
.024
.016
.031
.087
(1.40)
1.00
0.50
0.60
0.40
0.80
2.20
p1
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2009 Semtech Corp.
7
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RClamp1502B
PROTECTION PRODUCTS
Marking
Ordering Information
P6
Part Number
Qty per
Reel
Reel
Size
RClamp 1502B.TCT
3,000
7 Inch
RailClamp and RClamp are registered marks of Semtech Corporation
Tape and Reel Specification
Device Orientation in Tape
A0
B0
K0
1.85±0.05mm
1.85±0.05mm
0.88±0.05mm
Tap e
Width
B, (Max)
D
D1
( M IN )
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.3 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2009 Semtech Corp.
8
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