High Density Plus®

HIGH DENSITY
PLUS
®
HIGH DENSITY PLUS
®
Table Of Contents
Description
Page
Overview
A Modular High Density Pin and Socket Interconnection System
2
Daughtercard Socket Connector
4
Daughtercard Socket Module
6
Daughtercard Accessories / Ordering Information
8
HS Series
Daughtercard Hole Patterns
11
Backpanel Pin Module
12
HP Series
Backpanel Accessories
■
Power Distribution
17
Backpanel Accessories — Guide Pins
19
Right Angle HD+® Pin Connector
20
Backpanel Hole Patterns / Polarization
25
High Density Plus Specifications and Operating Characteristics
26
Signal Integrity of the High Density Plus Family
28
Compliant Contact
29
Litton Electronic System Packaging
31
Other Product Offerings
32
Specifications
Technical Information
While the information in this publication is believed to be accurate and reliable, all data presented is
subject to change without notice. Winchester Electronics disclaims responsibility for any damages
resulting from application or any incompleteness or inaccuracies in the information presented.
Consult factory for specific information on the latest design specifications.
The following trademarks are owned or licensed by Winchester Electronics:
HIGH DENSITY PLUS®, HD + ®, C-Press®, HIGH DENSITY PLUS 1TM,
HIGH DENSITY PLUS 2TM, HD + 1TM, HD + 2 TM, HD PLUS 1TM, HD PLUS 2TM
®
CSA Certified File No.
LR34182
Recognized under the Component Program of Underwriters Laboratories Inc. File No. E31650
®
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 1
HIGH DENSITY
PLUS
®
Overview
■
■
■
■
■
■
■
■
■
■
■
Complete system design enhances
product performance and reduces
time-to market
Modular backplane and daughterboard connectors offer unlimited
design flexibility
Integral daughterboard stiffener
Optional HD +1TM and HD +2 TM
rows of contacts provide additional
grounding and shielding without
sacrificing signal contact density
Higher interconnect density. Up to
six rows of contacts on continuous
0.100" grid. Up to 50% greater
contact density
Industry keying / polarization
standard
Integral power management for
high current, multi-voltage
applications
C-Press® — the most reliable
compliant pin in the industry meets
40 year life telecommunications
standards
Two options for the modular power
distribution:
— External Bus Bars
— Internal Heavy Copper
— Multilayer Technology
Meets performance requirements
of MIL-C-28859 and MIL-STD-2166
Contact Sequencing Options
A Modular High Density Pin and Socket Interconnection System
Plus Contacts
Socket Connector
On Daughtercard
Plus Contacts
Pin Modules
On Backpanel
Evolution and Revolution
Modularity
Using higher speed and higher power
semiconductors, today’s electronic systems
combine many functions into one totally
integrated package. These systems must
operate faster, more efficiently and be more
cost-effective to produce.
Meeting these performance parameters
demands that designers must:
1. Minimize reflections due to
impedance mismatch.
2. Reduce crosstalk between
adjacent signal contacts.
3. Minimize inductance of contacts
used for power and ground.
4. Integrate power distribution into
the backpanel design.
HD+® combines a modular design concept with
the density and electro-mechanical performance vital to VLSI designs.
Both pin and socket modules are end stackable
providing a virtually continuous .100 x .100,
(2.54 x 2.54) contact grid.
Pin modules are available with both ends open
for continuous stacking, with one end wall and
with one end polarized to ensure a unique
identity.
HD+® incorporates a product family of off-theshelf back plane and daughtercard connectors
including:
3 row modules and 4 row modules,
including the HD+1TM and HD+2TM
contacts illustrated on the next page,
address grounding and power
requirements, without increasing the
size of the connector envelope.
Don’t Conform . . . Create!
HIGH DENSITY PLUS® — a fully integrated
interconnection system, is specifically designed
to meet existing and anticipated semiconductor
technology needs.
CSA Certified File No.
®
LR34182
Recognized under the Component Program o
of Underwriters Laboratories Inc. File No. E31650
®
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 2
HIGH DENSITY
PLUS
®
Overview
A Modular High Density Pin and Socket Interconnection System
Aluminum Stiffener
Locates Modules
Multilayer
Backpanel
Mounting
Hole / Boss
Stiffener
Insulation
Contact Tail
Alignment Guide
Insulator
H D+2TM
Contacts
▼
H D+1TM
Contacts
C-Press®
Compliant Pin
Contact
Daughtercard
Socket Connector
Pin Module
Density
To demonstrate the density achievable with
HIGH DENSITY PLUS®, a good comparison
can be made using the Double Eurocard
Format, a standard for VME Bus and Multibus II
designs.
192 I/O’s are provided using Din 41612
connectors.
Without addressing power, grounding and
impedance matching requirements, conventional 4 row, high density connectors can
increase this number up to 344 I/O’s. With the
addition of the HD+1TM and HD+2TM contacts,
grounding and impedance matching requirements can be addressed without sacrificing
signal contact density.
Power and Ground Capability
Today’s designs often require the ability to
install and remove daughtercards while the
system is operating. To facilitate this, HIGH
DENSITY PLUS® provides 3 distinct levels of
contact sequencing for ground, power and
signal.
Power Module
Power
Blades
Backpanel Modules
Connect To Internal
Copper Layers
External Bus Bars
Connect To Source At
Termination Studs
Termination
Stud
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 3
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Socket Connector
Daughtercard Modules
Socket modules are pre-assembled into
precisely located holes in an extruded
aluminum stiffener. End-stackability offers the
same flexibility to the daughtercard assembly
as the backpanel modules. Both are available in
3 and 4 row versions, with each offering 15 or 20
positions per row to mate with the corresponding
pin modules.
The HD+1TM and HD+2TM contacts of the socket
module are located on the bottom and top
surfaces of the insulator. These wide conductors
mate with Plus row cantilever contacts positioned
in the backpanel modules. An extended socket
module wipe option is available — refer to
sequence of mating chart on page 15.
Guide Modules
As connectors become longer, the mechanics of
alignment, insertion forces, and length become
more important.
To insure proper alignment, the HIGH DENSITY
PLUS® system offers a daughtercard module
and a mating backpanel guide pin.
Polarization Modules
HIGH DENSITY PLUS® offers polarization
modules for unique identity. Stainless steel
polarizing keys and bushings used in the
modules conform to MIL-C-55302. The
configurations are octagonal to provide up to
sixty-four polarization options when two modules
are used per daughtercard. When polarization
modules are used, a guide pin
must also be used.
Power and Ground Modules
The HIGH DENSITY PLUS® connector
system provides daughtercard modules that
interconnect to discrete backpanel power
modules or an external busing system.
Power modules contain two contacts, each rated
20 amperes. This power busing system
is designed to distribute power and ground
across the backpanel and to the individual
daughtercards.
Power Module
For part number see page HD / 10
Stiffener provides
low cost method
to eliminate
daughterboard
warpage
Polarizing Module
For part number see page HD / 8
Socket Module
For part number see page HD / 6
Guide Pin Module
For part number see page HD / 9
Spaces are permitted as
required between modules.
Mounting spacers may be
required for long spans.
Consult factory. For spacer
part number see page HD / 9
Socket Module
For part number see page HD / 6
Polarizing Module
For part number see page HD / 8
Catalog No. HS27500-X Shown
The final socket connector assembly will be assigned a dash number by the factory
Winchester Electronics
The socket modules and accessories shown on the following pages afford a wide degree of
design flexibility. The example shown illustrates how to combine various modules on a
stiffener to produce a complete connector assembly.
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 4
HIGH DENSITY
PLUS
®
HS Series
of first row datum for
location on stiffener
Daughtercard Socket Connector
15 Pos. =
.700
(17.78)
0.10 (2.5) thru clearance for # 2-32 stiffener
mounting screw part no. 113069
20 Pos. = .950
(24.13)
H D+2TM
Contact
.150
(3.81)
of
contact row
Socket
Contact
Insulator
15 Pos./Row =
.049
Max.
(1.24)
1.400
Ref.
(35.56)
20 Pos./Row = 1.900 Ref.
(48.26)
.100
Typ.
(2.54)
.465
3 Row = (11.81)
.565
4 Row = (14.35)
H D+1TM Contact
Tail Alignment Guide
Row
Designation
.390
(9.91)
.490
4 Row =
(12.45)
.026
(0.66) Ref.
row A
.200
(5.08)
.300
4 Row =
(7.62)
3 Row =
.45
(11.43)
3 Row =
.100
(2.54) Typ.
.025
(0.64) Typ.
.069
(1.75)
Daughtercard
Mounting
Surface
H D+2TM
Contact
.306
(7.77)
H D+1TM
Contact
.43
(10.9)
G
(Refer to code
order chart on
page 6)
.100
(2.54) Typ.
Key Attributes of the High Density Plus System
■
■
■
■
■
■
Complete system design enhances product
performance and reduces time-to-market
C- Press meets 40-year life telecommunications standards
Modular backplane and daughterboard
connectors offer unlimited design flexibility
Integral daughterboard stiffener
Higher interconnect density. Up to six row
of contacts on continuous 0.100" grid. Up
to 50% greater contact density
Industry keying/polarization standard
®
■
■
■
■
■
Integral power management for high
current, multi-voltage applications
C- Press — the most reliable compliant pin
in the industry
Two options for modular power distribution:
— External Bus Bars
— Internal heavy Copper Multilayer
— Technology
Meets performance requirements of
MIL-C-28859 and MIL-STD-2166
Contact Sequencing Options
®
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 5
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Socket Module
ORDERING INFORMATION
Note: The following information is used to
help the user select individual
modules. However, HD+® socket
connectors are supplied assembled
from individual socket modules.
Consult factory for final assembly
part number
HS
■ Step 1
Series
Code:
High Density
Socket
■ Step 2
■ Step 3
Connector Style: Insulator
0 = HD+® without Style:
HD+1TM and
A = End
HD+2TM
Stackcontacts
able
1 = HD+1TM
contacts
2 = HD+2TM with
both HD +1TM
and HD+2TM
contacts
3 = HD+2TM
configuration
with HD+1TM
contacts
omitted
See next page
2
A
■ Step 4
■ Step 5
Number of
Rows:
3 = 3 row
4 = 4 row
See next
page
Insulator
Positions / Row:
015 = 15 positions
020 = 20 positions
See next page
Selective Plating Chart — Step 6 & 8
Code
Mating Area
Solder Tail
.000030 min.
.000100 min.
AC
Gold
Tin - Lead
.000050 min.
.000100 min.
GC
Gold
Tin - Lead
Gold Flash over
.000100 min.
BC
.000025 min.
Tin - Lead
Palladium Nickel
Gold Flash over
.000100 min.
BK
.000040 min.
Tin - Lead
Palladium Nickel
Note: Contact underplate is .000050 minimum Nickel
4
020
■ Step 6
Selective Plating
HD +1TM & HD+2TM
Contacts:
00 = Without HD+1TM
and HD+2TM
ground contacts
see selective
plating chart
below for
sockets with
HD +1TM and
HD +2TM ground
contacts
See selective
plating chart below
AC
3
AC
■ Step 7
Contact Type &
Tail Length:
When using connector
style code 0 (without
ground contacts) use
contact type code 0, 1
or 2 only
See contact type
chart below
■ Step 8
Selective Plating
Socket Contact
(Signal) :
See selective
plating chart
below
Contact Type Chart — Step 7
P.C.B.
Thickness Code
.062
(1.57)
.093
(2.36)
.062
(1.57)
.093
(2.36)
Socket
Contact
Description
G
HD+1TM & HD +2TM
.015
Contact
+ (0.38)
.010
Description
- (0.25)
0
Standard Wipe
Standard Wipe
1
* Extended Wipe
Standard Wipe
2
Standard Wipe
Standard Wipe
3
Standard Wipe
* Extended Wipe
4
* Extended Wipe
* Extended Wipe
5
Standard Wipe
* Extended Wipe
.125
(3.18)
.150
(3.81)
.125
(3.18)
.150
(3.81)
* The Extended Wipe option produces a .025 (0.64 ref.) increase
in wipe over the standard socket assembly.
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 6
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Socket Modules
COMPONENTS
Socket Connector Style — Step 2 (4 Row Socket Modules Shown)
Code 1
Code 2
Code 3
Code 0
H D+1TM
Contact
H D +®
H D+1TM
Contact
H D+2TM
Contact
H D+1TM
H D+2TM
Contact
H D+2TM
H D+3TM
Number Of Rows — Step 4
Code 3
Code 4
4 Row Module
3 Row Module
Typical Socket Connector Profile — Step 5
3 Row
4 Row
1.07
(27.2) Ref.
.97
(24.6) Ref.
.45
(11.4) Max
H D+1TM
Contact
1.07
Ref.
(27.2)
1.17
(29.7) Ref.
.45
(11.4) Max
H D+1TM
Contact
H D+®, H D+1TM
H D+2TM
Contact
H D+2TM
.55
Max
(14.0)
.55
(14.0) Max
H D+1TM
Contact
H D+1TM
Contact
H D+®, H D+1TM
H D+2TM
Contact
H D+2TM
Typical Final Socket Connector Assembled To P.C. Board
L
M
Part Number
L
113069
.312
7.92
.031
0.79
to
.093
2.36
113069 - 1
.375
9.53
.094
2.38
to
.166
4.22
Ref.
M
(Nominal P.C. Board Thickness)
# 2-32
type AB self-tapping thread stiffener
mounting screw. Cross recessed pan head.
Material: Stainless steel
One mounting screw is typically supplied for
each module or mounting spacer. When using
multiple combinations of power, polarizing and
guide pin modules, each designated mounting
hole position need not be drilled in the P.C.
Board, providing the distance between
mounting holes is not greater than two inches.
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 7
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Accessories
Polarizing Key
Polarizing key part number 113036 is either supplied loose, not installed or assembled with module.
See code order chart
.10
2.4
.125
±.003
3.18
±.0.08
Reference dimension for press
fit with polarizing module
Material: Stainless steel
Insertion Tool: 107-43247
Polarizing Module Assembly
Polarizing Module
Shaded area represents the polarizing key.
Key is shown in position “A”
0.10 (2.5) thru clearance for # 2-32 stiffener
mounting screw part number 113069
Part number 113038 - 3A shown. Code letter
indicates the position of flat.
.265
(6.73)
Code Order Chart
A guide pin receptacle module is required on
applications using polarizing module.
.294
(7.47)
113038
-
M
L
■ Step 1
Polarizing
Module
Part Number
Code
*
■ Step 2
■ Step 3
Module Style
Polarizing Style
Omit if polarizing
key is not
assembled
Polarization Style
Description
1
H D+2TM, 4 row
2
H D+®,
3
H D+®, H D+1TM, 4 row
4
H D+2TM, 3 row
H D+1TM,
Part Number
3 row
Code
Clocking
Clocking
Code
Position
Position
A
E
B
F
C
G
D
H
Description
L
M
.490
(12.45)
113038 - 1
H D+2TM, 4 row
1.04
(26.4)
113038 - 2
H D+®, H D+1TM, 3 row
.84
(21.3)
.390
(9.91)
113038 - 3
H D+®, H D+1TM, 4 row
.94
(23.9)
.490
(12.45)
113038 - 4
H D+2TM, 3 row
.94
(23.9)
.390
(9.91)
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 8
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Accessories
Guide Pin Receptacle Module
0.10 (2.5) thru clearance
for # 2-32 stiffener
mounting screw part
number 113069
Part Number
Dia. 0.175 ±.003
(4.45 ±0.08) thru mates
with guide pin part
number 113152 refer to
backpanel accessories
for more information.
.265
(6.73)
.294
(7.47)
Description
L
M
113038 - 5
H D+2TM, 4 row
1.04
(26.4)
.490
(12.45)
113038 - 6
H D+®, H D+1TM, 3 row
.84
(21.3)
.390
(9.91)
113038 - 7
H D+®, H D+1TM, 4 row
.94
(23.9)
.490
(12.45)
113038 - 8
H D+2TM, 3 row
.94
(23.9)
.390
(9.91)
113172 - 1
*H D+®, H D+1TM, 4 row
.94
(23.9)
.490
(12.45)
* Special heavy duty version with
aluminum insert plus screw and
lockwasher attachment to stiffener.
M
Dia. 0.235
(5.97)
Countersink
L
Mounting Spacer
.30
(7.6)
.17
(4.3)
Clearance for # 2-32 stiffener
mounting screw part number
113069
Part number 113000
Consult factory for use on stiffeners
containing unsupported spans
.23
(5.8)
.08
(2.0)
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 9
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Accessories
20 Amp Power Module
30 Amp Power Module
Recommended P.C. Board Hole Patterns
Recommended P.C. Board Hole Patterns
Ordering Information
Ordering Information
H
■ Step 1
Series:
High
Density
32
40
42
■ Step 3
■ Step 2
Connector
Type:
Power module
(socket)
Code Description
30
H
Y
3 Row +0,
+1 Power Module
L
.970
24.64
3 Row +2,
+3 Power Module 1.070
27.18
4 Row +0,
+1 Power Module
4 Row +2,
+3 Power Module
■ Step 4
M
.450
11.43
Code Quantity
G
01
2
.150
3.81
02
2
.125
3.18
.570
1.170 14.48
29.72
■ Step 1
Series:
High
Density
■ Step 5
Contact Tail
Length:
Module
Type:
Power
Contact
Selective
Plating:
Code
BD
GE
Mating
Area
Gold flash
over
PalladiumNickel
50
Microinches
min. gold
Solder
Tail
Tinlead
62
Y
■ Step 3
■ Step 2
Module
Connector
Type:
Type:
30 Amp
Power module
(socket)
Code Quantity
■ Step 4
■ Step 5
Contact Tail
Length:
G
01
2
.150
3.81
02
2
.125
3.18
Code
BD
GE
Power
Contact
Selective
Plating:
Mating
Area
Solder
Tail
Gold flash
over
PalladiumNickel
Tinlead
50
Microinches
min. gold
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 10
HIGH DENSITY
PLUS
®
HS Series
Daughtercard Hole Patterns
Socket Module 3 and 4 Row
15 and 20 Positions
Accessory 3 and 4 Row
Hole Patterns
H D+®
H D+®, H D+1TM
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
.700
(17.78)
.950
20 Pos. =
(24.13)
15 Pos. =
.150
(3.81) Min.
.100
(2.54)
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
.100
(2.54) Typ.
Dia.
0.098
(2.49)
.150
(3.81)
Dia. .040 ± .003 Finished
(1.02 ± 0.08) Hole
0.098
(2.49)
Dia. 0.040 (1.02) Min.
Finished Hole
.200
(5.08)
.300
4 Row =
(7.62)
* 3 Row
.100
Typ.
(2.54)
End row of adjacent
socket module
.100
Typ.
(2.54)
.200
(5.08)
.200
(5.08)
.200
3 Row =
(5.08)
4 Row = .300
(7.62)
Power Module
H D+1TM
15 Pos. = .700
(17.78)
.950
20 Pos. =
(24.13)
H D+2TM
15 Position
14 Equal Spaces
.100
1.400
=
(2.54)
(35.56)
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
.100
(2.54) Typ.
Dia. 0.098
(2.49)
.150
(3.81)
.150
(3.81) Min.
.100
(2.54)
.250
(6.35)
Dia. .040 ± .003 Finished
(1.02 ± 0.08) Hole
.060 Artwork
Dia.
(1.52) Pad Ref.
Dia.
0.098
(2.49)
Dia. 0.040 (1.02) Min.
Finished Hole
.300
(7.62)
.100
(2.54) Typ.
End row of adjacent
socket module
.200
(5.08)
= .300
(7.62)
4 Row = .400
(10.16)
* 3 Row
H D+ 1TM
.100
(2.54)
.100
Typ.
(2.54)
H D+2TM
15 Pos. = .700
(17.78)
20 Pos. = .950
(24.13)
.150
(3.81)
Dia. 0.098
(2.49)
.200
(5.08)
Guide Pin Receptacle/ Polarizing Module
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
.100
(2.54) Typ.
.200
(5.08) Min.
.150
HD+®, & HD+1TM =
(3.81)
HD+®, & HD+2TM = .250
(6.35)
Dia. .040 ± .003 Finished
(1.02 ± 0.08) Hole
Dia. .060 Artwork
(1.52) Pad Ref.
H D+ 2TM
*
H D+1 TM
.100
(2.54)
=
Dia. .060 Artwork
(1.52) Pad Ref.
*
.200
(5.08)
Dia.
.150
(3.81)
Dia.
0.098
(2.49)
= .200
(5.08)
4 Row = .300
(7.62)
* 3 Row
End row of adjacent
socket module
3 Row = .300
(7.62)
4 Row = .500
(12.70)
.200
(5.08)
.100
(2.54) Typ.
* Delete row D for 3 row hole patterns
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 11
HIGH DENSITY
PLUS
®
HP Series
Backpanel Pin Module
plug-up capability to standard socket connectors.
Plus rows of contacts in the pin modules are
located within the side walls of the insulator.
They employ a preloaded cantilever spring design
similar to those found in cardedge connectors.
They provide pathways for power or low inductance ground connection (shielding).
Power Distribution Parameters
External Busing
Backpanel Modules
Pin connector modules are end-stackable on
.100 inch spacing and available in 3 and 4 row
versions. Each as either 15 or 20 contact
positions per row. The insulators are available
with both ends open for continuous stacking,
with one end wall to be positioned at the ends of
a stack for longitudinal guidance; and, with one
end polarization.
There are several types of HD+® pin contacts
available. “Standard” pin and an “Extended” pin
allow selected ground connections to make
contact first and break last. When daughtercards are engaged or disengaged with the
backpanel pins on a “live” system, this “first
make/last break” ground connection prevents
transient currents from passing into the fixed
voltage traces on the daughtercard. The I/O
contact tail variations include a stub tail or a
longer tail suitable for 3 levels of solderless wire
wrapping. These long tails also provide rear
External busing systems are mounted to the top
or bottom surfaces of the backpanel and are
typically used in high power applications.
Aluminum, copper, or brass bus bars create the
busing structure and also serve as backpanel
stiffeners. Consult the factory for further details.
■ Reduces complexity of multilayer boards
■ Economical for high power applications
■ Provides backpanel rigidity, eliminates
warpage
Internal Distribution
Internal power distribution utilizes the inner layers
and traces of the backpanel. It is typically used for
low power applications.
■ Economical for low power applications
■ Minimizes consumption of backpanel real
estate, 2-4 oz. copper
■ Use of HD+1TM and HD+2TM contacts
One End Wall
End to End
Stackable
One End
Polarized
.049
(1.24) Max.
15 Pins/Row = 1.400 Ref.
(35.56)
20 Pins/Row = 1.900 Ref.
(48.26)
3 Row = .53
(13.5)
4 Row = .63
(16.0)
Insulator
3 Row = .200
(5.08)
4 Row = .300
(7.62)
.100
(2.54) Typ.
HD+1TM
Contact
.500
(12.70) Typ.
.17
(4.3)
.48
(12.2)
.100
(2.54) Typ.
.025 (0.64)
Sq. ref. typ.
HD+2TM
Contact
Pin
Contact
PC
Board
Surface
HD+2TM
HD+1TM
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 12
HIGH DENSITY
PLUS
®
Backpanel Pin Modules
HP Series
ORDERING INFORMATION
H
■ Step 1
■ Step 2
■ Step 3
Series
Code:
High
Density
Connector
Type:
P = Pin
Connector Style:
0 = HD +® without
HD +1TM and
HD+2TM
contacts
1 = HD +® with
HD+1TM
contacts
2 = HD +® with
HD +1TM and
HD+2TM
contacts
3 = HD +® with
HD+2TM
contacts and
no HD+1TM
contacts
See below
P
1
A
■ Step 4
■ Step 5
Insulator
Number of
Style:
Rows:
3 = 3 row
A = Open
ends
4 = 4 row
B = One left
end wall
C = Two end
walls
D = One left
end
polarized
E = Two ends
polarized
F = One right
end wall
G =One right
end
polarized
See below
3
015
AA
1
AA
03
■ Step 6
■ Step 7
■ Step 8
■ Step 9
■ Step 10
Positions /
Row:
015 =
15 positions
020 =
20 positions
HD+ 1TM and
HD+ 2TM Contact
Type & Tail
Length:
0 = Without
HD+1TM and
HD+2TM
contacts
1 = 3 C-Press®
stub tails
2 = 3 C-Press®
solderless
wrap
3 = 5 C-Press®
stub tails
4 = 5 C-Press®
solderless
wrap
5 = 3 solder
stub tails
6 = 5 solder
stub tails
7 = 2 C-Press®
stub tails
See next
page
Selective
Plating HD+1TM
and HD+2TM
Contacts:
00 = Without
HD+1TM
and
HD+2TM
contacts
* * = See
selective
plating
chart on
next page
Pin Contact
Type & Tail
Length:
See pin
contact type
& tail length
chart on
page HD / 15
Selective
Plating Pin
Contact:
* * = See
selective
plating
chart on
next
page
Connector Style — Step 3
Code 0
Code 1
Code 2
Contact spring
mating area
HD+1TM
+®
H D +1
HD
H D +2
Insulator Style — Step 4
.049 Max.
(1.24) Typ.
Code A
.141
(3.58)
.141 Typ.
(3.58)
1
.049 Max.
(1.24) Typ.
Code B
Code C
.500 Typ.
(12.70)
Code E
.200 Typ.
(5.08)
1
Code D
.049 Max.
(1.24)
1
1
TM
.100 Typ.
(2.54)
.100
3 Row =
Typ.
(2.54)
.150
4 Row =
Typ.
(3.81)
.200 Typ.
(5.08)
.200
(5.08)
1
HD+1TM
HD+2TM
TM
1
1
.200
(5.08)
Code G
.141
(3.58)
1 = Open side of C-Press® faces side
wall indicated to determine left or
right orientation. This orientation
should be maintained during PC
board assembly
Code F
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 13
HIGH DENSITY
PLUS
®
Backpanel Pin Modules
HP Series
Number Of Rows — Step 5
Code 3
Code 4
3 Row Module
H D+1TM and H D+2TM Contact Clusters — Step 7
Code 1
Code 2
Code 3
.690
(17.53)
.194
(4.93)
Code 5
.128
(3.25) Ref.
.128
(3.25) Ref.
.690
(17.53)
.194
(4.93)
Code 6
Code 4
Code 7
.194
(4.92) Ref.
Selective Plating Chart — Step 8 and 10
Description
**
AA
C-Press® ground contact and
pin with stub tails
BJ
GA
AB
C-Press® ground contact
and pin with solderless
wrap tails
Mating Area
Code
GB
EA
.000030
(0.00076)
Gold flash
.000040
(.00101)
.000050
(0.00127)
.000030
(0.00076)
.000050
(0.00127)
.000030
(0.00076)
min. gold
over
min. PdNi
CA
C-Press® ground contact and
pin with stub tails
BG
C-Press® pins with rear
plug-up tails
DB
AC
Ground
contact and pin
with solder stub tails
BH
GC
.000015
(0.00038)
min. tin-lead
.000100
(0.00254)
min. tin-lead
min. gold
min. gold
min. gold
min. gold
®
C-Press pins with rear
plug-up tails
Solderless Wrap
Plating Area
.000030
(0.00076) min. gold
Gold flash over
.000025
min. PdNi
(0.00064)
Gold flash over
.000025
min. PdNi
(0.00064)
.000030
(0.00076) min. gold
Gold flash over
.000025 min. PdNi
(0.00064)
.000050
(0.00127) min. gold
gold flash
Mating area:
.000030 min. gold
(0.00076)
.000015
(0.00038)
min. tin-lead
Mating area: Gold flash over
.000025
min. PdNi
(0.00064)
.000100
(0.00254)
min. tin-lead
solder stub
tails only
Note: Contact underplate .000050 min. nickel overall
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 14
HIGH DENSITY
PLUS
®
Backpanel Pin Modules
HP Series
Standard Backpanel Application —
Step 9
Codes 4, 13, 51
* Codes 1, 6, 8
* Codes 5, 7
Codes 3, 12, 14,
52, 53
Midplane Application —
Step 9
* Codes 7, 10, 11
* Codes 6, 8, 9
Primary
side PCB
first
A ref.
make
A ref.
standard
Pin connector see
code order chart
first
A ref.
make
A ref.
standard
±10% backplane
P.C. board surface
B ref.
D ±10% thickness
Secondary
side PCB
ref.
C standard
first
C ref.
make
Stub
Tails
Solderless wrap
or rear plug-up
Midplane shroud
insulator only
(order separately)
Rear plug-up pins
Pin Contact Type and Tail Length — Step 9
Type
Description
Standard Backpanel
A
Code
03
C-Press® stub
.220
(5.59)
01
08
06
Standard
C-Press ® solderless wrap
or rear plug-up
.230
(5.84)
09
12
C-Press® stub
14
52
Solder stub tail
53
04
.240
(6.10)
.220
(5.59)
.220
(5.59)
.240
(6.10)
C-Press® stub
05
07
First
Make
10
C-Press ® solderless wrap
or rear plug-up
.260
(6.60)
11
13
C-Press® stub
51
Solder stub tail
Midplane Application
B
C
D
.194
(4.93)
.690
(17.53)
.576
(14.63)
.493
(12.52)
.523
(13.28)
.194
(4.93)
.325
(8.25)
—
—
—
—
.220
(5.59)
.186
(4.72)
.093
(2.36)
.125
(3.18)
.230
(5.84)
—
—
—
—
.128
(3.25)
—
—
—
—
.194
(4.93)
.690
(17.53)
.523
(13.28)
.553
(14.05)
.616
(15.65)
.325
(8.26)
.128
(3.25)
—
—
—
—
.260
(6.60)
.093
(2.36)
.125
(3.18)
.186
(4.72)
—
—
—
—
* Note: Consult factory for selective loading of first make pins
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 15
HIGH DENSITY
PLUS
®
HP Series
Backpanel Pin Modules
ORDERING INFORMATION
C-Press® Replacement Pin Contacts
03
113018
■ Step1
C-Press® contact
part number
L
**
■ Step 2
■ Step 3
■ Step 4
Pin Contact Type
and Pin Length:
01, 03 thru 14 —
see pin contact type
and tail length chart
on page 15
Selective Plating
Pin Contact:
* * = See selective plating
chart on page 14
Replacement pin
designation
C-Press® Replacement Ground Contacts
2
113013
2B
**
■ Step1
■ Step 2
■ Step 3
■ Step 4
C-Press® contact
part number
Tail Length:
1 = Solderless wrap
2 = Stub tail
Selective Plating
Ground Contact:
* * = See selective plating
chart on page 14
Ground Contact Type:
2B = Two C-Press® tails
3B = Three C-Press® tails
5B = Five C-Press® tails
Solder Tail Replacement Pin Contacts
52
113138
L
**
■ Step1
■ Step 2
■ Step 3
■ Step 4
Solder tail contact
part number
Pin Contact Type
and Pin Length:
51, 52 and 53 —
see pin contact type
and tail length chart
on page 15
Selective Plating
Pin Contact:
* * = See selective plating
chart on page 14
Replacement pin
designation
Solder Tail Replacement Ground Contacts
113137
■ Step1
Solder tail contact
part number
■ Step 2
Tail Length:
51 = Stub tail
51
3B
**
■ Step 3
Selective Plating
Ground Contact:
* * = See selective plating
chart on page 14
■ Step 4
Ground Contact Type:
3B = Three solder tails
5B = Five solder tails
Midplane Shroud 4 Row Part Numbers — Letter Codes Refer To Step 4
Code A
Code B or F
Code C
Code D or G
Code E
15 Positions
113028-12
113028-18
113028-20
113028-14
113028-16
20 Positions
113028-11
113028-17
113028-19
113028-13
113028-15
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone: (203)741-5400 Fax: (203)741-5500 www.winchesterelectronics.com
HD / 16
HIGH DENSITY
PLUS
®
Backpanel Accessories
HP Series
Power Distribution
■
Dual Power Blade Module For Internal Power Distribution
C-Press® power
blade contacts
D
.39
(9.9)
A
.20
(5.1)
H
E
.170
(4.3)
Stiffener
Guide
B equals space at
.100
= C Ref.
(2.54)
2
113084
Part
Number
113084-1113084-2-
**
**
PC Board
Hole
Pattern
BA
■ Step1
■ Step 2
■ Step 3
C-Press ® power blade
module part number
Contact Code:
Selective Plating:
A
B
C
D
E
Code Description
H
1
J
.220 2
(5.59)
.200
(5.1)
.52
.202 .202
(13.2) (5.13) (5.13)
P
.320 3 .300
.62
.202 .202
(8.13)
(7.62) (15.7) (5.13) (5.13)
113084-3-
**
J
.320 3 .300
.62
.262 .262
(8.13)
(7.62) (15.7) (6.65) (6.65)
113084-4-
**
J
.320
.300
.62
.202 .262
3
(8.13)
(7.62) (15.7) (5.13) (6.65)
Contacts
(2 per)
3 row
3 C-Press®
2
4 row
4 C-Press
®
3
4 row
4 C-Press®
4
4 row
4 C-Press®
Code
BA
GA
Mating
Area
Gold flash over
.000028
(0.00071) Min.
Palladium Nickel
Min. Gold
.000050
(0.00127)
C-Press ® Area
and Stub Tail
.000020
Min.
(0.00051)
Tin-lead
Power Blade Shroud
Protects exposed power blade contact while maintaining plugability of four row daughtercard
socket power module.
.170
(4.32)
.118
(3.00)
Part
Number
Power
Blade Type
Used With Blade
Catalog Number
113173-4
BUSS Bar —
4 row
113071-4,-5, or -89
113173-3
P.C.B. Mount —
4 row
113084-2-
**
.295
(7.49)
.425
(10.80)
Winchester Electronics
Part Number 113173-1 Shown
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 17
HIGH DENSITY
PLUS
®
Backpanel Accessories
HP Series
■
Power Distribution
Power Blade Contacts — Used With Aluminum Bus Bar
3 Row
PC Board Bus Bar
Type
Hole
Hole
Pattern
Pattern
Part
Number
113071-9
III
K
J
113071-8
I
H
J
113071-7
II
N
P
113071-5
VI
H
H
113071-4
IV
J
J
113071-1
VII
P
P
4 Row
.270
(6.85)
Typ.
.370
(9.40)
Typ.
.025
(0.63)
Typ.
.210
.337 (5.33)
(8.56) Typ.
Typ.
.495
(12.57)
Typ.
.035
(0.89)
.035
(0.89)
2 equal spaces
.100
.200
=
Typ.
(2.54) (5.08)
.300
(7.62)
Ref.
3 equal spaces
.100
.300
=
Typ.
(2.54) (7.62)
Type II
Type I
Type III
.200
(5.08)
Ref.
.300
(7.62)
Ref.
.300
(7.62)
Ref.
Type VII
Type IV
Type VI
.025
(0.63)
Typ.
.322
(8.18)
Typ.
Material: Phosphor Bronze
Alloy C52100
per QQ-B-750,
composition A.
Finish: .000030
Min. gold
(0.00076)
over
.000075 Min. nickel
(0.00191)
Recommended Hole Patterns For Power Blades
3 Row
Description
V
End polarized
.450
(11.43)
End wall
.250
(6.35)
Open ends
.150
(3.81)
V
.200
(5.08)
4 Row
V
.200
(5.08)
.200
(5.08)
V
.300
(7.62)
.200 (5.08)
1
1
1
Pattern N
Pattern H
V
.200
(5.08)
V
.200
(5.08)
1
2 equal spaces
.100
.200
=
(2.54) (5.08)
Winchester Electronics
Pattern P
3 equal spaces
.100
.300
=
(2.54) (7.62)
Pattern K
1
1 = End row of
adjacent pin
connector
Pattern J
Note: Power blade contact holes are shown at the minimum spacing
required for modules to be end stackable
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 18
HIGH DENSITY
PLUS
®
Backpanel Accessories — Guide Pins
HP Series
Guide Pins — Midplane
Guide Pins — Standard
.160
(4.06)
.070
(1.78)
A
30O
Dia.
.160
(4.06)
1.000
(25.40)
.218
(5.54)
30O
.166 ±.002
(4.22 ±0.05)
#
Dia. .115 ±.003
2-56 UNC-2B
(2.92 ±0.08)
Thread x .290 (7.37)
min. deep
Dia. .166 ±.002
(4.22 ±0.05)
.242
(6.15)
Material:
Part Number
Dimension A
113152-2
.810
(20.57)
113152-1
1.000
(25.40)
.045
(1.14)
Dia.
Part Number 113152-1 Shown
.218
(5.54)
.335
(8.51)
.115
(2.92 ±0.08)
#
2-56
UNC-2A
Thread
Part Number 113151-1
Material:
Stainless steel. Order separately
under part number 113151-1.
Stainless steel. Order separately under part number
113152-1. Guide pin option requires corresponding
guide pin receptacle on daughterboard connector
assembly — see page HD / 11 for part number
identification. A guide pin is also required on
applications that specify polarization.
Screw
Part Number
L
M
114025-1
.375
(9.53)
.191 to .315
(4.85)
(8.00)
114025-1
.250
(6.35)
.084 to .190
(2.13)
(4.83)
Standard Guide Pins — Assembly
L
Midplane Guide Pins — Assembly
.125 (3.17) min. .315 (8.00) max.
Part number 114021
External #2 lockwasher
Ref.
Material: Stainless Steel
#2-56 UNC-2A thread
cross recessed machine
screw (see chart below
for length / part number)
Material: Stainless Steel
Guide pin part
number 113152-1
Guide pin part
number 113152-1
Guide pin part
number 113151-1
M
(nominal P.C.
Board thickness)
Part Number
Dim. A
Dim. B
113165-2
.248
(6.23)
.19
(4.8)
113165-1
.188
(4.78)
.11
(2.8)
Press-Fit Guide Pins
B
A
.81
(20.6)
30o
.115
Dia. .126 Dia.
(3.20)
(2.92)
Straight Knurl
.040
(1.02)
Dia. .240
(6.10)
Dia. .166
(4.22)
Part number 113165-1 shown. Diameter .118 ±.002
non-plated thru P.C.B. hole (required).
Dia. .085
(2.16)
.30
(7.6)
Straight
Knurl
Dia. .166
(4.22)
30o
1.00
(25.4)
Part number 113163-1 shown. For use in midplane
applications with part number 113165. Recommended for
use on backpanels .125 to .315 nominal thick.
Note: See page HD/25 for recommended mounting hole patterns
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 19
HIGH DENSITY
PLUS
®
Right Angle HD+® Pin Connector
HP Series
Winchester Electronics now offers a
right angle male HD+® connector for
connecting backpanel to backpanel,
motherboard to motherboard and
extension boards.
This HD+® right angle male connector
mates without HD+® right angle
female connectors and has power
modules that carry up to 30 Amps per
contact or 60 Amps per module.
Ask your Customer Service
Coordinator for drawing #28500
Typical Connector Assembly Profile
Header
Power Module
Guide Pin
ORDERING INFORMATION
H
■ Step 1
Series
Code:
High
Density
■ Step 2
Connector
Type:
R = Right
Angle
■ Step 3
Connector Style:
0 = HD+® without
ground
contacts
■ Step 4
Insulator
Style:
A = Open
ends
R
0
■ Step 5
■ Step 6
■ Step 7
■ Step 8
■ Step 9
■ Step 10
Number of
Rows:
4 = 4 rows
Positions /
Row:
015 =
15 positions
Ground Contact
Type & Tail
Length:
0 = Without
ground
contact
Selective
Plating Ground
Contact:
00 = Without
ground
contact
Pin Contact
Type & Tail
Length:
See PN
Contact Type
and Tail
Length chart
below
Selective
Plating Pin
Contact:
See selective
plating chart
below
Pin Contact Type & Tail Length Chart
Type
Code
Description
56
Standard
Make
A
.220
5.59
54
Solder
Stub Tail
57
First
Make
55
.260
6.60
B
Selective Plating Chart
Code
Description
Mating
Area
Solder
Tail Area
AK
Pin Contacts
.000030
0.00076
Min Gold
.000100
0.00254
Min TinLead
.150
3.81
.125
3.18
.150
3.81
.125
3.18
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 20
HIGH DENSITY
PLUS
®
HP Series
Right Angle HD+® Pin Connector
HEADER
Recommended P.C. Board Hole Pattern
GUIDE PIN
Recommended P.C. Board Hole Pattern
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 21
HIGH DENSITY
PLUS
®
Right Angle HD+® Pin Connector
HP Series
POWER MODULE
Winchester Electronics understands
the needs of our customers for more
and more power in their systems. To
satisfy these needs, we now offer a
30 Amp power contact in the HD+®
connector system that takes no
additional real estate. Each power
module consists of two contacts that
can carry up to 30 Amps each to give
you 60 Amps per module!
Part Number HRP420302
Shown
Recommended P.C. Board Hole Pattern
(component side shown)
ORDERING INFORMATION
H
■ Step 1
■ Step 2
Series
Code:
High
Density
Connector
Type:
RP = Right
Angle,
Power
Module
RP
■ Step 4
Module Type: Blade Height:
42 =
Code Description
4 Row, HD+2TM
42
■ Step 3
C
D
01
02
VLOW/VLOW
(.187/4.75)
VLOW/LOW (.187/4.75) (.227/5.76)
03
04
05
06
07
08
09
VLOW/HIGH
(.287/7.29)
LOW/VLOW
(.187/4.75)
LOW/LOW
(.227/5.76) (.227/5.76)
LOW/HIGH
(.287/7.29)
HIGH/VLOW
(.187/4.75)
HIGH/LOW
(.287/7.29) (.227/5.76)
HIGH/HIGH
(.287/7.29)
■ Step 5
Tail
Length:
Code
B
01
02
.125
.150
■ Step 6
Selective Plating
Pin Contact:
See selective
plating chart below
Selective Plating Chart
Code
Description
Mating
Area
Solder
Tail Area
GJ
Blade
Contacts
.000050
0.00127
Min Gold
.000100
0.00254
Min TinLead
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 22
HIGH DENSITY
PLUS
®
Right Angle HD+® Pin Connector
HP Series
MOUNTING SCREWS
Typical Final Assembly Connector Shown Assembled To P.C. Board
Mounting screw part number 113069-1 shown
in final connector assembly
MOUNTING SPACER
Consult Factory For Use On Stiffeners Containing Unsupported Spans
Part Number 113000 Shown
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 23
HIGH DENSITY
PLUS
®
Backpanel Hole Patterns
HP Series
Pin Module 3 and 4 Row 15 and 20 Positions
H D+® — Code 0
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
.100
(2.54) Typ.
.200
(5.08)
.300
4 Row =
(7.62)
* 3 Row
=
H D+1TM & H D+2TM Contact — Code 1, 2 or 5
H D+1TM & H D+2TM Contact — Code 3, 4 or 6
.100
Typ.
(2.54)
.200
Typ.
(5.08)
.300
(7.62)
.400
4 Row =
(10.16)
* 3 Row
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
=
.300
(7.62)
.400
4 Row =
(10.16)
* 3 Row
H D+1 TM
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
=
H D+1TM
H D+1TM
.100
(2.54)
Typ.
= .400
(10.16)
4 Row = .500
(12.70)
* 3 Row
.500 (12.70) Typ.
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
.200
(5.08) Typ.
.100
(2.54)
Typ.
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
.500
(12.70) Typ.
15 Position
14 Equal Spaces
.100 = 1.400
(2.54)
(35.56)
20 Position
19 Equal Spaces
.100 = 1.900
(2.54)
(48.26)
= .400
(10.16)
4 Row = .500
(12.70)
* 3 Row
H D+1TM
H D +1TM
HD+2TM
H D+2TM
.100
(2.54)
Typ.
.100 (2.54) Typ.
15 Position
20 Position
14 Equal Spaces 19 Equal Spaces
.100 = 1.400 .100
= 1.900
(2.54)
(35.56) (2.54)
(48.26)
Right Angle
H D+2TM
.100
(2.54)
Typ.
.100 (2.54) Typ.
* Delete row D for 3 row hole patterns
H D+®
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 24
HIGH DENSITY
PLUS
®
HP Series
Backpanel Hole Patterns / Polarization
Recommended Mounting Hole Patterns
Guide pin holes are shown at the minimum spacing required for guide pin
modules to be end stackable.
3 Row
4 Row
.118 ±.002 (3.00 ±0.05)
For NPTH (preferred) typ.
.200
(5.08)
.118 ±.002 (3.00 ±0.05)
For NPTH (preferred) typ.
.047
(1.19)
.120 ±.003 (3.05 ±0.08)
For PTH typ. datum
.200
(5.08)
.047
(1.19)
.120 ±.003 (3.05 ±0.08)
For PTH typ. datum
Open Ends
Open Ends
.100
(2.54)
.150
(3.81)
.300
(7.62)
.300
(7.62)
.141
(3.58)
End Wall
.141
(3.58)
End Wall
.100
(2.54)
.150
(3.81)
.500
(12.70)
.500
(12.70)
.346
(8.79)
End Polarized
.346
(8.79)
End Polarized
.100
(2.54)
.150
(3.81)
Note: Refer to Litton Electronic System Packaging H D+® Backpanel Design Guide
for accesory configurations not shown.
Polarization Bushing
H D+1TM
.187
(4.75)
Thru hole
H D+2TM
.160
(4.06)
Part Marking
Code A Shown
Part Number 113037-2
Note: Orientation with respect to row
designation for mating connectors.
Material:
Removal
Tool:
Sintered stainless steel. Order
separately under part number
113037-2. Bushing press fits into
pin connector with installation tool
part number 107-43240.
Polarization Style
Code
A
Clocking
Position
Code
Clocking
Position
E
B
F
Part number 107-43241
C
G
Consult factory to order bushings
preassembled into pin connector.
D
H
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 25
HIGH DENSITY
PLUS
®
High Density Plus Specifications and Operating Characteristics
SPECIFICATIONS
MATERIALS AND FINISHES
The following materials and finishes apply to all High Density Plus series daughtercard and
backpanel connector modules.
Insulators:
Thermoplastic polyester, glass filled, color black, UL rated 94 V-O.
BACKPANEL CONTACTS
Signal Contacts:
Material:
Copper alloy
Finish:
See Selective Plating Chart on page HD / 14
HD+1TM & HD+2TM Contacts:
Material:
Copper alloy
Finish:
See Selective Plating Chart on page HD / 14
Dual Power Blade Contacts:
Material:
Copper alloy
Finish:
See Selective Plating Chart on page HD / 17
DAUGHTERCARD CONTACTS
Signal Contacts:
Materials:
Copper alloy
Finish:
HD+1TM
See Selective Plating Chart on page HD / 6
HD+2TM
&
Material:
Contacts:
Finish:
Power Module Contacts:
Material:
Finish:
Daughtercard Stiffener:
Copper alloy
See Selective Plating Chart on page HD / 6
Copper alloy
See Selective Plating Code Chart on page HD / 10
Extruded aluminum alloy 6061-T6 per QQ-200/8.
Clear anodize finish per MIL-A-8625.
Stiffener Mounting Screws:
CRES Type 302, passivated
Polarizing Bushings:
Sintered metal CRES Type 316
Polarizing & Guide Pins:
CRES Type 303, passivated
Guide Pin Screws:
CRES Type 303, passivated
Guide Pins:
CRES Type 203, passivated
HD+® ACCESSORY TOOLING — Repair Tools
DESCRIPTION
CATALOG NUMBER
Polarization Key (Socket Connector)
Polarization Key Removal Tool
Polarization Key Insertion Tool
107-43248
107-43247
Polarization Bushing (Pin Header)
Polarization Bushing Removal Tool
Polarization Busing Insertion Tool
107-43241
107-43240
Dual Power Blade Module Insertion Tool
3 Row
4 Row
107-43313
107-43312
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 26
HIGH DENSITY
PLUS
®
High Density Plus Specifications and Operating Characteristics
SPECIFICATIONS
OPERATING CHARACTERISTICS
Signal Contact Resistance:
20 milliohms maximum initial
C-Press® Contact to Plated Through
Hole Resistance:
2 milliohms (max)
HD+1TM
Contact Resistance:
4 milliohms maximum
HD+2TM Contact Resistance:
7 milliohms maximum
Power Blade Contact Resistance:
1.5 milliohms maximum
Signal Contact Normal Force:
75 g minimum
Power Contact Normal Force:
100 g minimum
HD+1TM & HD+2TM Contact Normal Force:
100 g minimum
Individual Signal Contact Engagement Force: 2.5 oz max average
Individual Signal Contact Separation Force:
0.5 oz minimum
Contact Life (Durability):
200 cycles, with 30 microinches plating on mating
contacts, and 500 cycles, with 50 microinches plating
on mating contacts
C-Press® Signal Contact to
Backpanel Retention:
10 lb minimum
®
C-Press Signal Contact torque:
3.0 in.-oz minimum
Insulation Resistance:
5000 megohms minimum
Voltage Rating @ Sea Level (@ 60 Hz):
1000 Vrms
Signal Contact Current Rating:
1 A @ 70 O C, 3 A Maximum
HD+1TM & HD+2TM Contact Current Rating:
4 A @ 70 O C, 8 A Maximum
Power Contact Current Rating:
20 A @ 70 O C, 25 A Maximum
Temperature Range:
-55 O C to +105 O C
HOLE SIZE REQUIREMENTS
Printed Circuit
Board Dielectric
Material
Copper Thickness
.001-.003
±.003
.040 Finished
Diameter
Solder Thickness
.0001-.0008
+.0015
-.0010
.0453 Diameter Hole
Standard Diameter P.T.H.
1. Hole drilled to .0453 +.0015, -.001 diameter.
2. Plating thickness must be .001 to .003 copper and .0001 to .0008 solder.
3. Final hole dimension must be gauged to .040 ±.003 diameter.
4. See Winchester drawing number 27331
HD+® PIN HEADER TOOLING — Repair Tools
DESCRIPTION
Pin Contact Repair
Single Contact Pullout Tool
Single Contact KO Tool Handle
Single Contact Seating Tool Tip
Single Contact KO Tool Tip
Ground Contact Repair
Removal Tool
Insertion Arbor Press Tool
CATALOG NUMBER
107-43238
107-42500
107-43230
107-42031
107-43239
107-43232
DESCRIPTION
Shroud & Insulator Repair
Removal Tool 4 x 15
Removal Tool 3 x 15
Removal Tool 4 x 20
Removal Tool 3 x 20
Seating Tool 4 x 15
Seating Tool 3 x 15
Seating Tool 4 x 20
Seating Tool 3 x 20
CATALOG NUMBER
107-43234
107-43235
107-43236
107-43237
107-43244
107-43246
107-43243
107-43245
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 27
HIGH DENSITY
PLUS
®
Signal Integrity of the High Density Plus Family
It has been determined that the HIGH DENSITY PLUS®
connector family, together with a proper choice of grounding
pattern, is suitable for inclusion in system designs where risetime
is equal to or less than 700 ps. Crosstalk characteristics of the
HIGH DENSITY PLUS® connectors, especially HD+2TM, are
predictable and suitable for hi-performance system design.
Signal Reflection — HIGH DENSITY PLUS® Family
Reduces Simultaneous Switching Noise
20
Group I
Group II
Crosstalk
In addition to signal reflections, another source of noise must be
considered — crosstalk. Crosstalk is caused by the electromagnetic coupling of a “quiet” signal contact to a nearby “active”
signal contact. There are two types of crosstalk to be concerned
with; forward crosstalk and backward crosstalk. Crosstalk can
be reduced by increasing the number of ground contacts
because the electromagnetic fields created by the signal and
ground contacts will cancel each other’s effects.
Group III
15
10
5
Percent
Percent Reflected Voltage
H D+® Crosstalk Measurements
0
A
B
C
D
H D+®
A B C D
Reflected Area By Row
H D+1TM
A
B
C
D
0
-.5
-1
-1.5
-2
-2.5
-3
5
4
H D+2TM
HIGH DENSITY PLUS® offers the advantage of up to two
additional rows of contacts that can be used for low inductance
grounding or power distribution.
A grounding scheme utilizing only 4% of the total pin contacts
was selected to create a worst case condition and demonstrate
how the “Plus” rows of contacts can improve signal integrity in
that environment.
shows rows A, B, C, D experiencing signal
reflections from 10% to 18%.
Group II — with HD+1TM signal reflections are reduced
and duration decreased.
Group III — combines HD+1TM and HD+2TM row contacts
to provide exceptional shielding.
B4, 6
D4, 6
A5, 6
Foward XTalk
Risetime 700ps
3 - 1 interface
D6, 7
Backward XTalk
A5, 6
3
2
D4, 6
1
0
nanosecs 1
B4, 6
1.5
2
2.5
3
Group I —
HIGH DENSITY PLUS® Sequence Of Mating
Contact
Electrical
Overtravel*
Effective
Wipe***
Guide Pin **
.510 (12.95)
.420 (10.67)
N/A
Insulators **
.310 (7.87)
.220 (5.59)
N/A
Pol Key **
.256 (6.50)
.166 (4.22)
N/A
Advanced Ground Contact
.223 (5.66)
.133 (3.38)
.190 (4.83)
Advanced Power Contact
.212 (5.38)
.122 (3.10)
.179 (4.54)
Standard Ground Contact
.198 (5.03)
.108 (2.74)
.165 (4.19)
Advanced Socket & Pin (.260")
Signal Contacts
.155 (3.94)
.065 (1.65)
.123 (3.12)
Standard Power Contact
.152 (3.86)
.062 (1.57)
.120 (3.05)
Mid (.240") Signal Pin and
Advanced Signal Socket Contacts
.135 (3.43)
.045 (1.143)
.102 (2.59)
Advanced (.260") Signal Pin and
Standard Signal Socket Contacts
.130 (3.30)
.040 (1.02)
.100 (2.54)
Standard (.220") Signal Pin and
Advanced Signal Socket Contacts
.115 (2.92)
.025 (.64)
.085 (2.16)
Mid (.240") Signal Pin and
Standard Signal Socket Contacts
.110 (2.79)
.020 (.51)
.080 (2.03)
Standard (.220") Signal Pin and
Standard Signal Socket Contacts
.090 (2.29)
0 (0)
.060 (1.52)
*
**
***
Worst case peak backward crosstalk of 5.6% was observed
between adjacent pins 6 and 7 in the D row. Forward crosstalk
was also largest for this pair of pins. Peak backward and
forward crosstalk between adjacent A row pins was 4.2% and
2.2% respectively. The presence of the HD+® rows clearly
reduces both the forward and backward crosstalk, even for the
D row adjacent pins.
Crosstalk is most favorably affected by the presence of the
H D+1TM and H D+2TM rows. The effects of the rows are clearly
most important to the D row in the connector where the +2 row
assists risetime response, reduces risetime loss and improves
crosstalk performance by nearly 18%. For the most demanding of applications, the H D+2TM connector provides significant
improvements in system performance.
Electrical Overtravel is the total distance of socket connector travel after initial
contact has been made.
Engagement is non-electrical.
Effective Wipe is defined as the total distance of socket connector travel after
full contact engagement has been made.
To standard signal pin and standard signal socket contacts
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 28
HIGH DENSITY
PLUS
®
Compliant Contact
C-Press® “True” Compliant Press-Fit Connectors
Winchester Electronics offers the leading edge in compliant press-fit
pins and connectors. In both design and performance, the C-Press®
contact is the premium compliant pin.
Horizontal Cross Sections
Macro-photo cut-away view of actual, unretouched, compliant contact “C”
section. At maximum and minimum diameter, plated through-hole contact
pressure is distributed evenly along the inside circumference of the plated
through-hole. The “C” section ensures a gas tight connection without
damaging the hole or warping the board.
The advantage of the C-Press® contact lies in its unique “C” shaped
compliant section. Unlike two and four point press-fit systems, the
crescent-shaped, tapered beam conforms naturally within the board
to the shape of the plated through-hole. It expands or contracts to
make contact around the circumference of the plated through-hole
from .037" to .043" in diameter, exerting an equal normal force onto
the entire surface of the hole, while forming a gas tight and extremely reliable electrical connection.
True Compliant Fit
Because the compliant section of the C-Press® contact neither warps
a board nor distorts the hole, it is an excellent choice for use in
multilayered and Multiwire® boards. A major concern with “press-fit”
contacts is the amount of axial and radial deformation imparted to
the plated through-hole as a result of contact insertion. Because our
C-Press® contact offers a “True Compliant Fit,” the concern for
deformation damage to the plated through-holes and inner layers of
a printed circuit board is eliminated.
Electronic designers no longer have to subject their expensive
printed circuit boards to soldering or forcing a square peg into a
round hole. Worries about delamination from soldering or damage
by inserting square pegs disappear, and board warpage is significantly reduced.
Multiwire ® is a Registered Trademark of Kollmorgen Corp.
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 29
HIGH DENSITY
PLUS
®
Compliant Contact
In and Out of the Board ... Without Solder
Now, with the C-Press® contact, you can insert a round pin into a round hole. This innovative
engineering achievement (Patent #4017143) ensures a spring action pin to absorb potentially
destructive energy while providing excellent electrical characteristics. C-Press® contacts meet
or exceed the performance specifications called for in MIL-STE-2166 and ANSI/IPC-D-422.
C-Press® contacts have been approved and are being used in high volume by major
manufacturers of computer, medical and telecommunications equipment. Because C-Press®
contacts are approved and used in 40-year life equipment, they clearly offer both dependability
and performance.
The C-Press® system provides you with additional benefits such as rear plug-up, and the
freedom to mount components on both sides of the board without costly masking or hand
soldering operations.
Further benefits that save you time and money are the ability to remove and replace
contacts through the insulator, as well as remove and replace an insulator without disturbing
the contacts.
C-Press® contacts exhibit low insertion forces (40 lbs. max. per pin) and high retention forces
(10 lbs. min. per pin), even after multiple replacements.
If damaged traces or the need to incorporate revisions in the existing connection system
makes it necessary to alter interconnects at the circuit board level, the Winchester Electronics
“Isolation Contact” is the answer. This contact can be installed into the existing PTH at the
required position and effectively “Insulates” the contact from the circuitry at that location.
Desired circuit alteration can then be completed by means of wire wrapping from point-to-point.
Tooling and Engineering Support
Winchester Electronics will work with and support your Backpanel Supplier of your choice.
Many are familiar with our products and tooling. Connector and pin insertion equipment is
available to set up an in-house, turn key operation. From a simple arbor press to a micro
processor controlled hydraulic press with programmable X and Y axis, Winchester Electronics
has the assembly equipment to fit your needs.
As new generations of semiconductor logic impose higher demands on production technology,
the C-Press® true compliant pin can help promote a smooth transition into the future. C-Press®
pre-assembled connectors will provide access to solutions which would otherwise be unattainable with more primitive compliant or solid pin designs.
The plated through requirement of the C-Press® contact is easily achievable in production for
printed circuit manufacturers. The C-Press® hole (see diagram) is the same as called out in
MIL-STD-2166.
HOLE SIZE REQUIREMENTS
Printed Circuit
Board Dielectric
Material
Copper Thickness
.001-.003
±.003
.040 Finished
Diameter
+.0015
-.0010
.0453 Diameter Hole
Solder Thickness
.0001-.0008
Standard Diameter P.T.H.
1. Hole drilled to .0453 +.0015, -.001 diameter.
2. Plating thickness must be .001 to .003 copper and .0001 to .0008 solder.
3. Final hole dimension must be gauged to .040 ±.003 diameter.
4. See Winchester drawing number 27331
Design Flexibility
For design flexibility across the board, the C-Press® contact gives you everything you need.
As you go through the pages of this catalog you will find: Pre-assembled Edgecard Connectors,
a variety of Signal Pins, D-Subminiatures, MIL-C-83503 Headers, C-Tel®, Power Terminals,
Strip Headers, DIN Connectors, and more. With such a broad line of connectors, solder and
press-fit technologies no longer need to be mixed on your backplane, thereby reducing assembly costs and production time. Over the years, billions of C-Press® contacts have been successfully installed by communications, computer and medical equipment manufacturers, as well as
backpanel suppliers worldwide.
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 30
HIGH DENSITY
PLUS
LittonHIGH
Electronic
SystemPLUS
Packaging
DENSITY
®
®
E.S.P. ... your global one-stop source for HD Plus Systems
Litton Electronic System Packaging is your early involvement technical marketing
partner that facilitates the resources of Advanced Circuitry, Winchester Electronics,
Inter-Pak Electronics and Interconnection Products-Scotland. ESP coordinates
the total design, manufacture, assembly and test of your sub-system ... electronic
packaging solutions.
Winchester Electronics
Winchester Electronics has provided more than four decades of innovative leadership in connector technology. The C-Press® contact offers the industry standard in
compliant pin press-fit connector technology. It is specified in the most discriminating
computer and telecommunications applications requiring long life and minimum hole
distortion characteristics.
■
■
■
■
■
HIGH DENSITY PLUS®
Din Connectors
C-Press® Compliant Pin
RF Connectors
Cable Assemblies
■
■
■
■
■
Edgecard
Rack and Panel
L-Series
2 mm
ISO-9002 Registered
Advanced Circuitry
Advanced Circuitry manufactures high density controlled impedance multilayer
daughtercards and bare board backpanels.
■
■
■
■
■
■
■
■
High Performance Substrates
Large Panel Capability: Up to 30" x 48"
PCB Thickness: Up to .400"
Heat Sink Copper to 29 oz.
Copper Inner Layers, UL Approved to 10 oz.
Internal Reliability Lab
Up to 50 layers... standard production
ISO-9002 Registered
Inter-Pak Electronics
Inter-Pak Electronics is the benchmark supplier for automated press-fit backpanel
assembly and advanced electrical test.
■
■
■
■
■
Computer Controlled Automated Assembly
Advanced Electrical System Test and Signal Analysis Level I, II, III and IV
Custom Card Cage and Chassis Integration
Solder Technology Center (SMT and Thru-Hole)
ISO-9002 Registered
Interconnection Products Division (IPD)
IPD is a major supplier of backplane interconnection to the European marketplace.
■
■
■
■
Backplane Interconnection Systems
Sub-System Integration
Computer Aided Backplane Engineering (CABE)
ISO-9002 Registered
Winchester Electronics
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HD / 31
HIGH DENSITY
PLUS
Other Product
Offerings
HIGH
DENSITY
PLUS
®
®
Press-fit “SMA”
Coaxial Connector with
C-Press® compliant pin
technology
The perfect
solderless
connector
MetCon-2TM
Connector System
Winchester
L-Series
High Density
two piece connector system
Printed Circuit
Edgecard
DIN 41612
Connector
System
MIL-C-55302
military PCB interconnections
HIGH DENSITY PLUS ®
pin and socket
interconnection
system
USECO Terminals
and Hardware
About Us
Winchester Electronics, a member of Litton
Industries’ Electronic Components and
Materials group, has been a high reliability
supplier of multipole electrical and electronic
connectors since 1941. Through the years,
Winchester has developed Rack and Panel,
Cardedge and Military connectors for many
diverse applications. Winchester’s C-Press®
compliant pin product has made us the favored
supplier of the telecommunications and
communications industries. We have led the
industry in the use of DIN, HD+®, IDC, L-Series
and other high density solder and press-fit
connectors. Our products are installed in the
backpanels and daughtercards of all major
systems suppliers. To expand our product
offering, Winchester recently acquired
Retconn, a leading designer and manufacturer
of RF coaxial connectors, contacts and cable
harnesses for the communication and
computer industries.
We are a company of many “FIRSTS”:
■ The First MIL-Grade Mono-Block
Connector
■ The First Quick-Disconnect Connector
■ The First Pin and Socket Printed Circuit
Connector
■ The First Environmental Rectangular
Connector
■ The First Compliant Pin Connector
Winchester Electronics
These “FIRSTS” were used on numerous Military
programs such as Atlas, Titan, Minuteman, Polaris,
Poseidon, Pershing and Bulpup, plus the F104,
F105 and B-52, as well as Singars and Lantirn.
These “Firsts” were also used in the initial
backpanels made by Western Electric in their D4
channel banks and Bellpac (now Fastec) systems.
Winchester’s core capabilities include high-speed,
fine pitch, progressive stamping; precision
molding; flexible rapid response development
engineering; and high-volume assembly of
connectors and cable assemblies, as well as
contract manufacturing.
Winchester has several ISO 9000 registered
production facilities all over the world. Sales
efforts are global via direct salesman, Litton
Precision Product International (LPPI) sales
offices, contracted manufacturer’s representatives
and authorized distributors.
We are a member of Electronic Systems
Packaging (ESP); Litton’s system focused
technical sales and marketing service. The other
member divisions are Advanced Circuitry, InterPak Electronics and Interconnection Products.
ESP capitalizes on the synergy of our divisions to
bring customers the most reliable, cost-effective
custom backpanels and enhanced interconnect
system packaging in the industry.
Winchester Electronics is committed to remain a
World-Class supplier with products and services
that meet clearly defined customer requirements
ON TIME, EVERY TIME.
62 Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
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