PANASONIC MN101EF11G

MN101E11G
MN101E11G
Type
MN101EF11G
Mask ROM
Internal ROM type
FLASH
ROM (byte)
128K
RAM (byte)
4K
Package (Lead-free)
QFP084-P-1818E
QFP084-P-1818E (ES (Engineering Sample)
available)
Minimum Instruction
Execution Time
100 ns (at 3.135 V to 3.465 V, , normal-mode)
100 ns
 Interrupts
External (5 lines)
Internal (13 lines) : Timer × 4, A/D × 1, RESET × 1, OSD × 1, Serial × 2, I²C × 1, Caption × 1, Remote control × 1, HSYNC× 1,
VSYNC× 1
 Timer Counter
8-bit timer × 4
Watchdog timer : Time-out period is selectable.
 Serial interface
I²C × 1 : for multimaster mode, bus line (output) has 2 systems
Sync serial / UART × 1
 Caption / Teletext Decoder
・Built-in sync separator × 1
 I/O Pins
I/O
30
Common use
 A/D converter
10-bit × 8-ch. (with S/H)
 PWM
8-bit × 4-ch. , 14-bit × 1-ch.
 Special Ports
Remote control reception
 CRTC
1-layer display (graphics, characters, splits)
 Notes
Remote control input discriminant circuit built-in, build-in NTSC video signal processing circuit, built-in 3-line comb filter, PinP
available
 Development tools
In-circuit Emulator
PX-PAC101E02-4W9J
MAD00044DEM
MN101E11G
MN101E11G
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
P33, IRQ3
P34, IRQ4
VSYNC
P36, PWM4
PIPYS
PIPYIN
PIPVIN
PIPUIN
AVDD
AVSS
VREFH
VREFM
MCOMPIN
VREFL
MSCIN
CREFH
MVIN
CLH
MUIN
CLL
CREFL
P10, RMIN, IRQ0
P11, SDA0 *1
P12, SCL0 *1
P13, PWM *1
P14, VOUT0
P15, SBT0
P16, SBD0
P17, SBO0
P20, SDA1 *1
P21, SCL1 *1
P22, PWM0 *1
P23, PWM1
P24, PWM2
DVDD
DVSS
P25, SYSCLK
P26, TM0IO *1
P27, TM1IO *1
P30, NRST
P31, IRQ1
P32, IRQ2
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
VDD(VPP) *2
P07, ADIN7, VDAF
P06, ADIN6, HDAF
P05, ADIN5
DVDD
DVSS
P04, ADIN4
P03, ADIN3
P02, ADIN2
P01, ADIN1
P00, ADIN0
MMOD
OSC2
OSC1
PDO
VCOI
AVDD
AVSS
BOUT
SIREF
SCOMP
 Pin Assignment
QFP084-P-1818E
Note) *1: 5 V dielectric N-ch. open drain output pin
*2: Mask ROM = VDD, Flash memory built-in type = VPP
MAD00044DEM
GOUT
ROUT
VIREF
VCOMP
VMOUT
AVDD
FBPIN
AVSS
EW
VOUT
AVDD
FSCOUT
FSCIN
FPCO
AVSS
FVCOI
HOUT
HDOWN
EHTIN
BEAMIN
ABLIN
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semiconductors described in this book
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company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
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systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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