PIN diodes MA27P02 Silicon epitaxial planar type Unit: mm 0.27+0.05 –0.02 For high frequency switch 0.13+0.05 –0.02 Symbol Rating Unit Reverse voltage VR 60 V Forward current IF 100 mA Power dissipation * PD 150 mW Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C 0 to 0.01 Parameter 0.52±0.03 ■ Absolute Maximum Ratings Ta = 25°C 0.15 max. 0.60±0.05 0.15 min. 1 5° 0.15 min. • Small terminal capacitance Ct • Small forward dynamic resistance rf • Ultraminiature package and surface mounting type 1.0 mm × 0.6 mm (height: 0.52 mm) 5° 1.00±0.05 ■ Features 1.40±0.05 2 1: Anode 2: Cathode SSSMini2-F2 Package Marking Symbol: Y Note) *: With a glass epoxy PC board ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Symbol Max Unit VF IF = 10 mA 1.0 V Reverse current IR VR = 60 V 100 nA Terminal capacitance Ct VR = 1 V, f = 1 MHz 0.5 pF rf IF = 10 mA, f = 100 MHz 2.0 Ω Forward voltage Forward dynamic resistance * Conditions Min Typ Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. *: rf measurement device ; agilent model 4291B Publication date: March 2004 SKL00008BED 1 MA27P02 IF V F IR VR 1.0 102 100°C 25°C Terminal capacitance Ct (pF) Ta = 150°C 1 Reverse current IR (nA) −20°C 100°C 10 f = 1 MHz Ta = 25°C Ta = 150°C 102 Forward current IF (mA) Ct VR 103 103 10 1 10−1 25°C 10−2 10−1 0.8 0.6 0.4 0.2 10−3 10−2 10−4 0 0.2 0.4 0.6 0.8 1.0 1.2 0 20 40 Reverse voltage VR (V) Forward voltage VF (V) rf I F Forward dynamic resistance rf (Ω) 103 f = 100 MHz Ta = 25°C 102 10 1 10−1 10 −2 10 −1 1 10 Forward current IF (mA) 2 60 SKL00008BED 0 0 10 20 Reverse voltage VR (V) 30 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP