DFM1200EXS12-A000 Fast Recovery Diode Module Replaces DS5851-1.2 DS5851-2 August 2011 (LN28651) FEATURES KEY PARAMETERS VRRM VF IF IFM Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop Isolated Cu Base with Al2O3 Substrates Triple Diodes can be paralleled for 3600A rating Lead Free Construction (typ) (max) (max) 1200V 1.9V 1200A 2400A 9(K1) 7(K2) 5(K3) 8(A1) 6(A2) 4(A3) APPLICATIONS Chopper Diodes Boost and Buck Converters Free-wheel Circuits Snubber Circuits Resonant Converters Induction Heating Multi-level Switch Inverters External connection required for a single 3600A diode The DFM1200EXS12-A000 is a triple 1200V, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fig. 1 Circuit configuration Fast switching times and low reverse recovery losses allow high frequency operation, making the device suitable for the latest drive designs employing PWM and high frequency switching. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ORDERING INFORMATION Order As: DFM1200EXS12-A000 Note: When ordering, please use the complete part number Outline type code: E (See Fig. 7 for further information) Fig. 2 Package 1 /7 www.dynexsemi.com DFM1200EXS12-A000 ABSOLUTE MAXIMUM RATINGS – PER ARM Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25°C unless stated otherwise Symbol VRRM Parameter Test Conditions Max. Units Repetitive peak reverse voltage Tj = 125°C 1200 V IF Forward current DC, Tcase = 75°C, Tj = 125°C 1200 A IFM Max. forward current Tcase = 110°C, tp = 1ms 2400 A I t value fuse current rating VR = 0, tp = 10ms, Tj = 125°C 400 kA s Pmax Max. transistor power dissipation Tcase = 25°C, Tj = 125°C 7520 W Visol Isolation voltage – per module Commoned terminals to base plate. AC RMS, 1 min, 50Hz 2500 V 2 It 2 2 THERMAL AND MECHANICAL RATINGS Internal insulation material: Al2O3 Baseplate material: Cu Creepage distance: 33mm Clearance: 20mm CTI (Comparative Tracking Index): >600 Symbol Parameter Rth(j-c) Thermal resistance (per arm) Rth(c-h) Thermal resistance – case to heatsink (per module) Tj Tstg Test Conditions Min Typ. Max Units - - 20 °C/kW - - 6 °C/kW - - 125 °C -40 - 125 °C Mounting – M6 - - 5 Nm Electrical connections – M8 - - 10 Nm Continuous dissipation – junction to case Mounting torque 5Nm (with mounting grease) Junction temperature Storage temperature range Screw Torque 2/7 www.dynexsemi.com DFM1200EXS12-A000 STATIC ELECTRICAL CHARACTERISTICS – PER ARM Tcase = 25°C unless stated otherwise. Symbol Parameter IRM Peak reverse current VF Forward voltage LM Test Conditions Min Typ VR = 1200V, Tj = 125°C Max Units 30 mA IF = 1200A 1.9 2.2 V IF = 1200A, Tj = 125°C 2.1 2.4 V Inductance 20 nH STATIC ELECTRICAL CHARACTERISTICS Tcase = 25°C unless stated otherwise. Symbol LM Parameter Test Conditions Min Module inductance (externally connected in parallel) Typ Max 15 Units nH DYNAMIC ELECTRICAL CHARACTERISTICS – PER ARM Tcase = 25°C unless stated otherwise Symbol Parameter Qrr Reverse recovery charge Irr Peak reverse recovery current Erec Reverse recovery energy Test Conditions Min Typ. Max Units 200 μC VR = 600V 800 A dIF/dt = 9000A/μs 80 mJ IF = 1200A Tcase = 125°C unless stated otherwise Parameter Symbol Qrr Reverse recovery charge Irr Peak reverse recovery current Erec Reverse recovery energy Test Conditions Min Typ. Max Units 300 μC VR = 600V 920 A dIF/dt = 8400A/μs 140 mJ IF = 1200A 3 /7 www.dynexsemi.com DFM1200EXS12-A000 Fig. 3 Diode typical forward characteristics Fig. 4 Transient thermal impedance Fig. 5 DC Current rating vs case temperature Fig. 6 RBSOA 4/7 www.dynexsemi.com DFM1200EXS12-A000 PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 190 ±0.5 171 ±0.15 57 ±0.1 6 x M8 screwing depth max. 16 5.2 ±0.2 40 ±0.2 140 ±0.5 124 ±0.1 40 ±0.2 20 ±0.1 7 20.25 ±0.2 28 ±0.5 8 x Ø7 screwing depth max. 8 41.25 ±0.2 3 x M4 79.4 ±0.2 61.5 ±0.3 61.5 ±0.3 5 ±0.2 38 ±0.5 13 ±0.2 external connection 5(C) 7(C) external connection external connection 9(C) 3(C) 3(C) 2(G) 2(G) 1(E) 7(C) 9(C) 5(C) 5(C) 7(C) 9(C) 6(E) 8(E) 4(E) 4(E) 6(E) 8(E) 1(E) 4(E) 6(E) external connection DIM....ESM....... 8(E) Nominal Weight: 2250g external connection DIM....ECM....... Module Outline Type Code: external connection E DFM....EXM....... Fig. 7 Module outline drawing 5 /7 www.dynexsemi.com DFM1200EXS12-A000 IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application. The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product design is complete and final characterisation for volume production is in progress. The datasheet represents the product as it is now understood but details may change. No Annotation: The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS CUSTOMER SERVICE DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolnshire, LN6 3LF, United Kingdom Fax: +44(0)1522 500550 Tel: +44(0)1522 500500 Web: http://www.dynexsemi.com DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolnshire, LN6 3LF, United Kingdom Fax: +44(0)1522 500020 Tel: +44(0)1522 502753 / 502901 Email: [email protected] Dynex Semiconductor Ltd. 2005. Technical Documentation – Not for resale. 6/7 www.dynexsemi.com