AP2146/AP2156 0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2146 and AP2156 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. ( Top View ) EN1 All devices are available in SO-8 and MSOP-8EP packages. OUT1 1 8 FLG1 2 7 FLG2 3 6 GND EN2 4 5 OUT2 IN SO-8 Features ( Top View ) Dual USB port power switches Over-Current and Thermal Protection 0.8A Accurate Current Limiting Reverse Current Blocking 90mΩ On-Resistance Input Voltage Range: 2.7V - 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (Max) Fault Report (FLG) With Blanking Time (7ms Typ) ESD Protection: 6KV HBM, 300V MM Active Low (AP2146) or Active High (AP2156) Enable Ambient Temperature Range -40ºC to +85°C SO-8 and MSOP-8EP (Exposed Pad): Available in “Green” Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Notes: EN1 1 8 OUT1 FLG1 2 7 IN FLG2 3 6 GND EN2 4 5 OUT2 MSOP-8EP Applications Consumer Electronics – LCD TV & Monitor, Game Machines Communications – Set-Top-Box, GPS, Smartphone Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit Power Supply 2.7V to 5.5V IN 10k 10k 10mF OFF AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 0.1mF 68mF 0.1mF 68mF 0.1mF FLG1 FLG2 ON Load OUT1 EN1 EN2 OUT2 Load GND 1 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Available Options Part Number Channel Enable Pin (EN) Current Limit (Typ) Recommended Maximum Continuous Load Current AP2146 AP2156 2 2 Active Low Active High 0.8A 0.8A 0.5A 0.5A Pin Descriptions Pin Name EN1 FLG1 FLG2 EN2 OUT2 GND IN OUT1 Pin Number SO-8 MSOP-8EP 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 Exposed Pad - Function Switch 1 enable input, active low (AP2146) or active high (AP2156) Switch 1 over-current and over-temperature fault report, open-drain Switch 2 over-current and over-temperature fault report, open-drain Switch 2 enable input, active low (AP2146) or active high (AP2156) Switch 2 voltage output pin Ground Voltage input pin Switch 1 voltage output pin Exposed Pad: Exposed Pad It should be connected externally to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram FLG1 Thermal Sense Deglitch EN1 Driver Current Limit GND UVLO CS OUT1 CS OUT2 Reverse blocking IN Reverse blocking UVLO EN2 FLG2 Driver Current Limit Deglitch Thermal Sense AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 GND 2 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN Input Voltage VOUT Output Voltage VEN , VFLG Enable Voltage ILOAD TJ(MAX) TST Note: Parameter Human Body Model ESD Protection Machine Model ESD Protection Maximum Continuous Load Current Rating Unit 6 300 kV V 6.5 V VIN +0.3 V 6.5 V Internal Limited A +150 °C -65 to +150 °C Maximum Junction Temperature Storage Temperature Range (Note 4) 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit 2.7 5.5 V VIN Input Voltage IOUT Output Current 0 500 mA VIL Low-Level Input Voltage on EN or EN 0 0.8 V VIH High-Level Input Voltage on EN or EN TA Operating Ambient Temperature AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 3 of 17 www.diodes.com 2 VIN V -40 +85 C January 2016 © Diodes Incorporated AP2146/AP2156 Electrical Characteristics Symbol (@TA = +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.) Parameter VUVLO Input UVLO ISHDN Input Shutdown Current Input Quiescent Current, Dual ILEAK Input Leakage Current IREV Reverse Leakage Current IQ Test Conditions Min Typ Max 1.6 1.9 2.5 V Disabled, IOUT = 0 - 0.5 1 µA Enabled, IOUT = 0 - 95 140 µA Disabled, OUT grounded - - 1 µA Disabled, VIN = 0V, VOUT = 5V, IREV at VIN - 1 - µA - 90 100 135 135 mΩ mΩ RLOAD = 1kΩ VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C MSOP-8EP SO-8 Unit RDS(ON) Switch On-Resistance VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C - 120 160 mΩ ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 68µF - 0.7 - A Over-Load Current Limit VIN = 5V, VOUT = 4.8V, CL = 120µF, -40°C ≤ TA ≤ +85°C 0.6 0.8 1.0 A Current Limiting Trigger Threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 22µF - 1.0 - A TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 22µF - 20 - µs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V - - 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 - - V ISINK EN Input Leakage VEN = 5V - - 1 µA TD(ON) Output Turn-On Delay Time CL=1µF, RLOAD = 10Ω - 0.05 TR Output Turn-On Rise Time CL=1µF, RLOAD = 10Ω - 0.6 TD(OFF) Output Turn-Off Delay Time CL=1µF, RLOAD = 10Ω - 0.01 ILIMIT ITrig ms 1.5 ms ms Output Turn-Off Fall Time CL=1µF, RLOAD = 10Ω - 0.05 0.1 RFLG FLG Output FET On-Resistance IFLG =10mA - 20 40 Ω TBlank FLG Blanking Time CIN =10µF, CL = 68µF 4 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ - +140 - C THYS Thermal Shutdown Hysteresis - - +25 - - 110 60 - TF θJA Notes: SO-8 (Note 5) Thermal Resistance Junction-to-Ambient MSOP-8EP (Note 6) ms C o C/W o C/W 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane. AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 4 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics VEN 50% TD(ON) 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% TF TD(ON) 90% VOUT 10% 90% 10% 90% 10% Figure 1. Voltage Waveforms: AP2146 (Left), AP2156 (Right) All Enable Plots are for AP2146 Active Low Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time Ven 1 5V/div Ven 1 5V/div Vout 1 2V/div CL=1mF TA=+25°C RL=10Ω Vout 1 2V/div CL=1mF TA=+25°C RL=10Ω 500µs/div 500µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div Vout 2 2V/div CL=1mF TA=+25°C RL=10Ω Vout 2 2V/div CL=1mF TA=+25°C RL=10Ω 500µs/div 500µs/div AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 5 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Channel 1 Turn-On Delay and Rise Time Channel 1 Turn-Off Delay and Fall Time Ven 1 5V/div Ven 1 5V/div Vout 1 2V/div CL=100mF TA=+25°C RL=10Ω Vout 1 2V/div CL=100mF TA=+25°C RL=10Ω 500µs/div 500µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div CL=100mF TA=+25°C RL=10Ω Vout 2 2V/div CL=100mF TA=+25°C RL=10Ω Vout 2 2V/div 500µs/div 500µs/div Channel 1 Short Circuit Current, Device Enabled Into Short Channel 2 Short Circuit Current, Device Enabled Into Short Ven 1 5V/div Ven 2 5V/div Iout 1 200mA/div Iout 2 200mA/div VIN=5V TA=+25°C CL=22mF VIN=5V TA=+25°C CL=22mF 500µs/div AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 500µs/div 6 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Channel 1 Inrush Current Channel 2 Inrush Current Ven 1 5V/div Ven 2 5V/div CL=100uF VIN=5V TA=+25°C RL=10Ω CL=100uF Iout 1 200mA/div VIN=5V TA=+25°C RL=10Ω Iout 2 200mA/div CL=470uF CL=470uF CL=220uF CL=220uF 1ms/div 1ms/div Channel 1 1 Ω Load Connected to Enabled Device Channel 1 2Ω Load Connected to Enabled Device VIN=5V TA=+25°C CL=22mF VIN=5V TA=+25°C CL=22mF Vflag 1 2V/div Vflag 1 2V/div Iout 1 1A/div Iout 1 1A/div 2ms/div 2ms/div Channel 2 1 Ω Load Connected to Enabled Device Channel 2 2Ω Load Connected to Enabled Device VIN=5V TA=+25°C CL=22mF VIN=5V TA=+25°C CL=22mF Vflag 2 2V/div Vflag 2 2V/div Iout 2 1A/div Iout 2 1A/div 2ms/div AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 2ms/div 7 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Channel 1 Short Circuit with Blanking Time and Recovery Channel 2 Short Circuit with Blanking Time and Recovery VIN=5V TA=+25°C CL=22mF Vout 5V/div VIN=5V TA=+25°C CL=22mF Vout 5V/div Vflag 5V/div Vflag 5V/div Iout 1A/div Iout 1A/div 20ms/div 20ms/div Channel 1 Power On Channel 2 Power On Vflag 5V/div Vflag 5V/div TA=+25°C CL=22mF RL=10Ω Iout 200mA/div TA=+25°C CL=22mF RL=10Ω Iout 200mA/div Ven 5V/div Ven 5V/div Vin 5V/div Vin 5V/div 1ms/div 1ms/div Channel 1 UVLO Increasing Channel 1 UVLO Decreasing Vin 2V/div TA=+25°C CL=22mF RL=10Ω Iout 200mA/div TA=+25°C CL=22mF RL=10Ω Vin 2V/div Iout 200mA/div 10ms/div 1ms/div AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 8 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Channel 2 UVLO Increasing Vin 2V/div Channel 2 UVLO Decreasing TA=+25°C CL=22mF RL=10Ω Iout 200mA/div TA=+25°C CL=22mF RL=10Ω Vin 2V/div Iout 200mA/div 1ms/div 10ms/div Channel 1 Enabled and Shorted with Channel 2 Disabled Channel 1 Disabled and Channel 2 Enabled Vout 1 5V/div Ven1 5V/div Vout 2 5V/div Vout 1 5V/div TA=+25°C CL=22mF Vflag 1 5V/div Iout 2 500mA/div Ven2 5V/div TA=+25°C CL=22mF Vout 2 5V/div 100ms/div 50ms/div AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 9 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 500 400 300 CL=1mF RL=10Ω TA=+25°C 200 100 CL=1mF RL=10Ω TA=+25°C 30 30 29 29 28 28 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 600 25 500 24 400 23 Fall Time (us) Rise Time (us) 4 4.5 5 5.5 6 5.5 6 Fall Time vs Input Voltage Rise Time vs Input Voltage 300 CL=1mF RL=10Ω TA=+25°C 200 22 CL=1mF RL=10Ω TA=+25°C 21 20 100 19 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 Input Voltage (V) Input Voltage (V) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 1.60 60 Supply Current, Output Disabled (uA) 65 Supply Current, Output Enabled (uA) 3.5 Input Voltage (V) Input Voltage (V) VIN =5.0V 55 VIN=5.5V 50 45 40 VIN =3.3V VIN =2.7V 35 VIN = 5.5V 1.40 1.20 VIN = 5.0V 1.00 VIN = 3.3V 0.80 0.60 VIN = 2.7V 0.40 0.20 0.00 30 -60 -40 -20 0 20 40 60 80 100 -45 AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 -25 -5 15 35 55 75 95 Ambient Temperature (°C) Ambient Temperature (°C) 10 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Typical Performance Characteristics (Cont.) Short-Circuit Output Current vs Ambient Temperature Static Drain-Source On-State Resistance vs Ambient Temperature 710 Short-Circuit Output Current (mA) 200 Static Drain-Source On-State Resistance (mΩ) 190 180 VIN = 2.7V 170 VIN = 3.3V 160 150 140 130 120 110 VIN = 5V 100 -60 -40 -20 0 20 40 60 700 VIN = 2.7V 690 VIN = 3.3V VIN = 5.0V 680 670 660 650 VIN = 5.5V 640 630 80 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.15 2.05 2.04 Threshold Trip Current (A) Undervoltage Lockout (V) UVLO Rising 2.03 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA=+25°C CL=22mF 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) Current Limit Response vs Peak Current 45 Current Limit Response (us) 40 35 30 25 VIN=5V TA=+25°C CL=22mF 20 15 10 5 0 2 3 4 5 6 7 8 9 10 Peak Current (A) AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 11 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Application Information Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2146/AP2156 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2146/AP2156 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30oC), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2146/AP2156 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2146/AP2156 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 12 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Application Information (Cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Downstream USB Ports Power Supply 3.3V 5V D+ DVBUS AP2146 7 IN OUT1 8 0.1mF USB Controller 0.1mF 2 FLG1 1 EN1 3 FLG2 4 EN2 OUT2 68mF D+ DVBUS 5 GND 6 GND 0.1mF 68mF GND Figure 2. Typical Two-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2146/AP2156, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2146/AP2156 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2146/AP2156 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 13 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Ordering Information Part Number Package Code Packaging AP21X6SG-13 AP21X6MPG-13 S MP SO-8 MSOP-8EP Quantity 13” Tape and Reel Part Number Suffix 2500/Tape & Reel 2500/Tape & Reel -13 -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 4 : Active Low 5 : Active High YY WW X X 1 (2) 6 : 2 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 2 3 4 MSOP-8EP AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 14 of 17 www.diodes.com January 2016 © Diodes Incorporated AP2146/AP2156 Package Outline Dimensions (All dimensions in mm.) Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. (1) Package type: SO-8 SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm (2) Package type: MSOP-8EP D 4X 10 ° 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 15 of 17 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm January 2016 © Diodes Incorporated AP2146/AP2156 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. (1) Package type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 16 of 17 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 January 2016 © Diodes Incorporated AP2146/AP2156 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com AP2146/AP2156 Document number: DS31813 Rev. 4 - 2 17 of 17 www.diodes.com January 2016 © Diodes Incorporated