Datasheet - Diodes Incorporated

AP2142/ AP2152
0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2142 and AP2152 are integrated high-side power switches
( Top View )
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
GND
1
8
FLG1
IN
2
7
OUT1
EN1 3
6
OUT2
EN2 4
5
FLG2
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
SO-8
Features
( Top View )
•
Dual USB Port Power Switches
•
Over-Current and Thermal Protection
•
0.8A Accurate Current Limiting
•
Reverse Current Blocking
•
GND
1
8
FLG1
IN
2
7
OUT1
115mΩ On-Resistance
EN1
3
6
OUT2
•
Input Voltage Range: 2.7V – 5.5V
EN2
4
5
FLG2
•
0.6ms Typical Rise Time
•
Very Low Shutdown Current: 1µA (max)
•
Fault Report (FLG) with Blanking Time (7ms typ)
•
ESD protection: 4.5KV HBM, 350V MM
•
Active High (AP2152) or Active Low (AP2142) enable
Applications
•
Ambient Temperature Range -40°C to +85°C
•
Consumer Electronics – LCD TV & Monitor, Game Machines
•
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
•
Communications – Set-Top-Box, GPS, Smartphone
Molding Compound (No Br, Sb)
•
MSOP-8EP
ƒ
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
ƒ
Halogen and Antimony Free. “Green” Device (Note 3)
•
UL Recognized, File Number E322375
•
IEC60950-1 CB Scheme Certified
Notes:
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
AP2152 Enable Active High
Power Supply
2.7V to 5.5V
IN
10k
10k
10uF
OFF
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
0.1uF
68uF
0.1uF
68uF
0.1uF
FLG1
FLG2
ON
Load
OUT1
EN1
EN2
OUT2
Load
GND
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AP2142/ AP2152
Available Options
Current Limit
(typ)
0.8A
Recommended Maximum
Continuous Load Current
2
Enable Pin
(EN)
Active Low
2
Active High
0.8A
0.5A
Part Number
Channel
AP2142
AP2152
0.5A
Pin Descriptions
Pin
Name
Pin Number
GND
IN
EN1
EN2
FLG2
SO-8
1
2
3
4
5
MSOP-8EP
1
2
3
4
5
OUT2
OUT1
FLG1
6
7
8
6
7
8
Exposed Tab
—
Function
Ground
Voltage input pin
Switch 1 enable input, active low (AP2142) or active high (AP2152)
Switch 2 enable input, active low (AP2142) or active high (AP2152)
Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
Switch 2 voltage output pin
Switch 1 voltage output pin
Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance.
Exposed Tab
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2142, AP2152
FLG 1
T h e rm a l
S ense
D e g litc h
EN1
D riv e r
C u rre n t
L im it
GND
U VLO
C u rre n t
S ense
OUT1
C u rre n t
S ense
OUT2
IN
U VLO
EN2
FLG 2
D riv e r
C u rre n t
L im it
D e g litc h
T h e rm a l
S ense
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
GND
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AP2142/ AP2152
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Rating
3
300
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
VIN
ILOAD
TJ(MAX)
TST
Input Voltage
Unit
kV
V
Maximum Continuous Load Current
Internal Limited
A
150
°C
-65 to +150
°C
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Units
2.7
5.5
V
Output Current
0
500
mA
EN Input Logic Low Voltage
0
0.8
V
VIH
EN Input Logic High Voltage
2
VIN
V
TA
Operating Ambient Temperature
-40
+85
°C
VIN
Input voltage
IOUT
VIL
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Max
Unit
VUVLO
Input UVLO
RLOAD = 1kΩ
1.9
2.5
V
ISHDN
Input Shutdown Current
Disabled, IOUT = 0
0.5
1
µA
Input Quiescent Current, Dual
Enabled, IOUT = 0
100
160
µA
ILEAK
Input Leakage Current
Disabled, OUT grounded
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
150
mΩ
IQ
RDS(ON)
ISHORT
ILIMIT
Switch On-Resistance
Short-Circuit Current Limit
Over-Load Current Limit
1.6
Typ
VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C
1
MSOP-8EP
SO-8
120
160
mΩ
140
180
mΩ
Enabled into short circuit, CL = 68µF
0.6
1.0
A
VIN = 5V, VOUT = 4.8V, CL = 68µF, -40°C ≤ TA ≤ +85°C
Current Limiting Trigger Threshold
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
ISINK
µA
VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ 85°C
ITrig
TD(ON)
115
EN Input Leakage
VEN = 5V
Output Turn-On delay Time
CL=1µF, RLOAD = 10Ω
Output Turn-On rise Time
0.6
0.8
A
1.0
A
0.8
2
V
V
1
0.05
µA
ms
CL=1µF, RLOAD = 10Ω
0.6
Output Turn-Off delay Time
CL=1µF, RLOAD = 10Ω
0.01
Output Turn-Off Fall Time
CL=1µF, RLOAD = 10Ω
0.05
0.1
RFLG
FLG Output FET On-Resistance
IFLG =10mA
30
50
Ω
TBlank
FLG Blanking Time
CIN =10µF, CL = 68µF
7
15
ms
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
THYS
Thermal Shutdown Hysteresis
TR
TD(OFF)
TF
θJA
Notes:
Thermal Resistance Junction-toAmbient
4
1.5
ms
ms
ms
140
°C
25
°C
SO-8 (Note 5)
110
°C/W
MSOP-8EP (Note 6)
60
°C/W
5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Typical Performance Characteristics
VEN
50%
TD(ON)
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
TF
TD(ON)
90%
VOUT
10%
90%
10%
90%
10%
Figure 1 Voltage Waveforms: AP2142 (left), AP2152 (right)
All Enable Plots are for AP2142 Active Low
Channel 1 Turn-Off Delay and Fall Time
Channel 1 Turn-On Delay and Rise Time
Ven 1
5V/div
Ven 1
5V/div
Vout 1
2V/div
Vout 1
2V/div
CL = 1µF
TA = +25°C
RL = 10Ω
CL = 1µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
Channel 2 Turn-On Delay and Rise Time
Channel 2 Turn-Off Delay and Fall Time
Ven 2
5V/div
Ven 2
5V/div
Vout 2
2V/div
Vout 2
2V/div
CL = 1µF
TA = +25°C
RL = 10Ω
CL=1µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 1 Turn-Off Delay and Fall Time
Channel 1 Turn-On Delay and Rise Time
Ven 1
5V/div
Ven 1
5V/div
CL = 100µF
TA = +25°C
Vout 1
2V/div
Vout 1
2V/div
RL = 10Ω
CL = 100µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
Channel 2 Turn-On Delay and Rise Time
Channel 2 Turn-Off Delay and Fall Time
Ven 2
5V/div
Ven 2
5V/div
CL = 100µF
TA = +25°C
Vout 2
2V/div
RL = 10Ω
Vout 2
2V/div
CL = 100µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
Channel 2 Short Circuit Current,
Device Enabled Into Short
Ven 1
5V/div
Ven 2
5V/div
Iout 1
200mA/div
Iout 2
200mA/div
VIN = 5V
VIN = 5V
TA = +25°C
TA = +25°C
CL = 22µF
CL = 22µF
500µs/div
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
500µs/div
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 2 Inrush Current
Channel 1 Inrush Current
Ven 1
5V/div
Ven 2
5V/div
CL = 100µF
VIN = 5V
TA = +25°C
RL = 10Ω
CL = 100µF
Iout 1
200mA/div
VIN = 5V
TA = +25°C
RL = 10Ω
Iout 2
200mA/div
CL = 470µF
CL = 470µF
CL = 220µF
CL = 220µF
1ms/div
1ms/div
Channel 1
2Ω Load Connected to Enabled Device
Channel 1
1 Ω Load Connected to Enabled Device
VIN = 5V
VIN = 5V
TA = +25°C
CL = 22µF
Vflag 1
2V/div
Iout 1
1A/div
TA = +25°C
CL = 22µF
Vflag 1
2V/div
Iout 1
1A/div
2ms/div
2ms/div
Channel 2
1 Ω Load Connected to Enabled Device
Channel 2
2Ω Load Connected to Enabled Device
VIN = 5V
VIN = 5V
TA = +25°C
CL = 22µF
Vflag 2
2V/div
Iout 2
1A/div
TA = +25°C
CL = 22µF
Vflag 2
2V/div
Iout 2
1A/div
2ms/div
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
2ms/div
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 1
Short Circuit with Blanking Time and Recovery
Channel 2
Short Circuit with Blanking Time and Recovery
VIN = 5V
Vout
5V/div
TA = +25°C
VIN = 5V
Vout
5V/div
TA = +25°C
CL = 22µF
CL = 22µF
Vflag
5V/div
Vflag
5V/div
Iout
1A/div
Iout
1A/div
20ms/div
20ms/div
Channel 1 Power On
Channel 2 Power On
Vflag
5V/div
Vflag
5V/div
TA = +25°C
Iout
200mA/div
CL = 22µF
TA=25°C
Iout
200mA/div
CL=22uF
RL=10Ω
RL = 10Ω
Ven
5V/div
Ven
5V/div
Vin
5V/div
Vin
5V/div
1ms/div
1ms/div
Channel 1 UVLO Increasing
Channel 1 UVLO Decreasing
TA = +25°C
Vin
2V/div
TA = +25°C
CL = 22µF
Vin
2V/div
RL= 10Ω
CL = 22µF
RL = 10Ω
Iout
200mA/div
Iout
200mA/div
10ms/div
1ms/div
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 2 UVLO Decreasing
Channel 2 UVLO Increasing
TA = +25°C
Vin
2V/div
TA = +25°C
CL = 22µF
Vin
2V/div
RL = 10Ω
CL = 22µF
RL = 10Ω
Iout
200mA/div
Iout
200mA/div
1ms/div
10ms/div
Channel 1 Enabled and Shorted with Channel 2 Disabled
Channel 1 Disabled and Channel 2 Enabled
Ven1
5V/div
Vout 1
5V/div
Vout 1
5V/div
Vout 2
5V/div
Ven2
5V/div
Vflag 1
5V/div
TA = +25°C
TA = +25°C
CL = 22µF
CL = 22µF
Iout 2
500mA/div
Vout 2
5V/div
100ms/div
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
50ms/div
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Turn-Off Time vs Input Voltage
800
31
700
31
600
Turn-Off Time (us)
Turn-On Time (us)
Turn-On Time vs Input Voltage
500
400
300
CL = 1µF
RL = 10Ω
TA = +25°C
200
100
CL = 1µF
RL = 10Ω
TA = +25°C
30
30
29
29
28
28
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
4
4.5
25
500
24
400
23
Fall Time (us)
600
300
5.5
6
CL = 1µF
200
22
CL = 1µF
21
RL = 10Ω
RL = 10Ω
20
TA = +25°C
100
TA = +25°C
19
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Supply Current, Output Disabled vs Ambient Temperature
Supply Current, Output Enabled vs Ambient Temperature
1.60
60
Supply Current, Output Disabled (uA)
65
Supply Current, Output Enabled (uA)
5
Fall Time vs Input Voltage
Rise Time vs Input Voltage
Rise Time (us)
3.5
Input Voltage (V)
Input Voltage (V)
Vin=5.0V
55
Vin=5.5V
50
45
Vin=2.7V
40
Vin=3.3V
35
Vin=5.5V
1.40
1.20
Vin=5.0V
1.00
0.80
Vin=3.3V
0.60
Vin=2.7V
0.40
0.20
0.00
30
-60
-40
-20
0
20
40
60
80
100
-45
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
-25
-5
15
35
55
75
95
Ambient Temperature (°C)
Ambient Temperature (°C)
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
710
Short-Circuit Output Current (mA)
200
Static Drain-Source On-State
Resistance (mΩ)
190
180
Vin=2.7V
170
Vin=3.3V
160
150
140
130
120
110
Vin=5V
100
-60
-40
-20
0
20
40
60
80
700
Vin=2.7V
690
Vin=3.3V
Vin=5.0V
680
670
660
650
640
Vin=5.5V
630
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
Ambient Temperature (°C)
Threshold Trip Current vs Input Voltage
Undervoltage Lockout vs Ambient Temperature
1.15
2.05
2.03
Threshold Trip Current (A)
Undervoltage Lockout (V)
2.04
UVLO Rising
2.02
2.01
2.00
1.99
UVLO Falling
1.98
1.97
1.14
1.13
1.12
TA = +25°C
CL = 22µF
1.11
1.96
1.10
1.95
-60
-40
-20
0
20
40
60
80
100
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
Current Limit Response vs Peak Current
45
Current Limit Response (us)
40
35
30
25
VIN = 5V
20
TA = +25°C
15
CL = 22µF
10
5
0
2
3
4
5
6
7
8
9
10
Peak Current (A)
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Application Information
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2142/AP2152 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2142/AP2152 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2142/AP2152 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
2
PD = RDS(ON)× I
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2142/AP2152 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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AP2142/ AP2152
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2 Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2142/AP2152, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2142/AP2152 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2142/AP2152 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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May 2014
© Diodes Incorporated
AP2142/ AP2152
Ordering Information
Part Number
Package Code
Packaging
AP21X2SG-13
AP21X2MPG-13
S
MP
SO-8
MSOP-8EP
Quantity
13” Tape and Reel
Part Number Suffix
2500/Tape & Reel
2500/Tape & Reel
-13
-13
Marking Information
(1)
SO-8
( Top view )
8
7
6
5
Logo
Part Number
4 : Active Low
5 : Active High
YY WW X X
2
1
(2)
2 : 2 Channel
G : Green
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
AP21X X
3
4
MSOP-8EP
( Top view )
8
7
Logo
AP21X X
1
Document number: DS31571 Rev. 7 - 2
5
YWXE
Part Number
4 : Active Low
5 : Active High
AP2142/ AP2152
6
2
3
A~Z : Green
MSOP-8EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
2 : 2 Channel
4
14 of 17
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May 2014
© Diodes Incorporated
AP2142/ AP2152
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
(1) Package type: SO-8
E1 E
A1
Gauge Plane
Seating Plane
L
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
Package type: MSOP-8EP
D
4X
10
°
x
E
0.25
D1
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
c
A2
A
D
L
E1
See Detail C
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
15 of 17
www.diodes.com
MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
May 2014
© Diodes Incorporated
AP2142/ AP2152
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
(2)
Package type: MSOP-8EP
X
C
Y
G
Y2
Dimensions
C
G
X
X1
Y
Y1
Y2
Y1
X1
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
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www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
May 2014
© Diodes Incorporated
AP2142/ AP2152
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
17 of 17
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May 2014
© Diodes Incorporated