AP2166/ AP2176 1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2166 and AP2176 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and thermal limiting and short-circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false overcurrent reporting and does not require any external components. ( Top View ) EN1 All devices are available in SO-8 and MSOP-8EP packages. 8 FLG1 2 7 FLG2 3 6 GND EN2 4 5 OUT2 ( Top View ) Dual USB port power switches Overcurrent and thermal protection 1.5A accurate current limiting Reverse Current Blocking 90mΩ on-resistance Input voltage range: 2.7V - 5.5V 0.6ms typical rise time Very low shutdown current: 1µA (max) Fault report (FLG) with blanking time (7ms typ) ESD protection: 6KV HBM, 300V MM Active low (AP2166) or active high (AP2176) enable Ambient temperature range -40°C to +85°C SO-8 and MSOP-8EP (Exposed Pad): Available in “Green” Molding Compound (No Br, Sb) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Notes: IN SO-8 Features OUT1 1 EN1 1 8 OUT1 FLG1 2 7 IN FLG2 3 6 GND EN2 4 5 OUT2 MSOP-8EP Applications Consumer Electronics – LCD TVs & Monitors, Game Machines Communications – Set-Top-Boxes, GPS, Smartphones Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit Power Supply 2.7V to 5.5V IN 10k 10k 10uF OFF AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 0.1uF 68uF 0.1uF 68uF 0.1uF FLG1 FLG2 ON Load OUT1 EN1 EN2 OUT2 Load GND 1 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Available Options Part Number Channel Enable Pin (EN) Current Limit (typ) Recommended Maximum Continuous Load Current AP2166 AP2176 2 2 Active Low Active High 1.5A 1.5A 1.0A 1.0A Pin Descriptions Pin Name EN1 FLG1 FLG2 EN2 OUT2 GND IN OUT1 Exposed Pad Pin Number SO-8 MSOP-8EP 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 — Function Switch 1 enable input, active low (AP2166) or active high (AP2176) Switch 1 over-current and over-temperature fault report, open-drain Switch 2 over-current and over-temperature fault report, open-drain Switch 2 enable input, active low (AP2166) or active high (AP2176) Switch 2 voltage output pin Ground Voltage input pin Switch 1 voltage output pin Exposed Pad: Exposed Pad It should be connected externally to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram FLG1 Thermal Sense Deglitch EN1 Driver Current Limit GND UVLO CS OUT1 CS OUT2 Reverse blocking IN Reverse blocking UVLO EN2 FLG2 Driver Current Limit Deglitch Thermal Sense AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 GND 2 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM Rating Unit 6 300 kV V 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V Internal Limited A +150 °C -65 to +150 °C VIN ILOAD TJ(MAX) TST Note: Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 4) 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Units 2.7 5.5 V Output Current 0 1.0 A VIL Low-Level Input Voltage on EN or EN 0 0.8 V VIH High-Level Input Voltage on EN or EN TA Operating Ambient Temperature VIN Input Voltage IOUT AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 3 of 17 www.diodes.com 2 VIN V -40 +85 C May 2016 © Diodes Incorporated AP2166/ AP2176 Electrical Characteristics Symbol (@TA = +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.) Parameter Test Conditions Min Typ Max Unit 1.6 1.9 2.5 V Disabled, IOUT = 0 - 0.5 1 µA Enabled, IOUT = 0 - 95 140 µA Input Leakage Current Disabled, OUT grounded - - 1 µA Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN - 1 - µA - 90 100 135 135 mΩ mΩ VUVLO Input UVLO RLOAD = 1kΩ ISHDN Input Shutdown Current Input Quiescent Current, Dual ILEAK IREV IQ VIN = 5V, IOUT = 1A, -40°C ≤ TA ≤ +85°C MSOP-8EP SO-8 RDS(ON) Switch On-Resistance VIN = 3.3V, IOUT = 1A, -40°C ≤ TA ≤ +85°C - 120 160 mΩ ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 68µF - 1.5 - A Overload Current Limit VIN = 5V, VOUT = 4.8V, CL = 120µF, -40°C ≤ TA ≤ +85°C 1.1 1.5 1.9 A 2.0 - A ILIMIT Current Limiting Trigger Threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF - TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 68µF - 20 - µs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V - - 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 - - V ISINK ITrig EN Input Leakage VEN = 5V - - 1 µA TD(ON) Output Turn-on Delay Time CL=1µF, RLOAD = 10Ω - 0.05 - ms TR Output Turn-on Rise Time CL=1µF, RLOAD = 10Ω - 0.6 1.5 ms TD(OFF) Output Turn-off Delay Time CL=1µF, RLOAD = 10Ω - 0.01 - ms ms Output Turn-off Fall Time CL=1µF, RLOAD = 10Ω - 0.05 0.1 RFLG FLG Output FET on-Resistance IFLG =10mA - 20 40 Ω IFOH Error Flag Iff Current VFLG = 5V - 0.01 1 µA TBlank FLG Blanking Time CL = 68µF 4 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ - +140 - C THYS Thermal Shutdown Hysteresis - - +25 - C - 110 60 - °C/W °C/W TF θJA Notes: SO-8 (Note 5) Thermal Resistance Junction-to-Ambient MSOP-8EP (Note 6) 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane. AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 4 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics VEN 50% TD(ON) 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% TD(ON) 90% VOUT 10% TF 90% 10% 90% 10% Figure 1 Voltage Waveforms: AP2166 (left), AP2176 (right) All Enable Plots are for AP2176 Active High Ven 1 5V/div Ven 1 5V/div Vout 1 2V/div Vout 1 2V/div CL=1µF TA= +25°C RL=10Ω CL=1µF TA= +25°C RL=10Ω 500µs/div Channel 1 Turn-On Delay and Rise Time AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 500µs/div Channel 1 Turn-Off Delay and Fall Time 5 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (continued) Ven 2 5V/div Ven 2 5V/div Vout 2 2V/div Vout 2 2V/div CL=1µF TA= +25°C RL=10Ω CL=1µF TA= +25°C RL=10Ω 500µs/div Channel 2 Turn-Off Delay and Fall Time 500µs/div Channel 2 Turn-On Delay and Rise Time Ven 1 5V/div Ven 1 5V/div CL=100µF Vout 1 2V/div TA= +25°C Vout 1 2V/div RL=10Ω CL=100µF TA= +25°C RL=10Ω 500µs/div Channel 1 Turn-Off Delay and Fall Time 500µs/div Channel 1 Turn-On Delay and Rise Time Ven 2 5V/div Ven 2 5V/div CL=100µF TA= +25°C Vout 2 2V/div Vout 2 2V/div RL=10Ω CL=100µF TA= +25°C RL=10Ω 500µs/div Channel 2 Turn-Off Delay and Fall Time 500µs/div Channel 2 Turn-On Delay and Rise Time AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 6 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (cont.) Ven 1 5V/div Ven 2 5V/div Iout 1 500mA/div Iout 2 500mA/div VIN=5V VIN=5V TA= +25°C TA= +25°C CL=68µF CL=68µF 500µs/div Channel 1 Short Circuit Current, Device Enabled Into Short Ven 1 5V/div 500µs/div Channel 2 Short Circuit Current, Device Enabled Into Short Ven 2 5V/div CL=100µF CL=100µF VIN=5V VIN=5V TA= +25°C TA= +25°C RL=5Ω RL=5Ω Iout 1 200mA/div Iout 2 200mA/div CL=470µF CL=470µF CL=220µF CL=220µF 1ms/div Channel 2 Inrush Current 1ms/div Channel 1 Inrush Current VIN=5V TA= +25°C Vflag 1 2V/div CL=68µF Iout 1 1A/div VIN=5V TA= +25°C Vflag 1 2V/div CL=68µF Iout 1 1A/div 2ms/div Channel 1 1Ω Load Connected to Enabled Device AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 2ms/div Channel 1 2Ω Load Connected to Enabled Device 7 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (cont.) VIN=5V TA= +25°C Vflag 2 2V/div CL=68µF VIN=5V TA= +25°C Vflag 2 2V/div CL=68µF Iout 2 1A/div Iout 2 1A/div 2ms/div Channel 2 2Ω Load Connected to Enabled Device 2ms/div Channel 2 1Ω Load Connected to Enabled Device Vout 5V/div VIN=5V TA= +25°C Vout 5V/div VIN=5V TA= +25°C CL=68µF CL=68µF Iout 500mA/div Vflag 5V/div Iout 1A/div Iout 1A/div 20ms/div Channel 1 Short Circuit with Blanking Time and Recovery 20ms/div Channel 2 Short Circuit with Blanking Time and Recovery Vflag 5V/div Vflag 5V/div Iout 500mA/div TA= +25°C Iout 500mA/div TA= +25°C CL=68µF CL=68µF RL=5Ω RL=5Ω Ven 5V/div Ven 5V/div Vin 5V/div Vin 5V/div 1ms/div Channel 2 Power On 1ms/div Channel 1 Power On AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 8 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (cont.) TA= +25°C Vin 2V/div CL=68µF Vin 2V/div RL=5Ω TA= +25°C CL=68µF RL=5Ω Iout 500mA/div Iout 500mA/div 10ms/div Channel 1 UVLO Decreasing 1ms/div Channel 1 UVLO Increasing TA= +25°C Vin 2V/div CL=68µF Vin 2V/div RL=5Ω TA= +25°C CL=68µF RL=5Ω Iout 500mA/div Iout 500mA/div 10ms/div Channel 2 UVLO Decreasing 1ms/div Channel 2 UVLO Increasing Vout 1 5V/div Ven1 5V/div Vout 2 5V/div Vflag 1 5V/div Vout 1 5V/div TA= +25°C Ven2 5V/div Iout 2 500mA/div Vout 2 5V/div 100ms/div Channel 1 Enabled and Shorted with Channel 2 Disabled AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 TA= +25°C CL=68µF CL=68µF 50ms/div Channel 1 Disabled and Channel 2 Enabled 9 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (cont.) Turn-Off Time vs Input Voltage 750 30 700 29 CL=1µF 650 29 RL=10Ω 28 TA= +25°C Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 600 550 500 450 28 27 27 400 CL=1µF 350 RL=10Ω 26 300 TA= +25°C 26 25 250 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Fall Time vs Input Voltage Rise Time vs Input Voltage 22 650 600 22 Fall Time (us) Rise Time (us) 550 500 450 400 CL=1µF 350 RL=10Ω 300 TA= +25°C 21 21 CL=1µF 20 RL=10Ω 20 TA= +25°C 19 250 2 2.5 3 3.5 4 4.5 5 5.5 2 6 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 63 Supply Current, Output Disabled (uA) Supply Current, Output Enabled (uA) 68 Vin=5.0V 58 Vin=5.5V 53 48 43 38 Vin=3.3V 33 Vin=2.7V Vin=5.5V 0.8 Vin=3.3V 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Vin=2.7V 0.0 28 -60 -40 -20 0 20 40 60 80 100 -60 Document number: DS31814 Rev. 4 - 2 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) AP2166/ AP2176 Vin=5.0V 10 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Typical Performance Characteristics (cont.) Short-Circuit Output Current vs Ambient Temperature Static Drain-Source On-State Resistance vs Ambient Temperature 1.56 Short-Circuit Output Current (A) 170 Static Drain-Source On-State Resistance (mΩ) Vin=2.7V 160 150 140 130 Vin=3.3V 120 110 100 Vin=5V 90 80 1.55 CL=100µF 1.54 Vin=3.3V Vin=2.7V 1.53 Vin=5.0V 1.52 1.51 1.50 1.49 1.48 1.47 1.46 Vin=5.5V 1.45 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.99 2.20 Threshold Trip Current (A) Undervoltage Lockout (V) 1.98 2.10 2.00 UVLO Rising 1.90 1.80 UVLO Falling 1.70 1.97 1.96 1.95 1.94 1.93 1.92 TA= +25°C 1.91 CL=68µF 1.90 1.89 1.88 1.60 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) Current Limit Response vs Peak Current Current Limit Response (us) 120 100 80 VIN=5V 60 TA= +25°C CL=68µF 40 20 0 0 2 4 6 8 10 12 Peak Current (A) AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 11 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Application Information Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Overcurrent and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2166/AP2176 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2166/AP2176 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both overcurrent and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2166/AP2176 is designed to eliminate false overcurrent reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA= Ambient temperature C RθJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2166/AP2176 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an overcurrent or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or overcurrent occurs with 7-ms deglitch. AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 12 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Application Information (continued) Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Downstream USB Ports Power Supply 3.3V 5V D+ DVBUS AP2166 IN OUT1 0.1uF USB Controller 0.1uF FLG1 EN1 FLG2 EN2 68uF D+ DVBUS OUT2 GND GND 0.1uF 68uF GND Figure 2 Typical Two-Port USB Host/ Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2166/AP2176, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2166/AP2176 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2166/AP2176 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 13 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Ordering Information AP 21 X 6 XX G - 13 Enable Channel Package Green Packing 6 : Active Low 7 : Active High 6 : 2 Channel S : SO-8 MP : MSOP-8EP G : Green 13 : Tape & Reel Part Number Package Code Packaging AP21X6SG-13 AP21X6MPG-13 S MP SO-8 MSOP-8EP Quantity 13” Tape and Reel Part Number Suffix 2,500/Tape & Reel 2,500/Tape & Reel -13 -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 6 : Active Low 7 : Active High YY WW X X 1 (2) 6 : 2 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 2 3 4 MSOP-8EP AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 14 of 17 www.diodes.com May 2016 © Diodes Incorporated AP2166/ AP2176 Package Outline Dimensions (All dimensions in mm.) Please see http://www.diodes.com/package-outlines.html for the latest version. 0.254 (1) Package type: SO-8 E1 E Gauge Plane Seating Plane A1 L Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D (2) SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm Package type: MSOP-8EP D 4X 10 ° 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 15 of 17 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm May 2016 © Diodes Incorporated AP2166/ AP2176 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 16 of 17 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 May 2016 © Diodes Incorporated AP2166/ AP2176 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com AP2166/ AP2176 Document number: DS31814 Rev. 4 - 2 17 of 17 www.diodes.com May 2016 © Diodes Incorporated