AP2101/AP2111 2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments ( Top View ) The AP2101 and AP2111 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap GND 1 applications. The family of devices complies with USB 2.0 and IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time, under-voltage lockout and auto-discharge functionalities. A 7ms deglitch capability on the open-drain Flag output prevents false SO-8 over-current reporting and does not require any external components. All devices are available in SO-8 and MSOP-8EP packages. ( Top View ) Features • 8 NC Single USB port power switches with auto-discharge GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG • Short-circuit current and thermal protection • 2.45A accurate current limiting • • Fast transient response time: 5μs 90mΩ on-resistance • Reverse Current Blocking • Input voltage range: 2.7V – 5.5V • Consumer electronics – LCD TV & Monitor, Game Machines • 0.6ms typical rise time • Communications – Set-Top-Box, GPS, Smartphone • MSOP-8EP Applications • Very low shutdown current: 1μA (max) • Fault report (FLG) with blanking time (7ms typ) • ESD protection: 4kV HBM, 300V MM • Active low (AP2101) or active high (AP2111) enable • Ambient temperature range: -35°C to 85°C • Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB SO-8 and MSOP-8EP (Exposed Pad): Available in “Green” Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) • UL Recognized, File Number E322375 • IEC60950-1 CB Scheme Certified Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit AP2111 Enable Active High IN Power Supply 2.7V to 5.5V 10k 10uF Load OUT 0.1uF 0.1uF 120uF FLG ON EN GND OFF AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 1 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Available Options Part Number Channel AP2101 AP2111 1 1 Enable Pin (EN) Active Low Active High Current Limit (Typical) 2.45A 2.45A Recommended Maximum Continuous Load Current 2.0A 2.0A Pin Descriptions Pin Number Pin Name GND IN EN FLG OUT NC SO-8 1 2, 3 4 5 6, 7 8 MSOP-8EP 1 2, 3 4 5 6, 7 8 Exposed tab — Exposed tab Functions Ground Voltage input pin (all IN pins must be tied together externally) Enable input, active low (AP2101) or active high (AP2111) Over-current and over-temperature fault report; open-drain flag is active low when triggered Voltage output pin (all OUT pins must be tied together externally) No internal connection; recommend tie to OUT pins Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram Current Sense IN Discharge Control UVLO Driver EN OUT Current Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN Input Voltage Ratings 4 300 Units kV V 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V ILOAD TJ(MAX) TST Caution: Note: Parameter Human Body Model ESD Protection Machine Model ESD Protection Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 4) Internal Limited A 150 °C -65 to +150 °C Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices 4. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C) AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 2 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input voltage IOUT Output Current Min Max Units 2.7 5.5 V 0 2.0 A -35 85 °C EN Input Logic Low Voltage 0 0.8 V EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature VIL VIH Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Symbol Parameter Test Conditions (Note 5) Min Typ Max 1.6 1.9 2.5 V Disabled, IOUT = 0 0.5 1 µA 45 70 µA 1 µA VUVLO Input UVLO RLOAD = 1kΩ ISHDN Input Shutdown Current IQ Input Quiescent Current Enabled, IOUT = 0 ILEAK Input Leakage Current Disabled, OUT grounded IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN RDS(ON) Switch On-Resistance VIN = 5V, IOUT = 1.5A TA = +25°C 0.05 MSOP8-EP SO-8 90 95 VIN = 3.3V, IOUT = 1.5A µA 115 115 140 -40°C ≤ TA ≤ +85°C 115 TA = 25°C Unit mΩ 140 170 -40°C ≤ TA ≤ +85°C ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, CL=120µF ITRIG Current Limiting Trigger Threshold Output Current Slew rate (<100A/s) , CL = 100µF 2.5 A Short-Circuit Current Limit Enabled into short circuit, CL = 100µF 2.5 A ISHORT 2.1 2.45 TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output) VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V EN Input leakage VEN = 5V TD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω 50 TR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω 0.6 TD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω 4 Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω FLG Output FET On-Resistance IFLG =10mA, CL=100µF ISINK TF RFLG 2.8 5 µs 0.8 V 1 µA 1.5 ms 0.03 0.1 ms 20 40 Ω 7 15 ms 2 V µs µs FLG Blanking Time CIN = 10µF, CL = 100µF RDIS Discharge Resistance (Note 6) VIN = 5V, disabled, IOUT = 1mA 290 Ω TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ 140 °C THYS Thermal Shutdown Hysteresis 25 °C SO-8 (Note 7) 110 °C/W MSOP-8EP (Note 8) 60 °C/W TBLANK θJA Notes: Thermal Resistance Junction-toAmbient 4 A 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than 8mA. 7. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 8. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 3 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Typical Performance Characteristics VEN 50% TD(ON) TF TD(ON) 90% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT 10% 90% 10% 90% 10% Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right) All Enable Plots are for AP2111 Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div Vout 2V/div CL = 1µF CL = 1µF TA = 25°C TA = +25°C RL = 5Ω RL = 5Ω 400µs/div 400µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div Vout 2V/div CL = 100µF TA = +25°C CL = 100µF RL = 5Ω TA = +25°C RL = 5Ω 400µs/div 400µs/div AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 4 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Typical Performance Characteristics (cont.) Short Circuit Current, Device Enabled Into Short Inrush Current Ven 5V/div Ven 5V/div CL=100µF Iout 500mA/div VIN = 5V Iout 500mA/div CL=470µF VIN = 5V TA = +25°C RL = 2.5Ω CL=220µF TA = +25°C CL = 100µF 1ms/div 500us/div 0.6 Ω Load Connected to Enabled Device Short Circuit with Blanking Time and Recovery VIN = 5V TA = +25°C CL = 100µF Vflag 5V/div VIN = 5V TA = +25°C Vout 5V/div CL = 100µF Vflag 5V/div Iout 1A/div Iout 2A/div 2ms/div 50ms/div Power On Power Off TA = +25°C Vflag 5V/div CL = 100µF Vflag 5V/div RL = 2.5Ω Iout 1A/div Iout 1A/div Vin 5V/div Vin 5V/div Vout 5V/div TA = +25°C CL = 100µF Vout 5V/div RL = 2.5Ω 1ms/div AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 10ms/div 5 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Typical Performance Characteristics (cont.) Device Disabled Device Enabled Vflag 5V/div Vflag 5V/div TA = +25°C VIN = 5V Iout 1A/div VIN = 5V Iout 1A/div TA = +25°C CL = 100µF RL = 2.5Ω CL = 100µF RL = 2.5Ω Ven 5V/div Ven 5V/div Vout 5V/div Vout 5V/div 1ms/div 1ms/div UVLO Increasing UVLO Decreasing TA = +25°C CL = 100µF RL = 2.5Ω Vin 2V/div Vin 2V/div Iout 500mA/div Iout 500mA/div TA = +25°C CL = 100µF 1ms/div 10ms/div Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 850 55 750 50 Turn-Off Time (us) Turn-On Time (us) RL = 2.5Ω 650 550 450 CL = 1µF RL = 10Ω 350 CL = 1µF RL = 10Ω 45 TA = +25°C 40 35 30 TA = +25°C 250 25 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 Input Voltage (V) AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) 6 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Typical Performance Characteristics (cont.) Fall Time vs Input Voltage Rise Time vs Input Voltage 650 25 600 24 Fall Time (us) Rise Time (us) 550 500 450 CL = 1µF 400 22 CL = 1µF 21 RL = 10Ω RL = 10Ω 20 TA = +25°C 350 23 TA = +25°C 19 300 2 2.5 3 3.5 4 4.5 5 5.5 2 6 2.5 3 3.5 0.9 Supply Current, Output Disabled (uA) 52 47 Vin=5.5V 42 37 32 4.5 5 5.5 6 Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Enabled (uA) 4 Input Voltage (V) Input Voltage (V) Vin=5.0V Vin=3.3V 27 Vin=5.5V 0.8 Vin=5.0V 0.7 0.6 Vin=3.3V 0.5 0.4 0.3 0.2 0.1 0.0 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 80 100 Ambient Temperature (°C) Short-Circuit Output Current vs Ambient Temperature Static Drain-Source On-State Resistance vs Ambient Temperature Static Drain-Source On-State Resistance (mΩ) Short-Circuit Output Current (A) 2.70 140 Vin=3.3V 130 120 110 100 90 Vin=5.0V 80 CL = 120µF 2.65 Vin=3.3V 2.60 2.55 2.50 Vin=5.0V 2.45 2.40 2.35 2.30 70 -60 -40 -20 0 20 40 60 80 100 AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 -60 -40 -20 0 20 40 60 Ambient Temperature (°C) Ambient Temperature (°C) 7 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Typical Performance Characteristics (cont.) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 3.24 2.15 Threshold Trip Current (A) Undervoltage Lockout (V) 3.22 2.10 UVLO Rising 2.05 2.00 UVLO Falling 1.95 3.20 3.18 3.16 TA = +25°C 3.14 CL = 68µF 3.12 3.10 1.90 3.08 -60 -40 -20 0 20 40 60 80 100 2.8 Ambient Temperature (°C) 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Current Limit Response vs Peak Current Current Limit Response (us) 45 40 VIN = 5V 35 TA = +25°C 30 25 20 15 10 5 0 0 2 4 6 8 10 12 Peak Current (A) AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 8 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Application Information Power Supply Considerations A 0.1-μF to 1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2101/AP2111 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2101/AP2111 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. At low input voltage condition (VIN < 3V), the short circuit protection current may rise as high as twice the typical value. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2101/AP2111 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA= Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 9 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/AP2111 Application Information (cont.) Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2101/AP2111 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2101/AP2111, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2101/AP2111 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2101/AP2111 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 10 of 14 www.diodes.com January 2013 © Diodes Incorporated AP2101/A AP2111 O Ordering In nformation n mber Part Num Package P Code Packagin ng AP21X1S SG-13 AP21X1MP PG-13 S MP SO-8 MSOP-8E EP 13” Tape an nd Reel Quantity y Part Numb ber Suffix 2500/Tape & Reel -13 2500/Tape & Reel -13 M Marking Infformation (1) SO-8 ( Top p View ) 8 7 6 5 1 : 1 Chan nnel YY : Yearr : 08, 09,10~ WW : Week : 01~52; 52 2 representts 52 and 53 week w X : Interna al Code G : Green n Logo Partt Number 6 : Active A Low 7 : Active A High AP21 1X X D YY WW W XX 1 2 3 4 EP (2) MSOP-8E ( Top View V ) 8 7 Logo AP21X X D 1 Document numberr: DS32015 Rev. 3 - 2 5 YWXE Parrt Number 6 : Active A Low 7 : Active A High AP2101/AP2 2111 6 2 3 A~Z : Green n MSOP-8-EP P Y : Year : 0~ ~9 W : Week : a~z : 1~26 week; A~Z : 27~52 2 week; Z reprresents 52 and 53 week w 1 : 1 Channel 4 11 of 14 www.diodes.com w January 2013 © Diodes Incorporate ed AP2101/AP2111 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 0.254 (1) SO-8 E1 E A1 Gauge Plane Seating Plane L Detail ‘A’ h 7°~9° 45° Detail ‘A’ A2 A A3 SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0° 8° θ All Dimensions in mm b e D (2) MSOP-8EP D 4X 10 ° x E 0.25 D1 E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 c A2 A D L E1 See Detail C AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 12 of 14 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm January 2013 © Diodes Incorporated AP2101/AP2111 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) MSOP-8-EP X C G Y2 Y Dimensions Y1 C G X X1 Y Y1 Y2 X1 AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 13 of 14 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 January 2013 © Diodes Incorporated AP2101/AP2111 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2101/AP2111 Document number: DS32015 Rev. 3 - 2 14 of 14 www.diodes.com January 2013 © Diodes Incorporated