Green AP2145/ AP2155 0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2145 and AP2155 are integrated high-side power switches SO-8 optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and EN 1 8 OUT FLG 2 7 IN GND 3 6 OUT NC 4 5 NC available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SO-8 and MSOP-8EP packages. (Top View) Features MSOP-8EP Single USB Port Power Switches Over-Current and Thermal Protection 0.8A Accurate Current Limiting Reverse Current Blocking EN 1 8 OUT FLG 2 7 IN GND 3 6 OUT NC 4 5 NC 90mΩ On-Resistance Input Voltage Range: 2.7V - 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (max) Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 6kV HBM, 400V MM Active High (AP2155) or Active Low (AP2145) Enable Ambient Temperature Range -40°C to +85°C Consumer electronics – LCD TV & Monitor, Game Machines SO-8 and MSOP-8EP (Exposed Pad): Available in “Green” Communications – Set-Top-Box, GPS, Smartphone Molding Compound (No Br, Sb) (Top View) Applications Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Notes: Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit IN Power Supply 2.7V to 5.5V 10k 10uF OUT Load 0.1uF 0.1uF 120uF FLG EN ON GND OFF AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 1 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Available Options Part Number Channel AP2145 AP2155 1 1 Enable Pin (EN) Active Low Active High Current Limit (typ) 0.8A 0.8A Recommended Maximum Continuous Load Current 0.5A 0.5A Pin Descriptions Pin Name Pin Number EN FLG GND NC OUT IN SO-8 1 2 3 4, 5 6, 8 7 Exposed Pad — MSOP-8EP 1 2 3 4, 5 6, 8 7 Function Enable input, active low (AP2145) or active high (AP2155) Over-current and over-temperature fault report; open-drain flag is active low when triggered. Ground No internal connection Voltage output pin (all OUT pins must be tied together externally) Voltage input pin Exposed Pad: Exposed Pad It should be externally connected to GND plane and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram AP2145, AP2155 IN Current Sense OUT Current Limit FLG UVLO EN Driver Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM Parameter Human Body Model ESD Protection Machine Model ESD Protection Ratings 6 400 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V VIN ILOAD TJ(MAX) TST Input Voltage Unit kV V Maximum Continuous Load Current Internal Limited A 150 °C -65 to +150 °C Maximum Junction Temperature Storage Temperature Range (Note 4) Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 2 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol VIN Parameter Min Max Unit 2.7 5.5 V Input voltage IOUT Output Current 0 500 mA VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2.0 VIN V TA Operating Ambient Temperature -40 85 C Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ. Max Unit 1.6 1.9 2.5 V VUVLO Input UVLO ISHDN Input Shutdown Current Disabled, OUT = open 0.5 1 µA IQ Input Quiescent Current Enabled, OUT = open 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded 1 µA IREV Reverse Leakage Current Disabled, VIN= 0V, VOUT= 5V, IREV at VIN 1 RDS(ON) Switch On-Resistance MSOP-8EP VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C SO-8 90 95 140 140 mΩ mΩ VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C 120 160 mΩ ISHORT Short-Circuit Current Limit Enabled into short circuit, CIN =10µF, CL = 100µF 0.7 ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, CIN =10µF, CL = 100µF, -40°C ≤ TA ≤ +85°C ITRIG Current Limiting Trigger Threshold Output Current Slew rate (<100A/s), CIN = 10µF, CL = 22µF 1.0 A TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 100µF 10 µs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V EN Input Leakage Output Leakage Current ISINK IO-LEAK RLOAD = 1kΩ -1 0.6 0.8 µA A 1.0 0.8 V VEN = 5V 1 µA Disabled 1 µA 2 V TD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω 0.05 TR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω 0.6 TD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω 0.01 ms 1.5 Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω 0.05 0.1 FLG Output FET On-Resistance VIN = 3.3V or 5V, CIN = 10µF, IFLG = 10mA 20 40 IFLG FLG Leakage Current VFLG = 5V 1 TBlLANK FLG Blanking Time VIN = 3.3V or 5V, CIN = 10µF, CL = 100µF TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ THYS Thermal Shutdown Hysteresis θJA Notes: Thermal Resistance Junction-toAmbient 4 7 ms ms RFLG TF A ms Ω µA 15 ms 135 C 25 C SO-8 (Note 5) 110 C/W MSOP-8EP (Note 6) 60 C/W 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 3 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Typical Performance Characteristics VEN 50% TD(ON) TD(ON) 90% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT 10% TF 90% 10% 90% 10% Figure 1. Voltage Waveforms: AP2145 (left), AP2155 (right) All Enable Plots are for AP2155 Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div Vout 2V/div CL=1µF CL=1µF TA= +25°C TA= +25°C RL=10Ω RL=10Ω 500µs/div 500µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time Ven 5V/div Ven 5V/div Vout 2V/div Vout 2V/div CL=100µF CL=100µF TA= +25°C TA= +25°C RL=10Ω 500µs/div AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 RL=10Ω 500µs/div 4 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Typical Performance Characteristics (cont.) Short Circuit Current, Device Enabled Into Short Inrush Current CL=100µF Ven 5V/div Ven 5V/div Iout 200mA/div VIN=5V TA= +25°C RL=10Ω Iin 200mA/div VIN= 5V TA= +25°C CL=470µF CL=220µF CL=100µF 500µs/div 1ms/div 3 Ω Load Connected to Enabled Device 2 Ω Load Connected to Enabled Device VIN=5V TA= +25°C CL=100µF Vflag 2V/div VIN=5V TA= +25°C CL=100µF Vflag 2V/div Iout 500mA/div Iout 500mA/div 2ms/div 2ms/div Short Circuit with Blanking Time and Recovery Power On Vflag 5V/div Vout 5V/div Vflag 5V/div VIN=5V TA= +25°C CL=100µF Iout 1A/div TA= +25°C CL=100µF RL=10Ω Iout 200mA/div Vin 5V/div Vout 5V/div 50ms/div AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 1ms/div 5 of 13 www.diodes.com Vout 5V/div March 2013 © Diodes Incorporated AP2145/ AP2155 Typical Performance Characteristics (cont.) Power Off Device Enabled TA= +25°C CL=100µF RL=10Ω Vflag 5V/div Iout 200mA/div Vflag 5V/div Iout 200mA/div Vin 5V/div Ven 5V/div Vout 5V/div Vout 5V/div TA= +25°C CL=100µF RL=10Ω 10ms/div 1ms/div Device Disabled UVLO Increasing Vflag 5V/div TA= +25°C CL=100µF RL=10Ω Vin 2V/div TA= +25°C CL=100µF RL=10Ω Iout 200mA/div Ven 5V/div Iout 200mA/div Vout 5V/div 1ms/div 1ms/div UVLO Decreasing TA= +25°C CL=100µF RL=10Ω Vin 2V/div Iout 200mA/div 10ms/div AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 6 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Typical Performance Characteristics (cont.) Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 500 400 300 200 CL=1µF RL=10Ω TA= +25°C 100 30 CL=1µF RL=10Ω TA= +25°C 30 29 29 28 28 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 4 4.5 5 5.5 6 5.5 6 Fall Time vs Input Voltage Rise Time vs Input Voltage 600 25 500 24 400 23 Fall Time (us) Rise Time (us) 3.5 Input Voltage (V) Input Voltage (V) 300 CL=1µF RL=10Ω TA= +25°C 200 22 CL=1µF RL=10Ω TA= +25°C 21 20 100 19 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 Input Voltage (V) Input Voltage (V) Supply Current, Output Disabled vs Ambient Temperature Vin=5.5V Vin=5.0V Vin=3.3V Supply Current, Output Disabled (uA) 1.60 Vin=5.5V 1.40 1.20 Vin=5.0V 1.00 Vin=3.3V 0.80 0.60 Vin=2.7V 0.40 0.20 0.00 -45 -25 -5 15 35 55 75 95 Ambient Temperature (°C) AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 7 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Typical Performance Characteristics (cont.) Static Drain-Source On-State Resistance vs Ambient Temperature Short-Circuit Output Current vs Ambient Temperature 750 Short-Circuit Output Current (A) Static Drain-Source On-State Resistance (mΩ) 145 Vin=3.3V 135 125 115 105 95 85 75 745 Vin=3.3V 740 735 730 Vin=5V 725 Vin=5V 720 65 -60 -40 -20 0 20 40 60 80 -60 100 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Ambient Temperature (°C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.15 2.05 Threshold Trip Current (A) Undervoltage Lockout (V) 2.04 2.03 UVLO Rising 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA= +25°C CL=22µF 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) Current Limit Response vs Peak Current 45 Current Limit Response (us) 40 35 30 VIN=5V 25 TA= +25°C 20 CL=22µF 15 10 5 0 2 3 4 5 6 7 8 9 10 Peak Current (A) AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 8 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Application Information Power Supply Considerations A 0.1-μF to 1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2145/AP2155 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2145/AP2155 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2145/AP2155 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA= Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2145/AP2155 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 9 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2145/AP2155, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2145/AP2155 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2145/AP2155 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. Ordering Information AP 21 X 5 XX G - 13 Channel Package Green Packing 5 : 1 Channel S : SO-8 MP : MSOP-8EP G : Green 13 : Tape & Reel Enable 4 : Active Low 5 : Active High Part Number Package Code Packaging AP21X5SG-13 S SO-8 Quantity 2500/Tape & Reel AP21X5MPG-13 MP MSOP-8EP 2500/Tape & Reel 13” Tape and Reel Part Number Suffix -13 -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 4 : Active Low 5 : Active High YY WW X X 1 AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 5 : 1 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 2 3 4 10 of 13 www.diodes.com March 2013 © Diodes Incorporated AP2145/ AP2155 Marking Information (cont.) (2) MSOP-8EP Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 0.254 (1) Package Type: SO-8 E1 E Gauge Plane Seating Plane A1 L Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D (2) SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm Package Type: MSOP-8EP D 4X 10 ° 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 11 of 13 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm March 2013 © Diodes Incorporated AP2145/ AP2155 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package Type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 12 of 13 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 March 2013 © Diodes Incorporated AP2145/ AP2155 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2145/ AP2155 Document number: DS32031 Rev. 3 - 2 13 of 13 www.diodes.com March 2013 © Diodes Incorporated