MOST All Members Meeting Frankfurt 31 March 2009 Frankfurt DownloadLink 5576

Piet De Pauw
Melexis Opto Datacom
March 31, 2009
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
150 Mbps FOT's Compatible with
Leadfree SMD solder processes
MLX75603
“Heaven” FOT MLX75605
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“Heaven” Receiver
“Heaven” pigtail
for Receiver
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SP4 Eye Mask checked over
Complete Temperature range -40C to +95C OK
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SP4 Eye Mask checked
and over the complete Light Intensity Range
OK
SP4 Jitter spec checked
the Complete Temperature range -40C to +95C
OK
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Spec SP4: max jitter is
230 ps RMS
“Heaven” Transmitter
(RC)LED
MLX75604
“Heaven” FOT MLX75605
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“Heaven” pigtail
for Transmitter
Issue 1: Peaking in
order to reduce rise
time
Issue 2: Increase
drive current with
temperature
MLX75605AA Optical power over temperature into 1mm PMMA SI POF
0
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
-1
Optical power (dB)
-2
-3
-4
-5
-6
-7
Trimmed optical power
Untrimmed optical power
-8
Temperature (degC)
80
90
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Driving (RC)LEDs
100
Transmitter SP2 Overshoot Mask
Rise time: min 1.0ns
max: 1.4ns
MOST specification: 0.5UI=3.391ns/2=1.6955ns
in the worst case (48kHz frame speed)
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OK
Transmitter SP2 Undershoot Mask
Fall time: min 0.7ns
max: 1.6ns
MOST specification: 0.5UI=3.391ns/2=1.6955ns
in the worst case (48kHz frame speed)
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OK
Transmitter SP2 Eye Mask
Time base: 424ps/div
Transmitter eye diagram obtained with MOST worst case
pattern
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OK
OK
Spec Requirement:
Extinction Ratio min 10
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Transmitter Extinction Ratio
OK
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Transmitter Jitter
Spec SP2: max jitter is 112 ps RMS
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Transmitter -3 dB function
“Heaven” FOT MLX75605
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
“Heaven” Package
Use of SMD package for FOTs results in
reduced cost of ownership, since the
following steps can be omitted:
- Manual insertion of the FOT
- Separate wave soldering step for
soldering the FOTs.
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Why is a surface mountable FOT important?
Picking and Placing the “Heaven” Package
This allows the device to
be handled by the
vacuum pick-up head
of standard automated
pick & place SMD
machines.
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Flat surface area on top
has a length larger
than 6 mm.
Leadfree Reflow Soldering the “Heaven” Package
Moisture Sensitivity Level:
Already demonstrated: MSL3
(84 devices in test, no fails)
Planned tests: MSL2a and MSL2
10 to 30 s
245 °C
<3 °C/s
217 °C
200 °C
<6 °C/s
60 to 150 s
150 °C
60 to 180 s
<8 min
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
MLX75605 withstands lead free SMD assembly processes according IPC/JEDEC J-STD020B
i.e. withstands 245 oC +0 oC/-5 oC during at least 30 sec
In order to protect
devices during the
soldering process,
devices are delivered
with a kapton tape
on the top.
Kapton tape can be
easily removed
before ferrule
insertion.
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
Leadfree Reflow Soldering the “Heaven” Package
Material
TCE
below Tg (for epoxies)
Silicon
2.6 ppm/C
Cu Leadframe
16.5 ppm/C
Pure epoxy without filler
64 to 67 ppm/C (*)
Black Epoxy (standard amount
of filler)
Depending on the molding
compound: alfa1 =
7 to 20 ppm/C
Clear Epoxy with micron size
glass filler
52 ppm/C (30% filler) (**)
43 ppm/C (50% filler) (**)
35 ppm/C (70% filler) (**)
Clear Epoxy with nanopartcles
filler
58 ppm/C (20% filler)
52 ppm/C (30% filler =max)
(*) http://www1.nitto.co.jp/nt/EN/tech/en_300table.html
(**) http://home.jeita.or.jp/ecb/material/No021.pdf
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TCEs (Temperature Coefficient of
Expansion) relevant for Pacakges
Shear Stress in bond area in clear molding
compounds is about an order of magnitude larger
than in black molding compounds
TCE mismatch between:
•
•
Shear stress (arbitrary units)
60000
50000
40000
Typical Clear
Molding Compound
30000
Typical Black
Molding Compound
20000
10000
leadframe and molding
compound
Silicon die and molding
compound
gives rise to shear forces.
When shear force
exceeds adhesion
force between molding
compound and silicon
or leadframe,
delamnination occurs.
Delamination results
in wirebond breakage
during temperature
cycling.
0
1 2 3 4 5 6 7 8 9 10 11
Distance from center of package
body (arbitrary units)
Shear force increases
with third power from
center of package
body.
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Difference in Shear Stress in bond area within
Package
Connecting the “Heaven” Package
Sideview
“Heaven Pigtail”
in GOF
Integrated ferrule clamp
Fiber Optic Transceiver (FOT)
in 24 pin SOIC
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Standard MOST 2+x (x= 4,
12, 20,…) connector
Connecting the “Heaven” Package
Topview
Standard MOST 2+x (x= 4,
12, 20,…) connector
Fiber Optic Transceiver (FOT)
in 24 pin SOIC
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“Heaven Pigtail”
Pigtail connecting
FOT and MOST connector
Connecting the “Heaven” Package
2+x Connector (x= 4, 12, 20,…)
and “Heaven” Pigtails
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“Heaven” Pigtail
Pigtail connecting
FOT and MOST connector
“Heaven” Pigtail Pull-out Force Performance
Measurement data
For clamp part with thickness
0.3 mm:
13.5N
12.3N
15.6N
13.0N
15.0N
12.8N
Average = 13.7N +/- 1.3N
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
Spec pigtail pull-out force:
7N to 20N
Pigtail height same as connector height
Standard MOST 2+x (x= 4,
12, 20,…) connector
Height 12.8 mm to 14.1. mm
Total height using
GOF 13 mm
GOF: 5 mm
FOT: 8 mm
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“Heaven Pigtail”
in GOF
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Multicore Glas Optical Fiber (GOF)
00050D
Multicore Glas Optical Fiber (GOF)
Fiber Core
Fiber Cladding
Fiber Bundle
Fiber bundle diameter
Numerical Aperture
Attenuation at 650 nm
Temperature Range
Minimal Bending Radius
Ø 53 ± 4 µm
3 µm
380 fibers
Ø1 mm
0,5
< 0,25 dB/m
- 40°°C bis +125°°C
5 mm
Fiber Cladding
ε
Critcical Angle
Fiber Core
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Technical Data:
Wavelength (nm)
GOF
0,60
0,40
0,20
0,00
POF
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900
880
860
840
820
800
780
760
740
720
700
680
660
640
620
600
580
560
540
520
500
Attenuation (dB/m)
00051D
Attenuation GOF versus POF
1,20
1,00
0,80
Coupling to GOF Pigtails
The Optical coupling loss for in line connections in MOST includes:
Coupling loss due to reflection of light at the fiber end surfaces (in- and outcoupling)
Coupling loss due to axial misalignment
Coupling loss due to lateral misalignment
~0.5dB additional
coupling loss
0.0dB additional
coupling loss
By coupling light from a monocore-POF into a multicore-GOF power which is emitted
on the optical cladding of each single fiber is absorbed.
This adds an additional coupling loss of 0.5dB.
Despite this 0.5 dB coupling loss into GOF, pigtail loss including this coupling loss, is
limited to max 1.5 dB, which is within the requirements for MOST.
By coupling light from a multicore-GOF into a monocore-POF the complete transmitted
power is coupled into the monocore fiber.
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Signal direction
“Heaven” Pigtails
Hence, in development:
Dedicated “heaven” ferrule for “heaven” pigtail.
Dedicated 2+x connectors for GOF “heaven” pigtails
Conclusion:
SOIC FOT’s will be used
GOF pigtails the new standard for “Heaven” Pigtails?
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
“Heaven” pigtails in GOF meet performance requirements,
and seem to be close to meet cost requirements.
Optische Gehäuse
2x1-polig
a
K
o
m
b
Optische Gehäuse
2x1-polig
Sender/Empfänger für POF
t
io
n
Sender/Empfänger für GOF
F
O
G
i n / PO
F
Kappe
Stiftwanne
© 2008, KOSTAL Kontakt Systeme GmbH. Inhalt und Darstellung sind weltweit geschützt. Vervielfältigung, Weitergabe oder
Verwertung ist ohne Zustimmung auch auszugsweise verboten. Alle Rechte - inkl. Schutzrechtsanmeldungen - sind vorbehalten.
00054D
GOF / POF - Kombinierbarkeit
00055D
POF
GOF
Faserendhülse
Ferrule
Optisches Gehäuse
1-polig
( Empfänger ) für POF
Optisches Gehäuse
1-polig
( Empfänger ) für GOF
Inline - Koppler
Optisches Gehäuse
1-polig
( Sender ) für POF
Ferrule
Optisches Gehäuse
1-polig
POF
( Sender ) für GOF
Faserendhülse
GOF
Wellrohr
(optional)
© 2008, KOSTAL Kontakt Systeme GmbH. Inhalt und Darstellung sind weltweit geschützt. Vervielfältigung, Weitergabe oder
Verwertung ist ohne Zustimmung auch auszugsweise verboten. Alle Rechte - inkl. Schutzrechtsanmeldungen - sind vorbehalten.
Inline - Koppler
Qualification of the “Heaven” Package
• Release of Standard:
MOST Physical Layer Basic Specification Rev1.0
• Final silicon for RX and TX:
• End evaluation of RX and TX:
• Conformance testing specs
Date
October 2008
March 2009
May 2009
To be defined
Qualification
• Release of Standard: Automotive Application Recommendation for optical
MOST Components, Surface Mount Device (SMD):
To be defined
• Start of Qualification Tests:
May 2009
• End of Qualification tests:
December 2009
• Apply for "Automotive Application Recommendation for optical MOST
Components, Surface Mount Device (SMD)":
December 2009
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
Conformance to 150 MOST Standard
Devices fully optically
activated during High
Temperature Operating
Lifetest
Two SOIC devices
connected top to top
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SMD Parts Ready for
High Temperature Lifetests
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SMD High Temperature Lifetest Set-up
Now
FOT
+
INIC150
FOT integrated
with INIC150
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“Heaven” Roadmap
Later
Use of SMD package for FOTs results in reduced cost of
ownership, since the following steps can be omitted:
- Manual insertion of the FOT
- Separate wave soldering step for soldering the FOTs.
Melexis packaging technology for Fiber Optic Transceivers
demonstrated to withstand leadfree SMD processes.
GOF pigtails, the new standard for “heaven” pigtails?
150 Mbps MOST Fiber Optic Transceivers in SMD Package
ready for Conformance Testing and Qualification start.
© Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved
“Heaven” Conclusions
Piet De Pauw, Business Unit Opto Datacom,
[email protected]
Tel +32 57 226147, gsm +32 485 556208
Melexis Contact persons for support in
Japan:
David Poole, E-mail: [email protected],
+81 90 4226 9543
Yuji Ohkawa: E-mail: [email protected],
+81 90 1761 0501
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Thank You