Piet De Pauw Chairman Melexis Opto Division ITG VDE 5.4.1. Fachgruppentreffen Krems 30 June 2008 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Automotive market is around 70% of Melexis sales. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Fully ISO/TS 16949 Qualified Melexis Automotive Network Transceivers LIN LIN transceivers • Single and multi channel LIN System Basis Chips (SBC) Transceiver + Voltage Regulator + … Configurable LIN slaves • • Switch modules and contact monitoring Express down window lift, rear wiper control, small pumps, … ROM programmable LIN slaves • ASICs Flash LIN slaves • • • • • • Headlamp swiveling, HVAC flaps Anti pinch window lift Complete door modules Electric parking brake Seat positioning, seat heat/vent. Seat belt retractor, … LIN products developed in close collaboration with Vehicule Manufacturers in Europe, US and Asia. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved • Melexis Automotive Network Transceivers GM LAN transceiver: TH8056 Largest market share Shipping 3Mio parts per month Result from a long term relationship with GM (*) GM LAN: GM specific Single Wire CAN standard © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Only device approved for GM LAN gen 2.x next to Freescale Optoelectronics Optoelectronics sales sales is is around around 30 30 Million Million EUR/year. EUR/year. Key-less Entry Headlight Control Optical Switch MLX75303 Light-to-Frequency Converter MLX75304 Anti-Glare Mirror Light-to-Frequency Converter MLX75304 Rain Sensor ASIC Linear Array MLX90255 APPLICATION FUSION Exterior view: Night Vision Adaptive Cruise Control Lane Departure Warning Traffic Sign Recognition Interior view: Driver Drowsiness Smart Airbag Deployment Sunload Sensor ASIC Camera MLX75307 Console Light Control Display Brightness Control Light-to-Voltage/Frequency Converter MLX75304/305 Switch & Rotary Buttons Steering Controls Optical Switch MLX75303 Steering Wheel Angle Sensing Steering Wheel Torque Sensing Linear Array MLX90255, ASIC Optical Switch MLX75303 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Fuel Composition Analysis Melexis Linear Array © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis Melexis Automotive Automotive Optoelectronic Optoelectronic Products Products Compatible Compatible to to SMD SMD solder solder processes processes and and ambient ambient temperatures temperatures -40C -40C to to +125C +125C Melexis Melexis Optoelectronic Optoelectronic components components for for Steering Steering Angle Angle and and Torque Torque Sensing Sensing Melexis LED Driver © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis Automotive LED Drivers Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers PDIC in Clear molded Package for optical pick-up head Source: Melexis © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Clear Molded Packages The Photodiode Array allows for high speed data recovery as well as tracking and focusing. The Detector and APC detector allows for accurate laser power control during write pulses. The Laser, controlled by the Laser Diode Driver, emits a high modulated intensity to burn the holes in the disk. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Optoelectronic IC’s for Optical Pick-up Heads. Clear Molded Package - Simple low cost assembly process - Can form any shape including lens E.g. Packages from different suppliers for Optical data communication - Color filter can be added to molding component e.g. Vishay packages for NIR receivers for remote controls © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Important Advantages: Clear Molded Packages with filter Transparent to NIR NIR Receiver for remote controls Source: VISHAY © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Color filter added to molding component e.g. Vishay packages for NIR receivers for remote controls Cut-off Wavelength can be selected. A wide range of filters is commercially available. Source: http://www1.nitto.co.jp/nt/EN/tech/en_transmittance.html © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Molded Compounds can be obtained with light filter 1)Expensive molding compound compared to black molding compounds. 2) Severely limited Temperature Cycling performance and strong limitations on package size, due to important TCE mismatch between leadframe and silicon versus molding compound for clear molding compounds versus black molding compounds. 3) Discoloration by exposure to high temperatures (solder process) and when exposed to short wavelength light. 4) Important misalignment between molded lens and component on the leadframe limits optical coupling efficiency © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Issues Clear molded Packages Results of Soldering Tests on Packages with clear molding compounds Clear Molded package After soldering Acoustic Microscopy Pictures performed on clear molded package demonstrates that clear epoxy above IC may become fully delaminated after a reliability test. Potential reliability hazard. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Before solering Mark-up © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Supply Chain when using through hole mounted FOT’s Three steps: Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers Cavity Molding Standard molding system for epoxy compounds soft insert in mold seals die off from compound Epoxy compound Silicone Top mold © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Encapsulation with Rubber Insert Source: Eurasem © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Molded Cavity Package © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Cavity Molded Package © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Cavity Molding Technology © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Cavity Molding – Design Constraint © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Cavity Molding fulfills most severe automotive Qualification requirements Cavity Molding • Need to clean inserts and replace silicone every 600~800 shots • Second mold for replacement of inserts • Risk of compound particles. • Chip cleaning after molding © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved But… Melexis opto sensors using overmolded cavity package - Automotive quality - JEDEC compatible package outline - low cost © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Film Assistant Molded (FAM) Packages Advantages of Cavity molded optical Packages over Clear Molded Packages • • Robuust in Temperature Cycling tests Robuust withstanding leadfree SMD soldering processes 2) No discoloration due to exposure of short wavelengths or high temperatures 3) Low cost molding compound 4) Lower thermal resistance of package due to higher thermal conductivity of the package 5) Higher optical coupling efficiency between optical fiber and PD or light source. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 1) Excellent TCE matching between molding compound and leadframe and die => Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 24 pin SOIC Package Top View © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 24 pin SOIC Package After assembly of (RC)LED and lens © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Lid © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Lid attached to 24 pin SOIC © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Clamp Anchoring of Clamp Lid “Anchors” at SOIC bottom. Clamp is anchored at SOIC bottom for more robustness when force is applied on the fiber. 24 pin SOIC © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved “Mushrooms” on lid. Clamp is anchored to lid. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis 150 Mb/s Fiber Optic Transceivers ready to put in tape & reel package Pick and Place This allows the device to be handled by the vacuum pick-up head of a standard pick & place SMD machine. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Flat surface area on top has a length larger than 6 mm. SMD Soldering Process MLX75605 withstands lead free SMD assembly processes according IPC/JEDEC J-STD020 i.e. withstands 245 oC +0 oC/-5 oC during at least 30 sec In order to protect device during soldering process, devices are delivered with a kapton tape on the top. Kapton tape can be easily removed before ferrule insertion. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MLX75605 withstands Moisture Sensitivity Level #3. Mark-up © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Supply Chain when using Surface Mounted FOT’s Two Steps: 650 nm wavelength 150 Mbps speed Compatible to 1 mm PMMA POF © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 150 Mbps Fiber Optic Transceiver Connection to Pigtail Pigtail connecting FOT and MOST connector Fiber Optic Transceiver (FOT) in 24 pin SOIC Withstands leadfree SMD solder processes © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MOST 2+x (x= 0, 12, 20,…) connector Integrated ferrule clamp to 1 mm PMMA POF © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Fiber Optic Transceiver (FOT) with Pigtails When 1 mm SI PMMA POF is used for the pigtail material, a small bending radius of the POF introduces some additional loss in optical power. This additional power loss can be fully overcome by using GOF as pigtail fiber material. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis 150 Mb/s Fiber Optic Transceivers connected with pigtails Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Rx Ferrule Tx Ferrule Tx Ferrule Rx Ferrule Not OK OK Rx Tx Rx Tx © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Receiver and transmitter ferrules have two times a different diameter so that the receiver ferrule cannot be inserted in the Transmitter coupling hole, and the transmitter ferrule cannot be inserted into the Receiver coupling hole of the Fiber Optic Transceiver Package. Receiver and transmitter ferrules are different. Implemented by having at two different places a different diameter This assures that: • the Receiver Ferrule cannot be inserted in the Transmitter Coupling Hole, and • the Transmitter Ferrule cannot be inserted into the Receiver Coupling Hole of the Fiber Optic Transceiver Package. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Correct insertion Rx TX Ferrule Tx © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved RX Ferrule Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Correct insertion Rx TX Ferrule Tx © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved RX Ferrule Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Wrong insertion Rx RX Ferrule Tx © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved TX Ferrule Pigtail insertion into the FOT Mistake-Proofing (Poka-Yoke) Wrong insertion Rx RX Ferrule Tx © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved TX Ferrule Intergation of the Fiber Clamping Mechanism Customization of the fiber clamping mechanism is relatively straigthforward. For non automotive applications clamping of the optical fiber to the FOT without ferrule might be possible. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Integration of fiber clamping mechanism in the 24 pin SOIC package is demonstrated. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Automotive Infotainment Network Data rate Evolution (MOST standards) Transmitter maximum Power: -1.5 dBm Transmitter Minimum Power: - 6.5 dBm Available Optical Power Budget for the connection: Min 17 dB Minimal Receiver Sensitivity: - 23.5 dBm © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 17 dB Optical Power Budget over Full Temperature Range -40C to +95C for the 150 Mbps Fiber Optic Transceiver Features 3.3 V power supply • LVDS inputs for transmitter • LVDS output for receiver Fully optical tested Operating temperature range -40C to 95C © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Low EMI electrical connections: Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis 150 Mb/s Fiber Optic Receiver MLX75603 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 150 Mbps Receiver MLX75603AA Block Diagram Integration of PD results in: • High immunity to EMI • Lower assembly costs © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Integrated PIN Photo Diode Melexis 150 Mb/s Fiber Optic Receiver MLX75603AA Monolithic receiver. 1.1mm Diameter Photo Diode, small separation between optical fiber and PD, and butt coupling, assures optical coupling loss is negligibly small. Extended test modes for Photodiode analog tests. - High EMC immunity due to: On chip integration of Photo Diode Dual photo diode structure maximizes immunity against disturbances © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved PIN Photo Diode with ARC optimized for 650 nm. Receiver IC Bandwidth over supply voltage range Minimum -3 dB bandwidth needed for application MLX75603AA Analog path bandwidth at 95degC over supply range -1.0 1 10 100 1000 Attenuation (dB) -3.0 -5.0 3,0V -7.0 3,3V -9.0 3,6V -11.0 -13.0 -15.0 -17.0 Frequency (kHz) © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 1.0 Receiver eye diagram performed at -26dBm light power Vdd=3.3V -40 degC with speed enhancement block (*) Prototype material © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 150 Mbps Receiver MLX75603AA (*) SP4 Eye Mask Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis 150 Mb/s Fiber Optic Transmitter Transmitter during Power ON © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis 150 Mb/s Fiber Optic Transmitter Light source Requirements 1. Wavelength = 650 nm at the local absorption minimum of PMMA POF. 2. (RC)LED should be able to couple at least 0.5mW in 1mm PMMA POF. 4. Fall/rise time should be as low as possible but it is sufficient to be close to spec requirements i.e. tr and tf <4ns. Using pre-emphasis the (RC)LED rise and fall times can be reduced within spec. Conclusion: Only a small number of (RC)LED types available on the market today are useful. 0 Popt, dBm Lower than |-0.9| %/K 2 -2 -4 -6 -8 -10 -50 0 50 100 Temperature, °C 7.8mA 16mA 25.7mA 150 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved 4 3. Temperature dependence of light emitted power (RC)LED Bandwidth Enhancement • Rise time is determined by the time needed to build-up a minority carrier concentration within the RCLED, corresponding to the light level selected. • Fall time is determined by the minority carrier concentration and the minority carrier lifetime within the RCLED. (RC)LED bandwidth is boosted using pre-emphasis. i.e. a current peak during rising and falling edge. (RC)LED drive current is obtained by summing two currents: a Modulation current and a Pre-emphasis current. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved (RC)LED characteristics: 150 Mbps Transmitter IC MLX75604AA Block Diagram min3dB CONTROL LVDS receiver Buffer INPUT+ Swing control led driver with swing control and common-mode feedback Vcm Ibias Imod Commun. circuit Modulation current generator Peaking circuit Bias current generators VCC GND Zapping circuit Settings Bandgap current generator © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved INPUT- Optical Power over Temperature MLX75605AA Optical power over temperature into 1mm PMMA SI POF 0 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 -1 -3 -4 -5 -6 -7 Trimmed optical power Untrimmed optical power -8 Temperature (degC) © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Optical power (dB) -2 Rise time: min 1.012ns max: 1.369ns MOST specification: 0.5UI=3.391ns/2=1.6955ns in the worst case (48kHz frame speed) (*) Prototype material © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MLX75604AA (*) Transmitter IC SP2 Overshoot Mask 150 Mbps MOST V0.9 Fall time: min 1.207ns max: 1.635ns MOST specification: 0.5UI=3.391ns/2=1.6955ns in the worst case (48kHz frame speed) (*) Prototype material © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MLX75604AA (*) Transmitter IC SP2 Undershoot Mask 150 Mbps MOST V0.9 Time base: 424ps/div Transmitter eye diagram performed At Vdd=3.3V with MOST worst case pattern (*) Prototype material © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved MLX75604AA (*) Transmitter IC SP2 Eye Mask 150 Mbps MOST V0.9 Why Melexis in Fiber Optic Transceivers? Clear Molding for Fiber Optic Transceivers Cavity molding for Fiber Optic Transceivers New 150Mbps Fiber Optic Transceiver Receiver Transmitter Availability and Conclusions © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Melexis New Fiber Optic Transceivers Availability (plan) Prototypes compliant to 150 Mbps MOST Std rev 0.9: Mid 2008 Qualified product: end of 2008 PPAP: December 2009 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Production Samples: July 2009 Conclusions Integration of fiber clamping mechanism is possible. Customization of the fiber clamping mechanism is relatively straigthforward. FOT’s manufactured using the cavity molding technique can be directly picked and placed as a standard SMD component for lead free SMD processes. Capability of the technology is demonstrated with a 150 Mbps Fiber Optic Transceiver in line with the new 150 Mbps MOST standard. Coupling losses to the optical fiber are small. A minimum optical budget of 17 dB is available for the link between two FOT’s. © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved The cavity Molding Technique is an interesting technique to manufacture Fiber Optic Transceivers (FOT’s) and allows to overcome the most important issues with clear molding components. Piet De Pauw, Chairman Opto Division, [email protected] Tel +32 57 226147, gsm +32 485 556208 Melexis Contact persons for support in Japan: David Poole, E-mail: [email protected], +81 90 4226 9543 Yuji Ohkawa: E-mail: [email protected], +81 90 1761 0501 © Copyright Melexis Microelectronic Integrated Systems. All Rights Reserved Thank You