md eh powersso36 a2eh ua94aa5fullcu

This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly
with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has
© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility.
both international and Pan-American copyright conventions.
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Material Composition Declaration
1752-2
IPC Web Site for Information on IPC-1752 Standard
http://www.ipc.org/IPC-175x
1.1
Form Type *
Distribute
Declaration Class *
Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Informat
Supplier Information
Company Name *
Company Unique ID
Unique ID Authority
Response Date *
STMicroelectronics
Contact Name *
Title - Contact
Phone - Contact *
Email - Contact *
Authorized Representative * Title - Representative
Phone - Representative *
Email - Representative *
Carole DEL PUPPO
Requester Item Number
Response Document ID
Duplicate
Supplier Comments or URL for Additional Information
HED Packaging Engineering
+33 4-76-58-66-78
[email protected]
Mfr Item Number
Mfr Item Name
Effective Date
Version
Manufacturing Site
STA339BWS-5HUF
A2EH*UA94AA5
2009-12-07
A
MU1A
Alternate Recommendation PowerSSO36
Contact -> Authorized Representative
Weight *
UOM
Unit Type
482
mg
Each
Ecopack
2
compliant,
BSA
CD00240623
3.0
Alternate Item Comments
Manufacturing Process Information
Terminal Plating / Grid Array Material
Matte Tin (Sn) - annealed
Terminal Base Alloy
CU Alloy
J-STD-020 MSL Rating
3
Peak Process Body Temperature Max Time at Peak Temperature Number of Reflow Cycles
260 C
30 seconds 3
Comments
Disclaimer: While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and
* Required Field
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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RoHS Material Composition Declaration
Declaration Type *
Lock Supplier Fields
Simplified
RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
2002/95/EC
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium
Supplier certifies that it gathered the information it provides in this form concerning RoHS restrictive substances using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the
date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that
Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others,
Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a
written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's
remedies for issues that arise regarding information the Supplier provides in this form.
Supplier Acceptance * Accepted
RoHS Declaration * 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions
Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration
above and choose all applicable exemptions.
Exemption List Version
+ -
EL-2006/690/EC
7a. Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).
Declaration Signature
Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign
the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester.
Supplier Digital Signature
Carole Del Puppo
* Required Field
Digitally signed by Carole Del Puppo
DN: cn=Carole Del Puppo, o=HED operations, ou=HED Packaging engineering,
[email protected], c=FR
Date: 2009.12.07 15:55:41 +01'00'
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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Homogeneous Material Composition Declaration for Electronic Products
SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the
homogeneous material [3], enter the weight of the homogeneous material.
Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the
substance (JIG) or enter the substance and CAS (Other). [D] select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the
positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3 sigma range of distribution unless otherwise noted).
Line Functions: +I Inserts a New Item /SubItem +M Inserts a new Material
Item/SubItem
Name
+I -I device
Homogeneous
Material
Weight
+M -M Integrated circuit9.5
+M -M Leadframe
Unit of
Measure
mg
138.63 mg
Level
+C Inserts a new Substance Category
Substance Category
+S Inserts a new Substance
Substance
CAS
- Deletes the element line
Exempt Weight
Unit of Tolerance
PPM
Measure +
+C -C Supplier
Silicon die
+S -S Silicon (Si)
7440-21-3
9.482
mg
998,10
+C -C Supplier
die metallization
+S -S Aluminium (Al)
7429-90-5
0.002
mg
211
+C -C Supplier
die metallization
+S -S Copper (Cu)
7440-50-8
0.006
mg
632
+C -C Supplier
die metallization
+S -S Titanium (Ti)
7440-32-6
0.003
mg
316
+C -C Supplier
die metallization
+S -S Chromium (Cr)
7440-47-3
0.001
mg
105
+C -C Supplier
die metallization
+S -S Gold (Au)
7440-57-5
0.001
mg
105
+C -C Supplier
die metallization
+S -S Nickel (Ni)
7440-02-0
0.005
mg
526
+C -C supplier
alloy
+S -S Copper (Cu)
7440-50-8
135.096 mg
974,50
+C -C supplier
alloy
+S -S Iron (Fe)
7439-89-6
3.252
mg
23,458
+C -C supplier
alloy
+S -S Zinc (Zn)
7440-66-6
0.166
mg
1,197
+C -C supplier
alloy
+S -S Iron Phosphide (FeP)
26508-33-8
0.116
mg
837
1.912
mg
1,000,0
mg
975,01
+M -M Leadframe coatin1.912
mg
+C -C supplier
coating
+S -S Silver (Ag)
7440-22-4
+M -M Die Attach
mg
+C -C A
glue or soft solder
+S -S Lead (Pb)
7439-92-1
+C -C supplier
glue or soft solder
+S -S Silver (Ag)
7440-22-4
0.062
mg
15,038
+C -C supplier
glue or soft solder
+S -S Tin (Sn)
7440-31-5
0.041
mg
9,944
+S -S Copper (Cu)
7440-50-8
1.438
mg
1,000,0
12.726
mg
40,000
4.123
7a. Lead 4.02
+M -M Bonding wire
1.438
mg
+C -C Supplier
Bonding wire
+M -M Encapsulation
318.152 mg
+C -C supplier
Moulding Compound +S -S Phenol Resin
+C -C supplier
Moulding Compound +S -S Biphenyl epoxy resin
85954-11-6
9.545
mg
30,001
+C -C supplier
Moulding Compound +S -S epoxy resin
na
9.545
mg
30,001
+C -C supplier
Moulding Compound +S -S carbon black
1333-86-4
0.636
mg
1,999
+C -C supplier
Moulding Compound +S -S Silica, vitreous
60676-86-0
285.7
mg
897,99
+C -C supplier
connection coating
7440-31-5
8.228
mg
1,000,0
+M -M Finishing
* Required Field
8.228
mg
+S -S Tin (Sn)
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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