ipc1752 aa9i-uh82ad6

This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly
with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has
© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility.
both international and Pan-American copyright conventions.
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Material Composition Declaration
1752-2
IPC Web Site for Information on IPC-1752 Standard
http://www.ipc.org/IPC-175x
1.1
Form Type *
Distribute
Declaration Class *
Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Informat
Supplier Information
Company Name *
Company Unique ID
Unique ID Authority
Response Date *
STMicroelectronics
Contact Name *
Title - Contact
Phone - Contact *
Email - Contact *
Phone - Representative *
Email - Representative *
Authorized Representative * Title - Representative
Emilio Castelli
Response Document ID
Duplicate
Contact -> Authorized Representative
Supplier Comments or URL for Additional Information
APG Material Declaration Cham
Requester Item Number
Mfr Item Number
Mfr Item Name
Effective Date
Version
Manufacturing Site
L99DZ80EP
AA9I*UH82AD6
2011-04-04
A
MU1A
Alternate Recommendation TQFP 64 10x10x1.0 ExPad Dow
Weight *
UOM
Unit Type
260
mg
Each
Internal
ST
reference:
BSA:
CD00286304
EcoPack2
Alternate Item Comments
Manufacturing Process Information
Terminal Plating / Grid Array Material
Tin (Sn)
Terminal Base Alloy
CU Alloy
J-STD-020 MSL Rating
3
Peak Process Body Temperature Max Time at Peak Temperature Number of Reflow Cycles
260 C
30 seconds 3
Comments
Disclaimer: While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and
* Required Field
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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RoHS Material Composition Declaration
Declaration Type *
Lock Supplier Fields
Simplified
RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
2002/95/EC
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium
Supplier certifies that it gathered the information it provides in this form concerning RoHS restrictive substances using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the
date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that
Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others,
Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a
written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's
remedies for issues that arise regarding information the Supplier provides in this form.
Supplier Acceptance * Accepted
RoHS Declaration * 1 - Item(s) does not contain RoHS restricted substances per the definition above
Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration
above and choose all applicable exemptions.
Declaration Signature
Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign
the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester.
Supplier Digital Signature
Emilio Castelli
* Required Field
Digitally signed by Emilio Castelli
DN: cn=Emilio Castelli, o=STMicroelectronics, ou=APG, [email protected],
c=IT
Date: 2011.04.04 11:31:00 +02'00'
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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Homogeneous Material Composition Declaration for Electronic Products
SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the
homogeneous material [3], enter the weight of the homogeneous material.
Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the
substance (JIG) or enter the substance and CAS (Other). [D] select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the
positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3 sigma range of distribution unless otherwise noted).
Line Functions: +I Inserts a New Item /SubItem +M Inserts a new Material
Item/SubItem
Name
Homogeneous
Material
Weight
Unit of
Measure
+I -I TQFP 64 10x10x1.0 +M -M Integrated circuit27.783 mg
+M -M Leadframe
+M -M Die Attach
32.058 mg
0.941
mg
Level
+C Inserts a new Substance Category
Substance Category
+S Inserts a new Substance
Substance
Exempt Weight
Unit of Tolerance
PPM
Measure +
+C -C Supplier
Silicon die
+S -S Silicon (Si)
7440-21-3
27.401
mg
986,25
+C -C
die metallization
+S -S Aluminium (Al)
7429-90-5
0.003
mg
108
+C -C
die metallization
+S -S Copper (Cu)
7440-50-8
0.009
mg
324
+C -C
die metallization
+S -S Titanium (Ti)
7440-32-6
0.005
mg
180
+C -C
die metallization
+S -S Chromium (Cr)
7440-47-3
0.016
mg
576
+C -C
die metallization
+S -S Gold (Au)
7440-57-5
0.042
mg
1,512
+C -C
die metallization
+S -S Nickel (Ni)
7440-02-0
0.12
mg
4,319
+C -C
die metallization
+S -S Vanadium (V)
7440-62-2
0.009
mg
324
+C -C
Die coating
+S -S Gamma-butyrolactone 96-48-0
0.119
mg
4,283
+C -C
Die coating
+S -S Polyhydroxyamide
55295-98-2
0.053
mg
1,908
+C -C
Die coating
+S -S Alcoxysilane
na
0.004
mg
144
+C -C
Die coating
+S -S Aryl Silicilic Acid
na
0.002
mg
72
+C -C supplier
frame alloy
+S -S Copper (Cu)
7440-50-8
27.87
mg
869,36
+C -C
frame alloy
+S -S Nickel (Ni)
7440-02-0
0.869
mg
27,107
+C -C
frame alloy
+S -S Silicium (Si)
7440-21-3
0.188
mg
5,864
+C -C
frame alloy
+S -S Magnesium (Mg)
7439-95-4
0.043
mg
1,341
+C -C
frame coating
+S -S Silver (Ag)
7440-22-4
3.088
mg
96,325
+C -C supplier
CDAF
+S -S Silver (Ag)
7440-22-4
0.753
mg
800,21
+C -C
CDAF
+S -S epoxy resin
na
0.151
mg
160,46
+C -C
CDAF
+S -S aromatique amine
0.028
mg
29,756
+C -C
CDAF
+S -S Epoxyde Bisphenol A Re25068-38-6
0.009
mg
9,564
+S -S Copper (Cu)
7440-50-8
1.877
mg
1,000,0
85954-11-6
15.175
mg
80,001
+M -M Bonding wire
1.877
mg
+C -C Supplier
Bonding wire
+M -M Encapsulation
189.685 mg
+C -C supplier
Moulding Compound +S -S Epoxy Resin
* Required Field
CAS
- Deletes the element line
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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+M -M Finishing
* Required Field
7.657
mg
+C -C
Moulding Compound +S -S Phenol Resin
26834-02-6
7.587
mg
39,998
+C -C
Moulding Compound +S -S Silica, vitreous
60676-86-0
165.216 mg
871,00
+C -C
Moulding Compound +S -S Carbon black
1333-86-4
0.948
mg
4,998
+C -C
Moulding Compound +S -S Bismuth (Bi)
7440-69-9
0.759
mg
4,001
+C -C supplier
connection coating
7440-31-5
7.657
mg
1,000,0
+S -S Tin (Sn)
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
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