DISCRETE PACKAGE Data Sheet TO-263 Standard Materials Introduction J-Devices’ TO-263 package follows the JEDEC standard for automotive products with the exception of lead pitch. Application The TO-263 package is suitable for high-power applications (reference values 160W*/100A), designed for low on-resistance and high-speed switching MOSFETs: • Motor drivers • Power supply circuits • DC-DC converters • Consumer products • Automotive products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • Low on-resistance and high current density due to thick Al wire bonding • Full turnkey available from wafer probe through test and packing • Pb-free plating Under Developments • Environmentally friendly die attach Pb-free solder • Halogen free mold compound Process Highlights • Interconnect: Thick Al wire bonding technology • Plating: 100% matte Sn • Marking: Laser mark • Leadframe: Copper with Ni plating on wire bonding area • Die attach: Pb solder • Interconnect: Al wire 15.7 mil max • Mold compound: With halogen Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • All reliability testing include JEDEC standard pre-conditioning except high temperature storage • 85°C/85%RH, 168 hours, IR reflow 260°C 3X • PCT: 121°C/100% RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 500 cycles • High Temp Storage: 150°C, 1000 hours Test Service J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal Resistance • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services *1 negotiable Shipping • Tape and reel packing – 800 pcs per reel –Tape width 24 mm – Reel Ф = 330 mm • Barcode packing label DSJD416A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE TO-263 Cross-section Top & Bottom View Mold Compound Leadframe Wire Die Die Attach Material Package Outline Drawing – TO-263 Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD416A Rev Date: 3/15 www.j-devices.co.jp