DISCRETE PACKAGE Data Sheet TO-263 (7-pin) Standard Materials Introduction The TO-263 (7-pin) package is smaller than a JEDEC standard 7 outer lead package. Application • Leadframe: Copper with Ni plating on wire bonding area • Die attach: Pb solder • Interconnect: Al wire 15.7 mil max • Mold compound: with halogen Reliability Qualification The TO-263 (7-pin) package is suitable for highpower applications (reference values 160W*/80A), designed for multi-chip modules such as control ICs and a MOSFET for IPDs (Intelligent Power Devices): • Injection drivers • Lamp drivers • Automotive products J-Devices packages are assembled with proven reliable semiconductor materials. • All reliability testing includes: JEDEC standard pre-conditioning except high temperature storage • 85°C/85%RH, 168 hours, IR reflow 260°C 3X • PCT: 121°C/100% RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 500 cycles • High Temp Storage: 150°C, 1000 hours *Tc = 25°C, Tj = Max 150°C Test Service Enhanced Feature Options J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, intelligent power devices, etc. • IC test capability: – DC – Thermal resistance – Operation/protection/diagnosis function – Burn In test – Overcurrent test *1 • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services • Low on-resistance and high current density due to thick Al wire bonding • Dual die attachment • Full turnkey available from wafer probe through test and packing • Pb-free plating Under Developments • Environmentally friendly die attach Pb-free solder • Halogen free mold compound Process Highlights • Interconnect: Thick Al wire bonding technology • Plating: 100% matte Sn • Marking: Laser mark *1 negotiable Shipping • Tape and reel packing – 800 pcs per reel – Tape width 24 mm – Reel Ф = 330 mm • Barcode packing label DSJD417A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE TO-263 (7-pin) Cross-section Top & Bottom View Mold Compound Leadframe Wire Die Die Attach Material Package Outline Drawing – TO-263 (7-pin) Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD417A Rev Date: 3/15 www.j-devices.co.jp