DISCRETE PACKAGE Data Sheet TO-220 Process Highlights • Interconnect: Thick Al wire bonding technology • Lead finish: Sn-Ag-Cu dipping • Marking: Laser mark Introduction Standard Materials The TO-220 package follows JEDEC standard for high-power discrete products. • Leadframe: Copper with Ni plating on wire bonding area. • Die attach: Pb solder • Interconnect: Al wire 15.7 mil max • Mold compound: With halogen Application The TO-220 package is suitable for high-power applications (reference values 160W*/80A), designed for low on-resistance and high-speed switching MOSFETs: • Motor drivers • Power supply circuits • DC-DC converters • Consumer products • Automotive products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • Low on-resistance and high current density due to thick Al wire bonding • Full turnkey available from wafer probe through test and packing • Pb-free dipping Under Developments • Environmentally friendly die attach Pb-free solder • Halogen free mold compound Process Highlights • Interconnect: Thick Al wire bonding technology • Lead finish: Sn-Ag-Cu dipping • Marking: Laser mark Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • PCT: 121°C/100% RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 300 cycles • High Temp Storage: 150°C, 1000 hours Test Service J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal resistance • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only Shipping • Loose packing (std. 200 pcs/pack) • Barcode packing label DSJD410A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE TO-220 Cross-section Top & Bottom View Mold Compound Leadframe Die Wire Die Attach Material Package Outline Drawing – TO-220 Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD410A Rev Date: 3/15 www.j-devices.co.jp