New NXP Automotive LFPAK MOSFETs High Reliability LFPAK MOSFETs for Automotive Power Applications As automotive applications become more complex, additional real-estate is required within the same module size. In applications such as engine controllers, the additional functionality requires the use of smaller footprint MOSFETs. LFPAK has a footprint 46% smaller than that of DPAK whilst offering similar thermal performance. Key benefits } Low inductance } Low thermal resistance } Dimensions comparable to SO8 } Significantly thinner than SO8 & DPAK } Wirebond free - Cu clip design } High current transient robustness } 100% avalanche tested } Automotive AEC-Q101 qualified to 175 °C } Leads are optical-inspection friendly Design tools } Thermal Design guide } Spice models } Thermal models } Universal SO-8 footprint These can be downloaded from the product pages at: www.nxp.com/automotivemosfets and www.nxp.com/documents/reflow_soldering/sot669_fr.pdf Target applications } Engine and transmission controllers } Advanced braking systems } Coolant pumps } DC/DC converters } Reverse battery protection } General-purpose automotive switching where space is at a premium Typical diesel fuel injector drive Vboost Typical ABS/ESP system Vsupply drive boost GATE DRIVE motor driver MOSFET D2 2 solenoid coil 4 1 D1 injector 1 drive recirc injector 2 drive 2 drive 1 LS1 injector 3 drive 3 LS2 2 solenoid coil 3 1 2 solenoid coil 2 1 2 solenoid coil 1 1 safety switch MOSFET GATE DRIVE injector 4 battery 14 V freewheel diode drive 4 LS3 solenoid 4 driver MOSFET LS4 solenoid 3 driver MOSFET solenoid 2 driver MOSFET solenoid 1 driver MOSFET reverse polarity MOSFET 1 pump motor 2 current monitoring shunt brb323 brb329 VDS (V) 40 55 75 100 RDSon (max) @ RDSon (max) @ VGS = 10 V VGS = 5 V (mΩ) (mΩ) 8 8 18 17 18 18 28 28 53 49 9 19 19 30 53 ID(max) @ 25 °C (A) Rth(j-mb) Max (K/W) Type 75 75 47 46 49 48 35 34 25 23 1.4 1.4 1.8 1.8 1.4 1.4 1.8 1.8 1.8 1.8 BUK7Y08-40B BUK9Y09-40B BUK7Y18-55B BUK9Y19-55B BUK7Y18-75B BUK9Y19-75B BUK7Y28-75B BUK9Y30-75B BUK7Y53-100B BUK9Y53-100B VDS (V) 40 55 RDSon (max) @ RDSon (max) @ VGS = 10 V VGS = 5 V (mΩ) (mΩ) 8 8 25 24 12 11 18 17 9 27 12 19 ID(max) @ 25 °C (A) Rth(j-mb) Max (K/W) Type 75 75 35 34 62 62 47 46 1.4 1.4 2.5 2.5 1.4 1.4 1.8 1.8 BUK7Y08-40B BUK9Y09-40B BUK7Y25-40B BUK9Y27-40B BUK7Y12-55B BUK9Y12-55B BUK7Y18-55B BUK9Y19-55B Thermal comparison of DPAK versus LFPAK (dissipation = 1 W) DPAK LFPAK DPAK Tcase = 43.6 °C Die area = 8.96 mm2 Package area = 76 mm2 LFPAK Tcase = 45.9 °C Die area = 8.03 mm2 Package area = 41 mm2 www.nxp.com © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. Date of release: March 2010 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and Document order number : 9397 750 16899 reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Printed in the Netherlands Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.