Data Sheet LEADFRAME SOIC Thermal Performance Forced Convection, Single-layer PCB Pkg Small Outline IC Package (SOIC) SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and provides value added, low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Services and Support Amkor has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost. • Full package characterization • Thermal, mechanical stress and electrical performance modeling • Turnkey assembly, test and drop ship • World class reliability testing and failure analysis ΘJA (°C/W) by Velocity (LFPM) 8 ld 4.9 x 3.8 2.3 x 2.3 0 153.3 200 128.5 500 115.5 20 ld 12.8 x 7.6 5.1 x 4.1 83.2 65.7 57.5 28 ld 18.0 x 7.6 6.4 x 5.6 76.2 60.8 53.2 Forced Convection, Multi-layer PCB ΘJA (°C/W) by Velocity (LFPM) Pkg Body Size (mm) Pad Size (mm) 8 ld 4.9 x 3.8 2.3 x 2.3 0 112.7 200 103.3 500 97.1 28 ld 18.0 x 7.6 5.6 x 4.1 46.2 39.7 36.8 Pre-JEDEC Standard Test Boards Electrical Performance New Developments • Stealth dicing (narrow saw streets) • Larger/higher density leadframe strips • Leadframe roughening for improved MSL capability Pad Size (mm) JEDEC Standard Test Boards Features • • • • • Body Size (mm) Pkg Body Size (mm) Pad Size (mm) 8 ld 4.9 x 3.8 3.6 x 2.3 Longest 1.25 0.263 8.2 – – – Shortest 0.718 0.218 5.1 Longest 5.05 1.09 28.7 Shortest 1.42 0.345 8.04 Lead 28 ld 18.0 x 7.6 6.4 x 4.8 – – – Inductance Capacitance Resistance (nH) (pF) (mΩ) Simulated Results @ 100 MHz Reliability Qualification Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning. • Moisture Sensitivity JEDEC Level 1, 85°C/85% RH, 168 hrs Characterization JEDEC Level 3, 30°C/60% RH, 192 hrs • uHAST130°C/85% RH, No Bias, 96 hrs • Temp Cycle -65°C/+150°C, 500 cycles • High Temp Storage 150°C, 1000 hours Process Highlights • • • • • Visit Amkor Technology online for locations and to view the most current product information. Pcc wire bonding standard, Ag wire available Wafer backgrinding services available Multiple die and die stacking capability NiPdAu (PPF) or Matte Sn lead finish options Laser mark on package body DS370R Rev Date: 4/16 Questions? Contact us: [email protected] Data Sheet LEADFRAME SOIC Cross-section SOIC Test Services • • • • • Program generation/conversion Wafer probe Burn-in capabilities -55°C to +165°C test available Strip test available Shipping • • • • Clear anti-static tube, 20 inch Tape and reel Dry pack Drop ship Configuration Options SOIC Nominal Package Dimensions (inches) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC SOIC Narrow 8 0.150 0.194 0.058 0.006 0.064 0.050 0.236 MS-012 14 0.150 0.342 0.058 0.006 0.064 0.050 0.236 MS-012 16 0.150 0.391 0.058 0.006 0.064 0.050 0.236 MS-012 8 0.208 0.208 0.071 0.004 0.075 0.050 0.311 N/A 16 0.300 0.407 0.092 0.009 0.101 0.050 0.406 MS-013 18 0.300 0.456 0.092 0.009 0.101 0.050 0.406 MS-013 20 0.300 0.505 0.092 0.009 0.101 0.050 0.406 MS-013 24 0.300 0.607 0.092 0.009 0.101 0.050 0.406 MS-013 28 0.300 0.706 0.092 0.009 0.101 0.050 0.406 MS-013 SOIC Wide Visit Amkor Technology online for locations and to view the most current product information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2016, Amkor Technology Incorporated. All Rights Reserved. DS370R Rev Date: 4/16 Questions? Contact us: [email protected]