LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray® Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. (See table on back.) In addition to the standard core ChipArray package (CABGA), Amkor offers thin core ball grid array packages (CTBGA and CVBGA) which, coupled with a thin mold cap, achieve package thicknesses down to 1.0 mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/Os in a given footprint. Amkor ChipArray packages, regardless of body size and thickness, utilize the same, flexible capacity which assures economical packaging solutions. Further, high volume processes and innovative design assure high quality and cutting edge technology. Due to their small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height. Thermal Resistance: Reliability: Cutting edge technology and expanding package offerings provide a platform from prototype-to-production. • Full, in-house design • Square or rectangle packages available • 4 mm to 21 mm body size available • 8 to 449 ball counts • 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available • JEDEC MO-216 compliant for 0.8 mm and 1.0 mm ball pitch • JEDEC MO-195 compliant for 0.5 mm & 0.65 mm ball pitch • PB free and Green package available • Daisy Chain packages available • Short traces for excellent electrical inductance • Low inductance (modeled data) 1.4nH (1.0 mm trace length) 4.1nH (5.0 mm trace length) Theta JA at 1.0 Watt and 0 airflow (°C/Watt) CABGA CTBGA CVBGA 8x8 37.28 36.45 37.52 10 x 10 19.86 29.04 26.7 11 x 11 29 N/A N/A 15 x 15 20.1 N/A N/A 19 x 19 17.04 N/A N/A Amkor assures reliable performance by continuously monitoring key indices: • Moisture sensitivity JEDEC Level 2 @ 240 °C characterization JEDEC Level 3 @ 260 °C 85 °C/85% RH, 168 hours • Temp/humidity 85 °C/85%, 1000 hours • High temp storage 150 °C, 1000 hours • HAST 130 °C/85% RH, 96 hours • Temp cycle -55/+125 °C, 1000 cycles Applications: The ChipArray package family is applicable for semiconductors such as memory, analog, ASICs, RF devices and simple PLDs requiring a smaller package size than conventional PBGAs. ChipArray packages fill the need for low cost, minimum space and high speed requirements of mobile phones and pagers, notebook and subnotebook personal computers, PDAs and other wireless systems. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS550N Rev Date: 01’07 LAMINATE data sheet CABGA/CTBGA/CVBGA SIDE VIEW TOP VIEW BOTTOM VIEW Process Highlights Die thickness (max) 0.27 mm (10.5 mils) Bond pad pitch (min) 50 µm (2 mils) Marking Laser Ball inspection Optical Pack options Dry pack Wafer backgrinding Available Standard Materials Package substrate -Conductor Copper -Dielectric Epoxy polyimide blend Die attach adhesive Low stress elastomer Encapsulant Epoxy mold compound Solder ball Eutectic SnPb/Pbfree Test Services Program Generation/Conversion Product Engineering Wafer sort 256 Pin x 20 MHz test system available -55 °C to +165 °C Test available Burn-in Shipping JEDEC trays Tape and Reel services CABGA/CTBGA/CVBGA Standard Package Offering Ball Pitch Body Size 4 4 5 5 6 6 6 6 7 7 7 7 7 8 8 8 8 9 9 9 9 1.0 0.80 0.75 Ball Ball Ball Count Count Count 16 25 36 49 42 64 48 49 64 44 46 48 64 64 72 81 94 100 72 80 81 48 48 64 0.65 0.50 Ball Ball Count Count 49 40 40 57 48 56 64 84 81 104 108 64 84 96 105 108 111 132 113 144 96 124 180 Ball Pitch Body Size 10 10 10 10 10 10 11 11 11 12 12 12 13 13 13 14 14 1.0 Ball Count 81 100 97 112 121 108 144 0.80 Ball Count 100 96 120 121 144 97 109 128 169 144 160 196 200 224 225 192 220 0.65 Ball Count 0.50 Ball Count 192 241 181 277 200 223 208 228 288 277 289 320 417 287 300 Ball Pitch Body Size 15 15 15 15 16 16 17 17 17 17 17 17 19 19 19 21 21 21 21 21 1.0 Ball Count 160 176 196 144 176 208 224 228 252 256 280 289 324 256 272 316 336 400 0.80 0.65 Ball Ball Count Count 208 273 324 280 285 256 272 280 292 316 0.50 Ball Count 256 324 288 449 180 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.