DISCRETE PACKAGE Data Sheet 8-pin mini-HVSON Standard Materials Introduction The 8-pin mini-HVSON package is a 65% reduction in foot print area (3.3 x 3.15 mm) compared to the standard SOP-8 package. The die pad is exposed to enhance thermal performance. This package may also be know as: • TSON8-FL • TSON-Adv • PowerFLAT™ 3.3 x 3.3 • TSDSON • PowerPAK® 1212-8 • JEDEC MO240 BA Applications The 8-pin mini-HVSON package is suitable for medium-power applications (reference values 50W*), designed for low on-resistance and highspeed switching MOSFETs: • Battery protection circuits • DC-DC converters for consumer products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • Cu clip interconnect for more efficient heat dissipation • Full turnkey available from wafer probe through test and packing • Green materials: Pb-free plating & halogen free mold compound Under Development • Leadframe: Ag strip plating • Die attach & clip attach: Pb solder • Interconnect: – Cu clip for lead source – Au/Cu wire for lead gate • Mold compound: Halogen free Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • All reliability testing includes: JEDEC standard pre-conditioning except high temperature storage • 85°C/85%RH, 168 hours, IR reflow 260°C 3X • PCT: 121°C/100%RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 300 cycles • High Temp Storage: 150°C, 1000 hours Test Services J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, diodes, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal resistance • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services • Environmentally friendly die attach Pb-free solder *1 Sampling test only Process Highlights • Tape and reel packing – 3000 pcs per reel – Tape width 12 mm – Reel Ф = 330 mm • Barcode packing label • Die attach: 70 µm thin die pick up capability • Interconnect: Cu clips technology for better electrical and thermal performance. • Plating: 100% matte Sn • Marking: Laser mark Shipping DSJD403A Rev Date: 3/15 www.j-devices.co.jp DISCRETE PACKAGE Data Sheet 8-pin mini-HVSON Top & Bottom View Cross-section Mold Compound Cu Clip Clip Attach Material Leadframe Die Die Attach Material Package Outline Drawing – 8-pin mini – HVSON Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD403A Rev Date: 3/15 www.j-devices.co.jp