DISCRETE PACKAGE Data Sheet 8-pin HVSON Standard Materials Introduction The 8-pin HVSON package is thinner than the HSON8 and maintains the same footprint area (5 x 6 mm) as a standard SOP-8 package. The die pad is exposed to enhance thermal performance. This package may also be know as: • • • • • SO8-FL SOP-Adv PowerFLAT™ 5 x 6 TDSON JEDEC MO240 AA Applications The 8-pin HVSON is suitable for medium-power applications (reference values 80W*), designed for low on-resistance and high-speed-switching MOSFETs: • DC-DC converters etc. for consumer products *Tc = 25°C, Tj = Max 150°C Enhanced Feature Options • 100% plated lead tips for uniform solder fillet height • Thin package with good thermal performance • Same size as SOP-8 package with exposed pad and Cu clip interconnect • Full turnkey available from wafer probe through test and packing • Green materials: Pb-free plating & halogen free mold compound • Leadframe: Ag strip plating • Die attach & clip attach: Pb solder • Interconnect: – Cu clip for lead source – Au/Cu wire for lead gate • Mold compound: Halogen free Reliability Qualification J-Devices packages are assembled with proven reliable semiconductor materials. • All reliability testing include JEDEC standard pre-conditioning except high temperature storage • 85°C/85%RH, 168 hours, IR reflow 260°C 3X • PCT: 121°C/100%RH/2 atm, 96 hours • Temp Cycle: -65°C/+150°C, 300 cycles • High Temp Storage: 150°C, 1000 hours Test Services J-Devices offers full turnkey business for all power discrete products with the capability to test various types of power devices including: MOSFETs, diodes, intelligent power devices, etc. • Power discrete test capability: – DC – Capacitance *1 – Rg *1 – Avalanche test – Thermal resistance • Program conversion • Electrical failure analysis • Integrated test, marking, vision inspection and tape & reel services Under Development *1 Sampling test only • Environmentally friendly die attach Pb-free solder Shipping Process Highlights • Die attach: Pb solder • Interconnect: Cu clips technology for better electrical and thermal performance. • Plating: 100% matte Sn • Marking: Laser mark • Tape and reel packing – 3000 pcs per reel – Tape width 12 mm – Reel Ф = 330 mm • Barcode packing label DSJD402A Rev Date: 3/15 www.j-devices.co.jp Data Sheet DISCRETE PACKAGE 8-pin HVSON Cross-section Mold Compound Top & Bottom View Cu Clip Clip Attach Material Leadframe Die Die Attach Material Package Outline Drawing – 8-pin – HVSON Unit: mm With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD402A Rev Date: 3/15 www.j-devices.co.jp