MOSFET MetalOxideSemiconductorFieldEffectTransistor CoolMOS™C6600V 600VCoolMOS™C6PowerTransistor IPx60R190C6 DataSheet Rev.2.2 Final PowerManagement&Multimarket 600V CoolMOS" C6 Power Transistor 1 IPA60R190C6, IPB60R190C6 IPI60R190C6, IPP60R190C6 IPW60R190C6 Description CoolMOS" is a revolutionary technology for high voltage power MOSFETs, designed according to the superjunction (SJ) principle and pioneered by Infineon Technologies. CoolMOS" C6 series combines the experience of the leading SJ MOSFET supplier with high class innovation. The offered devices provide all benefits of a fast switching SJ MOSFET while not sacrificing ease of use. Extremely low switching and conduction losses make switching applications even more efficient, more compact, lighter, and cooler. Features • • • • Extremely low losses due to very low FOM R dson*Qg and Eoss Very high commutation ruggedness Easy to use/drive JEDEC1) qualified, Pb-free plating, Halogen free drain pin 2 gate pin 1 Applications PFC stages, hard switching PWM stages and resonant switching PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV, Lighting, Server, Telecom and UPS. source pin 3 Please note: For MOSFET paralleling the use of ferrite beads on the gate or separate totem poles is generally recommended. Table 1 Key Performance Parameters Parameter Value Unit VDS @ Tj,max 650 V R DS(on),max 0.19 ! Qg,typ 63 nC ID,pulse 59 A Eoss @ 400V 5.2 µJ Body diode d i/d t 500 A/µs Type / Ordering Code Package Marking IPW60R190C6 PG-TO247 IFX C6 Product Brief IPB60R190C6 PG-TO263 IFX C6 Portfolio IPI60R190C6 PG-TO262 IPP60R190C6 PG-TO220 IPA60R190C6 PG-TO220 FullPAK 6R190C6 Related Links IFX CoolMOS Webpage IFX Design tools 1) J-STD20 and JESD22 Final Data Sheet 2 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Table of Contents Table of Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Final Data Sheet 3 Rev. 2.2, 2014-12-02 600V CoolMOSTM C6 Power Transistor IPx60R190C6 Maximum ratings 2 Maximum ratings at Tj = 25 °C, unless otherwise specified. Table 2 Maximum ratings Parameter Symbol 1) Continuous drain current Values ID Min. Typ. - - Unit Note / Test Condition A TC= 25 °C Max. 20.2 12.8 Pulsed drain current 2) TC= 100°C ID,pulse - - 59 A TC=25 °C Avalanche energy, single pulse EAS - - 418 mJ ID=3.4 A,VDD=50 V (see table 21) Avalanche energy, repetitive EAR - - 0.63 Avalanche current, repetitive - - 3.4 A MOSFET dv/dt ruggedness IAR dv/dt - - 50 V/ns VDS=0...480 V Gate source voltage VGS - 20 - 20 V static - 30 ID=3.4 A,VDD=50 V 30 AC (f>1 Hz) Power dissipation for TO-220, TO-247, TO-262, TO-263 Ptot - - 151 Power dissipation for TO-220 FullPAK Ptot - - 34 Operating and storage temperature Tj,Tstg - 55 - 150 °C - - 60 Ncm Mounting torque TO-220, TO-247 Mounting torque TO-220 FullPAK W 50 Continuous diode forward current Diode pulse current 2) TC=25 °C M3 and M3.5 screws M2.5 screws IS - - 17.5 A TC=25 °C TC=25 °C IS,pulse - - 59 A 3) Reverse diode dv/dt dv/dt - - 15 Maximum diode 3) commutation speed dif/dt - - 500 V/ns VDS=0...400 V,ISD& ID, A/µs Tj=25 °C (see table 22) - - 2500 V VISO Insulation withstand voltage TO-220 FullPAK 1) Limited by Tj,max. Maximum duty cycle D=0.75 2) Pulse widthtp limited by Tj,max VRMS, TC =25 °C, t = 1 min 3) Identical low side and high side switch with identical RG Final Data Sheet 4 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Thermal characteristics 3 Thermal characteristics Table 3 Thermal characteristics TO-220 (IPP60R190C6),TO-247 (IPW60R190C6),TO-262 (IPI60R190C6) Parameter Symbol Values Unit Min. Typ. Max. Thermal resistance, junction - case RthJC - - 0.83 Thermal resistance, junction ambient RthJA - - 62 Soldering temperature, wavesoldering only allowed at leads Tsold - - 260 Table 4 °C/W leaded °C 1.6 mm (0.063 in.) from case for 10 s Unit Note / Test Condition Thermal characteristics TO-220 FullPAK (IPA60R190C6) Parameter Symbol Values Min. Typ. Max. Thermal resistance, junction - case RthJC - - 3.7 Thermal resistance, junction ambient RthJA - - 80 Soldering temperature, wavesoldering only allowed at leads Tsold - - 260 Table 5 Note / Test Condition °C/W leaded °C 1.6 mm (0.063 in.) from case for 10 s Unit Note / Test Condition Thermal characteristics TO-263 (IPB60R190C6) Parameter Symbol Values Min. Typ. Max. Thermal resistance, junction - case RthJC - - 0.83 Thermal resistance, junction ambient - - 62 RthJA °C/W SMD version, device on PCB, minimal footprint 35 Soldering temperature, wave- & reflow soldering allowed Tsold - - SMD version, device on PCB, 6cm 2 cooling area1) 260 °C reflow MSL1 1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm 2 copper area (thickness 70µm) for drain connection. PCB is vertical without air stream cooling. Final Data Sheet 5 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics 4 Electrical characteristics Electrical characteristics, at Tj=25 °C, unless otherwise specified. Table 6 Static characteristics Parameter Symbol Values Unit Note / Test Condition V VGS=0 V, ID=0.25 mA Min. Typ. Max. Drain-source breakdown voltage V(BR)DSS 600 - - Gate threshold voltage VGS(th) 2.5 3 3.5 Zero gate voltage drain current IDSS - - 1 - 10 - - - 100 nA VGS=20 V, VDS =0 V - 0.17 0.19 ! VGS=10 V, ID=9.5 A, Tj=25 °C - 0.44 - - 8.5 - Gate-source leakage current IGSS Drain-source on-state resistance RDS(on) Gate resistance Table 7 RG VDS =VGS, ID=0.63mA µA VDS =600 V, VGS=0 V, Tj=25 °C VDS =600 V, VGS=0 V, Tj=150 °C VGS=10 V, ID=9.5 A, Tj=150 °C f=1 MHz, open drain ! Dynamic characteristics Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition pF VGS=0 V, VDS=100 V, f=1 MHz Input capacitance Ciss - 1400 - Output capacitance Coss - 85 - Effective output capacitance, energy related1) Co(er) - 56 - VGS=0 V, VDS=0...480 V Effective output capacitance, time related2) Co(tr) - 266 - ID=constant, VGS=0 V VDS=0...480V Turn-on delay time td(on) - 15 - Rise time tr - 11 - Turn-off delay time td(off) - 110 - ns VDD=400 V, VGS=13 V, ID=9.5A, RG= 3.4! (see table 20) Fall time tf 9 1) Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V (BR)DSS 2) Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS Final Data Sheet 6 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics Table 8 Gate charge characteristics Parameter Symbol Values Min. Typ. Max. Gate to source charge Qgs - 7.6 - Gate to drain charge Qgd - 32 - Gate charge total Qg - 63 - Gate plateau voltage Vplateau - 5.4 - Table 9 Unit Note / Test Condition nC VDD=480 V, ID=9.5A, VGS=0 to 10 V V Reverse diode characteristics Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Diode forward voltage VSD - 0.9 - V VGS=0 V, IF=9.5A, Tj=25 °C Reverse recovery time trr - 430 - ns Reverse recovery charge Qrr - 6.9 - µC VR=400 V, IF=9.5A, diF/dt=100 A/µs Peak reverse recovery current Irrm - 30 - A Final Data Sheet 7 (see table 22) Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics diagrams 5 Electrical characteristics diagrams Table 10 Power dissipation TO-220, TO-247, TO-262, TO-263 Power dissipation TO-220 FullPAK Ptot = f(TC) Ptot = f(TC) Table 11 Max. transient thermal impedance TO-220, TO-247, TO-262, TO-263 Max. transient thermal impedance TO-220 FullPAK Z(thJC)=f(tp); parameter: D=tp/T Final Data Sheet Z(thJC)=f(tp); parameter: D=t p/T 8 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics diagrams Table 12 Safe operating area TC=25 °C TO-220, TO-247, TO-262, TO-263 Safe operating area TC=25 °C TO-220 FullPAK ID=f(VDS); TC=25 °C; D=0; parameter tp ID=f(VDS ); TC=25 °C; D=0; parameter tp Table 13 Safe operating area TC=80 °C TO-220, TO-247, TO-262, TO-263 Safe operating area TC=80 °C TO-220 FullPAK ID=f(VDS); TC=80 °C; D=0; parameter tp ID=f(VDS); TC=80 °C; D=0; parameter tp Final Data Sheet 9 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics diagrams Table 14 Typ. output characteristics TC=25 °C Typ. output characteristics Tj=125 °C ID=f(VDS); Tj=25 °C; parameter: VGS ID=f(VDS); Tj=125 °C; parameter: VGS Table 15 Typ. drain-source on-state resistance Drain-source on-state resistance RDS(on)=f(ID); Tj=125 °C; parameter: VGS RDS(on)=f(Tj); ID=9.5 A; VGS=10 V Final Data Sheet 10 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics diagrams Table 16 Typ. transfer characteristics Typ. gate charge ID=f(VGS); VDS=20V VGS=f(Qgate), ID=9.5A pulsed Table 17 Avalanche energy Drain-source breakdown voltage EAS=f(Tj); ID=3.4 A; VDD=50 V VBR(DSS)=f(Tj); ID=0.25 mA Final Data Sheet 11 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Electrical characteristics diagrams Table 18 Typ. capacitances Typ. Coss stored energy C=f(VDS); VGS=0 V; f=1 MHz EOSS=f(VDS) Table 19 Forward characteristics of reverse diode IF=f(VSD); parameter: Tj Final Data Sheet 12 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Test circuits 6 Test circuits Table 20 Switching times test circuit and waveform for inductive load Switching times test circuit for inductive load Switching time waveform VDS 90% V DS V GS 10% VGS td(on) td(off) tr ton Table 21 tf toff Unclamped inductive load test circuit and waveform Unclamped inductive load test circuit Unclamped inductive waveform V(BR)DS ID VD V DS VDS VDS ID Table 22 Test circuit and waveform for diode characteristics Test circuit for diode characteristics Diode recovery waveform ID # /#) #/ $ $00 ( $ . " $ ) ! 00 ( ! . " ! ) $ 00 $. $) RG1 ) V DS %$! RG2 !. !) / #00 #/ $ --, '$! RG1 = RG2 Final Data Sheet $ --, "--, --, .*+$$$&& 13 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Package outlines 7 Package outlines Figure 1 Outlines TO-247, dimensions in mm/inches Final Data Sheet 14 Rev. 2.2, 2014-12-02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Package outlines Figure 2 Outlines TO-220, dimensions in mm/inches Final Data Sheet 15 Rev. 2.2, 2014-12-02 6**M =^^[FGKm =6 H^fTa LaP]bXbc^a CHx6*J190=6 /45<487 @DC=;?7B ),/ ' '# '$ 9 9# 9$ 9% 9& ; ) )# * = =# 0 + . .# @3 3 ;XVc`T ! >X]P[ <PcP KWTTc /,..,/*6*45 MIN MAX 4.50 4.90 2.34 2.85 2.42 2.86 0.90 0.65 0.95 1.38 1.51 0.95 0.65 1.38 0.65 1.51 0.63 0.40 16.15 15.67 9.83 8.97 10.65 10.00 2.54 (BSC) ,0(+*5 MIN 0.177 0.092 0.095 0.026 0.037 0.037 0.026 0.026 0.016 0.617 0.353 0.394 )1(7/*06 01" Z8B00003319 5('.* 0 2.5 0 2.5 5mm *7412*'0 241-*(6,10 0.100 (BSC) 5.08 3 28.70 12.78 2.83 2.95 3.15 MAX 0.193 0.112 0.113 0.035 0.054 0.059 0.054 0.059 0.025 0.636 0.387 0.419 0.200 3 29.75 13.75 3.45 3.38 3.50 1.130 0.503 0.111 0.116 0.124 1.171 0.541 0.136 0.133 0.138 ,557* )'6* 05-05-2014 4*8,5,10 04 Dcb[X]T E<%HD **( ;c[[E5@$ SX\T]aX^]a X] \\'X]RWTa +6 JTe( ,(,& ,*+.'12'02 600V CoolMOS" C6 Power Transistor IPx60R190C6 Package outlines Figure 4 Outlines TO-262, dimensions in mm/inches Final Data Sheet 17 Rev. 2.2, 2014-12-02 )$$4 +AA>./2H +) 0AF8B 3B5@C<CDAB -0G)$1%*$+) 056=598 AED><@8C ,<9EB8 ( /ED><@8C 3/"&)'! 7<?8@C<A@C <@ ??#<@6;8C *02-1 )-3- ,/..3 %' +.4# Rev. &#%! 2.2, &$"$&"$( 2014-12-02 600VCoolMOS™C6PowerTransistor IPx60R190C6 RevisionHistory IPx60R190C6 Revision:2015-02-09,Rev.2.2 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2011-06-08 Release of final data sheet 2.1 2011-09-14 - 2.2 2015-02-09 PG-TO220 FullPAK package outline update (creation:2014-12-02) WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: [email protected] Publishedby InfineonTechnologiesAG 81726München,Germany ©2015InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. 19 Rev.2.2,2015-02-09