IPA60R1K0CE MOSFET 600VCoolMOS™CEPowerTransistor TO-220FP CoolMOS™isarevolutionarytechnologyforhighvoltagepower MOSFETs,designedaccordingtothesuperjunction(SJ)principleand pioneeredbyInfineonTechnologies.CoolMOS™CEisa price-performanceoptimizedplatformenablingtotargetcostsensitive applicationsinConsumerandLightingmarketsbystillmeetinghighest efficiencystandards.Thenewseriesprovidesallbenefitsofafast switchingSuperjunctionMOSFETwhilenotsacrificingeaseofuseand offeringthebestcostdownperformanceratioavailableonthemarket. Features •ExtremelylowlossesduetoverylowFOMRdson*QgandEoss •Veryhighcommutationruggedness •Easytouse/drive •Pb-freeplating,Halogenfreemoldcompound •Qualifiedforstandardgradeapplications Drain Pin 2, Tab Gate Pin 1 Applications Source Pin 3 PFCstages,hardswitchingPWMstagesandresonantswitchingstages fore.g.PCSilverbox,Adapter,LCD&PDPTVandindoorlighting. Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate orseparatetotempolesisgenerallyrecommended. Table1KeyPerformanceParameters Parameter Value Unit VDS @ Tj,max 650 V RDS(on),max 1000 mΩ Id. 6.8 A Qg.typ 13 nC ID,pulse 12 A Eoss@400V 1.3 µJ Type/OrderingCode Package IPA60R1K0CE PG-TO 220 FullPAK Final Data Sheet Marking 60S1K0CE 1 RelatedLinks see Appendix A Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Final Data Sheet 2 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE 1Maximumratings atTj=25°C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current1) Values Unit Note/TestCondition 6.8 4.3 A TC=25°C TC=100°C - 12 A TC=25°C - - 46 mJ ID=0.8A; VDD=50V; see table 11 EAR - - 0.13 mJ ID=0.8A; VDD=50V; see table 11 Avalanche current, repetitive IAR - - 0.8 A - MOSFET dv/dt ruggedness dv/dt - - 50 V/ns VDS=0...480V Gate source voltage (static) VGS -20 - 20 V static; Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz) Power dissipation TO-252 Ptot - - 61 W TC=25°C Power dissipation (FullPAK) TO-220FP Ptot - - 26 W TC=25°C Storage temperature Tstg -40 - 150 °C - Operating junction temperature Tj -40 - 150 °C - Continuous diode forward current IS - - 4.8 A TC=25°C Diode pulse current IS,pulse - - 12 A TC=25°C Reverse diode dv/dt3) dv/dt - - 15 V/ns VDS=0...400V,ISD<=IS,Tj=25°C see table 9 Maximum diode commutation speed dif/dt - - 500 A/µs VDS=0...400V,ISD<=IS,Tj=25°C see table 9 Mounting torque (FullPAK) TO-220FP - - - 50 Ncm M2.5 screws Insulation withstand voltage for TO-220FP VISO - - 2500 V Vrms,TC=25°C,t=1min Unit Note/TestCondition Min. Typ. Max. ID - - Pulsed drain current2) ID,pulse - Avalanche energy, single pulse EAS Avalanche energy, repetitive 2) 2Thermalcharacteristics Table3Thermalcharacteristics(FullPAK)TO-220FP Parameter Symbol Thermal resistance, junction - case Values Min. Typ. Max. RthJC - - 4.9 °C/W - Thermal resistance, junction - ambient RthJA - - 80 °C/W leaded Soldering temperature, wavesoldering only allowed at leads - - 260 °C Tsold 1.6mm (0.063 in.) from case for 10s 1) Limited by Tj max, TO252 equivalent, Maximum duty cycle D=0.5 Pulse width tp limited by Tj,max 3) IdenticallowsideandhighsideswitchwithidenticalRG 2) Final Data Sheet 3 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE 3Electricalcharacteristics atTj=25°C,unlessotherwisespecified Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=0.25mA 3.0 3.5 V VDS=VGS,ID=0.13mA - 10 1 - µA VDS=600,VGS=0V,Tj=25°C VDS=600,VGS=0V,Tj=150°C IGSS - - 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 0.86 2.22 1.00 - Ω VGS=10V,ID=1.5A,Tj=25°C VGS=10V,ID=1.5A,Tj=150°C Gate resistance RG - 16 - Ω f=1MHz,opendrain Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 600 - Gate threshold voltage V(GS)th 2.5 Zero gate voltage drain current IDSS Gate-source leakage current Table5Dynamiccharacteristics Parameter Symbol Input capacitance Values Min. Typ. Max. Ciss - 280 - pF VGS=0V,VDS=100V,f=1MHz Output capacitance Coss - 21 - pF VGS=0V,VDS=100V,f=1MHz Effective output capacitance, energy related1) Co(er) - 14 - pF VGS=0V,VDS=0...480V Effective output capacitance, time related2) Co(tr) - 57 - pF ID=constant,VGS=0V,VDS=0...480V Turn-on delay time td(on) - 10 - ns VDD=400V,VGS=10V,ID=1.9A, RG=12.2Ω;seetable10 Rise time tr - 8 - ns VDD=400V,VGS=10V,ID=1.9A, RG=12.2Ω;seetable10 Turn-off delay time td(off) - 60 - ns VDD=400V,VGS=10V,ID=1.9A, RG=12.2Ω;seetable10 Fall time tf - 13 - ns VDD=400V,VGS=10V,ID=1.9A, RG=12.2Ω;seetable10 Unit Note/TestCondition Table6Gatechargecharacteristics Parameter Symbol Gate to source charge Values Min. Typ. Max. Qgs - 1.5 - nC VDD=480V,ID=1.9A,VGS=0to10V Gate to drain charge Qgd - 6.5 - nC VDD=480V,ID=1.9A,VGS=0to10V Gate charge total Qg - 13 - nC VDD=480V,ID=1.9A,VGS=0to10V Gate plateau voltage Vplateau - 5.4 - V VDD=480V,ID=1.9A,VGS=0to10V 1) Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to80%Vo(BR)DSS Co(tr)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to80%Vo(BR)DSS 2) Final Data Sheet 4 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE Table7Reversediodecharacteristics Parameter Symbol Diode forward voltage Values Unit Note/TestCondition - V VGS=0V,IF=1.9A,Tj=25°C 220 - ns VR=400V,IF=1.9A,diF/dt=100A/µs; see table 9 - 1.5 - µC VR=400V,IF=1.9A,diF/dt=100A/µs; see table 9 - 12 - A VR=400V,IF=1.9A,diF/dt=100A/µs; see table 9 Min. Typ. Max. VSD - 0.9 Reverse recovery time trr - Reverse recovery charge Qrr Peak reverse recovery current Irrm Final Data Sheet 5 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation(FullPAK) Diagram2:Safeoperatingarea(FullPAK) 102 40 1 µs 101 10 µs 30 100 µs 1 ms 10 ms ID[A] Ptot[W] 100 20 DC 10-1 10 10-2 0 0 25 50 75 100 125 10-3 150 100 101 TC[°C] 102 103 VDS[V] Ptot=f(TC) ID=f(VDS);TC=25°C;D=0;parameter:tp Diagram3:Safeoperatingarea(FullPAK) Diagram4:Max.transientthermalimpedance(FullPAK) 2 101 10 0.5 101 1 µs 10 µs 0.2 100 100 µs 0.1 ID[A] ZthJC[K/W] 1 ms 10 ms 100 DC 10-1 0.05 0.02 10-1 0.01 single pulse 10-2 10-3 100 101 102 103 10-2 10-5 10-4 VDS[V] 10-2 10-1 tp[s] ID=f(VDS);TC=80°C;D=0;parameter:tp Final Data Sheet 10-3 ZthJC=f(tP);parameter:D=tp/T 6 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE Diagram5:Typ.outputcharacteristics Diagram6:Typ.outputcharacteristics 12 8 20 V 11 10 V 20 V 7 10 V 10 8V 8V 9 6 7V 8 5 7V ID[A] ID[A] 7 6 4 6V 3 5.5 V 2 5V 5 4 6V 3 5.5 V 2 5V 1 0 4.5 V 1 4.5 V 0 5 10 15 0 20 0 5 10 VDS[V] 15 20 VDS[V] ID=f(VDS);Tj=25°C;parameter:VGS ID=f(VDS);Tj=125°C;parameter:VGS Diagram7:Typ.drain-sourceon-stateresistance Diagram8:Drain-sourceon-stateresistance 5.0 2.00 4.5 1.80 1.60 4.0 1.40 5.5V 5V 6.5 V 6V 7V RDS(on)[Ω] RDS(on)[Ω] 3.5 3.0 10 V 98% 1.20 Typ 1.00 2.5 0.80 2.0 0.60 1.5 1.0 0.40 0 1 2 3 4 5 6 7 8 9 0.20 -50 -25 0 25 ID[A] RDS(on)=f(ID);Tj=125°C;parameter:VGS Final Data Sheet 50 75 100 125 150 Tj[°C] RDS(on)=f(Tj);ID=1.5A;VGS=10V 7 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE Diagram9:Typ.transfercharacteristics Diagram10:Typ.gatecharge 12 10 25 °C 9 10 8 120 V 480 V 7 8 VGS[V] ID[A] 6 150 °C 6 5 4 4 3 2 2 1 0 0 2 4 6 8 10 0 12 0 3 VGS[V] 6 9 12 15 125 150 Qgate[nC] ID=f(VGS);VDS=20V;parameter:Tj VGS=f(Qgate);ID=1.9Apulsed;parameter:VDD Diagram11:Forwardcharacteristicsofreversediode Diagram12:Avalancheenergy 2 10 50 25 °C 125 °C 40 101 IF[A] EAS[mJ] 30 20 0 10 10 10-1 0.0 0.5 1.0 1.5 2.0 0 25 50 VSD[V] 100 Tj[°C] IF=f(VSD);parameter:Tj Final Data Sheet 75 EAS=f(Tj);ID=0.8A;VDD=50V 8 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE Diagram13:Drain-sourcebreakdownvoltage Diagram14:Typ.capacitances 104 700 680 660 103 Ciss 620 C[pF] VBR(DSS)[V] 640 600 102 Coss 580 101 560 540 Crss 520 -75 -50 -25 0 25 50 75 100 125 150 175 100 0 100 Tj[°C] 200 300 400 500 VDS[V] VBR(DSS)=f(Tj);ID=0.25mA C=f(VDS);VGS=0V;f=1MHz Diagram15:Typ.Cossstoredenergy 2.0 Eoss[µJ] 1.5 1.0 0.5 0.0 0 100 200 300 400 500 VDS[V] Eoss=f(VDS) Final Data Sheet 9 Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE 5TestCircuits Table8Diodecharacteristics Test circuit for diode characteristics Diode recovery waveform V ,I Rg1 VDS( peak) VDS VDS VDS trr IF Rg 2 tF tS dIF / dt IF QF IF dIrr / dt trr =tF +tS Qrr = QF + QS Irrm Rg1 = Rg 2 t 10 %Irrm QS Table9Switchingtimes Switching times test circuit for inductive load Switching times waveform VDS 90% VDS VGS VGS 10% td(on) ton tr td(off) tf toff Table10Unclampedinductiveload Unclamped inductive load test circuit Unclamped inductive waveform V(BR)DS ID VDS VDS Final Data Sheet 10 ID VDS Rev.2.0,2016-02-26 600VCoolMOS™CEPowerTransistor IPA60R1K0CE 6PackageOutlines ),/ ' '# '$ 9 9# 9$ 9% 9& ; ) )# * = =# 0 + . .# @3 3 /,..,/*6*45 MIN MAX 4.50 4.90 2.34 2.85 2.86 2.42 0.65 0.90 0.95 1.38 0.95 1.51 0.65 1.38 0.65 1.51 0.40 0.63 15.67 16.15 8.97 9.83 10.00 10.65 2.54 (BSC) ,0(+*5 MIN 0.177 0.092 0.095 0.026 0.037 0.037 0.026 0.026 0.016 0.617 0.353 0.394 )1(7/*06 01" Z8B00003319 5('.* 0 2.5 0 2.5 5mm *7412*'0 241-*(6,10 0.100 (BSC) 5.08 3 28.70 12.78 2.83 2.95 3.15 MAX 0.193 0.112 0.113 0.035 0.054 0.059 0.054 0.059 0.025 0.636 0.387 0.419 0.200 3 29.75 13.75 3.45 3.38 3.50 1.130 0.503 0.111 0.116 0.124 1.171 0.541 0.136 0.133 0.138 ,557* )'6* 05-05-2014 4*8,5,10 04 Dimensions do not include mold flash, protrusions or gate burrs Figure 1 Final Data Sheet Outline PG-TO 220 FullPAK, dimensions in mm/inches 11 Rev.2.0,2016-02-26 600V CoolMOS™ CE Power Transistor IPA60R1K0CE 7 Appendix A Table 11 Related Links • IFX CoolMOS TM CE Webpage: www.infineon.com • IFX CoolMOS TM CE application note: www.infineon.com • IFX CoolMOS TM CE simulation model: www.infineon.com • IFX Design tools: www.infineon.com Final Data Sheet 12 Rev. 2.0, 2016-02-26 600V CoolMOS™ CE Power Transistor IPA60R1K0CE Revision History IPA60R1K0CE Revision: 2016-02-26, Rev. 2.0 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2016-02-26 Release of final version Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK™, i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. 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The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Final Data Sheet 13 Rev. 2.0, 2016-02-26