N EW VT-X700-E, VT-X700-L High-speed automated X-ray CT inspection system Market Trends and Issues Miniaturization Lightweighting Density enhancement The higher the engineering demands, the greater the challenge in Jisso (surface mounting) design. Compromised solder joint strength Miniaturized chips Bottom surface electrodes (BGA or CSP) Narrow pitches Shield mounting Enhanced need of hidden joint inspection Solder joint reliability must be ensured while overcoming various design constraints. Omron's X-Ray Inspection System with 3D-CT Method The 3D-CT method enables the inspection of indistinct X-ray camera shapes which 2D or pseudo CT cannot detect. 2D method (transparent) image VT-X700 CT image PCBs X-ray source No difference from quality product Clear difference from quality product Making the impossible in design a reality! · Bottom surface f mounting ti (P (Partial ti l mounting ti e.g. on a BGA b bottom tt iis now possible) · Sufficient solder fillet shape is ensured even for hidden joints · Enhanced application of packaged components Pinpoint Inspection The cross-sectional images of relevant inspection targets can be easily selected 3D-CT Method from abundant camera-image libraries to ensure precise fault detection. Quality product Cross-section image CT image Cross-section image CT image Wettability defect Enlarged view of rendered image Full coverage High-Output X-Ray Source Component types Normal Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source. CT image Defect CT image Insufficient soldering Through Hole Device (THD) Lifting Lead components Transistors, gull-wing type (SOP • QFP) Insufficient soldering QFN Insufficient soldering Chips IC chip * 3D graphic image Void Power devices (e.g. IGBT, MOS-FET) : Imaging cross section Compatibility with L-Sized (610 mm × 610 mm) PCBs * The 3D graphic images used in this catalog were created using VGStudio from Volume Graphics GmbH. Compatible with large-sized PCBs such as those used by network base stations. High-speed World's highest CT speed* thanks to our patent-approved technologies. 10% Reduction in Inspection Tact Time (Internal Comparison) New imaging system reduced inspection tact times by 10% compared with conventional systems. Enabled the complete inspection of all components (almost impossible by visible light-based inspection). * Based on an internal research conducted in January 2015. Specifications Hardware configuration/function specifications Item Description Model VT-X700-E Inspected components VT-X700-L BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices Inspected items Openings, non-wet, solder amount, shifting, foreign object stuck, bridging, lead presence, etc. (selectable to suit detected item) Imaging method Imaging specifications 3D-slice imaging using parallel CT Resolution 10, 15, 20, 25 or 30 μm (selectable to suit detected item) X-ray source Micro-focus closed tube (130 kV) X-ray detector Size Inspected PCBs Flat panel detector M-size PCB (50 mm x 50 mm to 330 mm x 255 mm); thickness: 0.4 mm to 3.0 mm PCB (50 mm x 50 mm to 610 mm x 610 mm); thickness: 0.6 mm to 7.0 mm 2.0 kg or lighter (with components mounted) 12.0 kg or lighter (with components mounted) Weight Top: 50 mm or shorter; bottom: 20 mm or shorter Mounted component height Warpage/Flexure Dimensions 3.0 mm or less 2,180 (W) x 2,500 (D) x 1,720 (H) mm Approx. 2,920 kg Weight Device specifications 2.0 mm or less 1,550(W) x 1,650(D) x 1,620(H)mm Approx. 5,250 kg 900±15 mm PCB transfer height Power supply voltage Single phase, 200/210/220/230/240 VAC (± 10%), 50/60 Hz 3 phase, 200/210/220/230/240 VAC, 380/405/415/440 VAC (± 10%), 50/60 Hz 3.1 kVA 4.7 kVA Rated power X-ray leakage Less than 0.5 μSv/h Dimensions VT-X700-E * Contact Omron's sales representative for the VT-X700-L external dimensions. This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions . This product may cause interference if used in residential areas. OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION SALES DEPARTMENT Shinagawa Front Bldg. Conference 7F 2-3-13 Kounan Minato-ku Tokyo 108-0075 JAPAN TEL +81-3-6718-3550 FAX:+81-3-6718-3553 OMRON INDUSTRIAL AUTOMATION (CHINA) CO., LTD. F20,TowerA,NEO Building,6011ShennanAvenue, Futian District, Shenzhen, Guangdong 518048, China TEL: +86-755-8359-9028 FAX: +86-755-8359-9628 Cat. No. Q327-E1-04 Omron AOI Business Europe, Omron Europe B.V. Zilverenberg 2, 5234 GM 's-Hertogenbosch, The Netherlands TEL: +31 (0)736-481811 FAX: + 31 (0)736-481879 OMRON ELECTRONICS LLC 2895 Greenspoint Parkway, Suite 200 Hoffman Estates, IL 60169 U.S.A TEL:+1-847-843-7900 FAX:+1-847-843-7787 Authorized Distributor: OMRON ELECTRONICS KOREA CO.,LTD. 21F, KyoboTower B Wing, 465, Gangnam-daero, Seocho-gu, Seoul, Korea 137-920 TEL: +82-2-3483-7789 FAX: +82-2-3483-7788 OMRON ASIA PACIFIC PTE LTD 438A Alexandra Road #05-05/08 (Lobby 2) Alexandra Technopark Singapore 119967 TEL:+65-6835-3011 FAX:+65-6835-2711 Note: Specifications subject to change without notice 0416(1215)(O)