N EW VT-X700, VT-X900 High speed automated X-ray CT inspection system For SEMICONDUCTOR VT-X700, VT-X900 VT-X700 VT-X900 Omron‘s unique Automated inspection capability ensures process quality in a mass-production environment by using Submicron CT imaging with a variety of Metrology data. Trends • Downsizing package • Higher density with stacked layer • Variety of device combination (SiP) Technology Omron’s proven 3D-CT technology leads through - Fast and Quantitative metrology - Stable Imaging with Sub-Micron Magnification - Recipe-based Automated Inspection Traditional X-Ray analysis Omron’s 3D rendering image Variety of data output 100 95 90 85 80 Bump ID_19 Bump ID_20 Bump ID_17 Bump ID_18 Bump ID_15 Bump ID_16 Bump ID_13 Bump ID_14 Bump ID_11 Bump ID_12 Bump ID_9 Bump ID_7 Bump ID_8 Bump ID_6 Bump ID_4 Bump ID_5 Bump ID_10 Sharp image to both top and bottom bumps Bump ID_3 Bump ID_1 Doesn’t differentiate between stacked bumps Bump ID_2 75 Quantify the process condition Automated Inspection and Metrology in mass production environment Application • Package on package (PoP) • System in package (SiP) • Flip Chip micro bump • Micro-bump on Wafer • Micro-bump on Lead Frame • Build in mass-production condition • Initial quality confirmation after lot change over • Monitor mass-production quality • Root cause analysis of defects Metrology Global cloud 3D-CT delivers automated inspection and output measurement results in parallel. Realizing quantitative understanding without destroying the sample, enables first article inspection confirmation after lot change over and facilitates the monitoring of production equipment performance and the key metrics of production. Stored data can be used for root cause analysis, which can then be shared globally for process improvement through the cloud system. Image figure in the factory VT-X900 Equipment Measurement data Analysis results Automated Inspection Omron uses its own algorithm and inspection logic to measure the key features of the sample and compare it to the Inspection image quality standard. Any features found outside the standard are indicated including a fault type. Defects found on Double X-section image X-Y Image sided boards or stacked devices are identified by layer. Inspection logic example Non-Contact-Open Inspection Solder wet fault and/or open fault is detected. Bad Vertical slice Normal Alignment Inspection The joint area position shift fault of a solder bump on the die and substrate is detected. Bad Vertical slice X-Z Image Y-Z Image Normal Defect Analysis 3D rendering images can be generated by 3D Analysis image voxel data (3D volume data) output from system (software option). Virtual slices enable observing bump shape and defect condition without destroying the sample. Vertical Slice Horizontal Slice Specifications* Hardware configuration/function specifications Item Description Model VT-X700-M VT-X900 Parallel CT, 3D slice imaging Imaging method Imaging resolution Max. Inspection area Imaging device Source 0.3, 0.5, 0.7, 1.0, 2.0, 3.0 μm 330 mm x 255 mm 330 mm x 330 mm 110 kV closed tube 110 kV open tube 5M pixels flat panel detector 4M pixels I.I. camera 1,550(W) x 1,650(D) x 1,620(H) mm 2,271(W) x 1,707(D) x 1,889(H) mm Approx. 2,900 kg Approx. 3,300 kg Rated voltage Single phase 200/210/220/230/240 VAC (±10%) Single phase 200/208/220/230/240 VAC (±10%) Rated power 2.9 kVA 6.0 kVA Oil free air 0.4 to 0.6 MPa 0.4 to 0.6 MPa X-Ray leakage < 0.5 μSv/hr < 0.5 μSv/hr Detector Dimension Weight Tool specification 10, 15, 20, 25, 30 μm CE, SEMI S2/S8, SECS/GEM, NFPA79, FDA Standard *The specification subject to change without notice. Dimensions VT-X700-M VT-X900 1650 1707 2271 1650 1620 1889 1550 This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions . This product may cause interference if used in residential areas. OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION SALES DEPARTMENT Shinagawa Front Bldg. Conference 7F 2-3-13 Kounan Minato-ku Tokyo 108-0075 JAPAN TEL +81-3-6718-3550 FAX:+81-3-6718-3553 Omron AOI Business Europe, Omron Europe B.V. Zilverenberg 2, 5234 GM 's-Hertogenbosch, The Netherlands TEL: +31 (0)736-481811 FAX: + 31 (0)736-481879 OMRON ELECTRONICS LLC 2895 Greenspoint Parkway, Suite 200 Hoffman Estates, IL 60169 U.S.A TEL:+1-847-843-7900 FAX:+1-847-843-7787 Authorized Distributor: OMRON ELECTRONICS KOREA CO.,LTD. 21F, KyoboTower B Wing, 465, Gangnam-daero, Seocho-gu, Seoul, Korea 137-920 TEL: +82-2-3483-7789 FAX: +82-2-3483-7788 OMRON INDUSTRIAL AUTOMATION (CHINA) CO., LTD. F20,TowerA,NEO Building,6011ShennanAvenue, OMRON ASIA PACIFIC PTE LTD Futian District, Shenzhen, Guangdong 438A Alexandra Road #05-05/08 (Lobby 2) 518048, China TEL: +86-755-8359-9028 FAX: +86-755-8359-9628 Alexandra Technopark Singapore 119967 TEL:+65-6835-3011 FAX:+65-6835-2711 C Cat. No. Q326-E1-02 OMRON Corporation 2015 All Rights Reserved. Note: Specifications subject to change without notice 0416(0215)(O)