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MLX90609
Angular Rate Sensor (Standard version)
Standard Features and Benefits
Application
High resolution and dynamic range
Both digital (SPI) and analog outputs
Low acceleration and angular rate cross
sensitivity
Low zero rate output drift
Cost effective and compact solution
High-performance MEMS sensor in mono
crystalline Si yielding a superior long term
behavior reliability and dynamic range
Programmable bandwidth
Factory set full scale range
On chip EEPROM calibration
Small footprint (SMD CLCC32) with horizontal
mounting
Operating temperature range: -40°C to 85°C
Navigation (dead reckoning)
Vehicle stability
Robots
The MLX90609 has various build in features to support automotive and high volume applications
(built-in on demand and non disruptive continuous self test, serial number in EEPROM…). These
types of applications needs close cooperation between the customer and Melexis. Please contact
Melexis in case you have such an application.
Ordering Information
Part No.
Temperature Code
Package Code
MLX90609EEA-N2
E (-40°C to 85°C)
EA (CLCC32)
MLX90609EEA-E2
E (-40°C to 85°C)
EA (CLCC32)
MLX90609EEA-R2
E (-40°C to 85°C)
EA (CLCC32)
Note: Other Full Scale Ranges can be provided. Please contact Melexis.
Functional Diagram
Option code
N2
E2
R2
Full Scale Range
±75 °/s
±150 °/s
±300 °/s
General Description
The MLX90609 Angular Rate Sensor is a full
gyroscopic system. A single SMD package
contains a high performance silicon micro
machined sensor with signal conditioning
circuitry. It operates from 5V supply and is
designed
for
demanding
automotive
applications.
The MLX90609 delivers two output signals
proportional to the angular rate perpendicular
to the assembly surface. One of the output
signals is in an analog voltage format (the
output is 2.5V at zero angular rate and the full
scale angular rate produces an output of 4.5V
or 0.5V depending on direction of rotation)
and the other one is in digital SPI format.
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Data Sheet
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MLX90609
Angular Rate Sensor (Standard version)
Table of Contents
1. Maximum Ratings ............................................................................................................ 3
2. Pin Definitions and Descriptions ...................................................................................... 4
3. MLX90609 General Electrical Specifications ................................................................... 5
4. MLX90609 Sensor Specific Specifications....................................................................... 6
5. Detailed Description......................................................................................................... 8
5.1 The Working Principle ................................................................................................. 8
5.2 Communication with the MLX90609 through the SPI.................................................. 9
5.3 Usage of the ADC ..................................................................................................... 12
5.3.1 ADC Instructions and Answers ........................................................................... 13
• The Refusal Answer...................................................................................... 13
• Command of the Status Reading (STATR) ................................................... 13
• Command of the ADC Control (ADCC) ......................................................... 13
• Command of the ADC Reading (ADCR) ....................................................... 13
5.3.2 Reading the Digital Angular Rate or Temperature (suggested procedure) ......... 14
6. Applications Examples................................................................................................... 15
7. Standard Information Regarding Manufacturability of Melexis Products with Different
Soldering Processes .......................................................................................................... 18
8. ESD Precautions............................................................................................................ 18
9. Package Information ...................................................................................................... 19
10. Glossary of Terms........................................................................................................ 20
11. Disclaimer .................................................................................................................... 22
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Data Sheet
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MLX90609
Angular Rate Sensor (Standard version)
1. Maximum Ratings
MLX90609 operates without failure, for 6500 hours with a certain temperature profile in the
40°C to +85ºC range.
-
The MLX90609 meets the following maximum ratings over the entire operating temperature range
and supply voltage range unless otherwise indicated. The current polarity is positive if the current
flows into a terminal. All voltages are referenced to VSS.
Parameter.
Min
Max
Units
Comments
No latch-up or damage.
Rise time (10 to 90%):
tr ≥ 0.5µs.
Supply Voltage, VDD
-0.5
7
V
Supply Voltage, VDD
4.75
5.25
V
Operating within specifications
25
mA
VDD = 0 to 7V
guaranteed by characterization
Output pins (OUTAR, OUTTEMP, all digital IO’s)
current limit, shorted to VDD or VSS pin
Operating Temperature Range, TAMBIENT
-40
85
°C
Operating Temperature Range, TJUNCTION
-40
110
°C
Storage Temperature Range
-55
125
°C
100
°C/W
150
mA
CDF - AEC - Q100-004;
VDD= 5.75V
±1500
g
Shock 0.5ms, 3 axis
Package Thermal Resistance
Latch-up withstand
Acceleration shock survival
-150
Output not shorted
Table 1. Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability.
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Data Sheet
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MLX90609
Angular Rate Sensor (Standard version)
2. Pin Definitions and Descriptions
Figure 2-1. MLX90609 pin-out
Group
Power Supply Pins
Serial Communication Pins
Factory Test Pins
User Diagnostic Pins
Output Pins
General purpose pins
Pin Name
Function
VSS
Digital ground 0V
VDD
Digital 5V
VDDA
Analog Supply 5V
VSSA
Analog ground, 0V, externally tied to digital ground
SCLK
Clock for serial data transfer, In, digital
MISO
Master In, Slave Out
MOSI
Master Out, Slave In
SS
Slave/Chip select (active low)
TEST
Test-mode control pin (internal pull-down,
In application tight to ground for EMC reasons)
TESTIN
In application tight to ground for EMC reasons
TESTOUT
Do not connect
SELFTEST
User on request self test input (for automotive applications)
ERROR
Continuous self test output (for automotive applications)
OUTAR
Analog angular rate output
OUTTEMP
Analog output of the temperature sensing module
VREF
2.5V Output reference voltage
HVIN
High voltage filter capacitor
FLT
External capacitor for bandwidth setting
TOPCAP
Tie to VSSA
CASE
Tie to VSSA
NC
Tie to VSSA
FLT
External capacitor for bandwidth setting
Table 2. MLX90609 Pin description
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Data Sheet
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MLX90609
Angular Rate Sensor (Standard version)
3. MLX90609 General Electrical Specifications
DC Operating Parameters TA = -40°C to 85°C, VDD = 4.75V to 5.25V.
Parameter.
Symbol
Supply Voltage
VDD
Supply Current
IDD
Test Conditions
Min
Typ
4.75
No output load
16
Max
Units
5.25
V
20
mA
Output capacitive load to VDD or VSS
Analog output
0
100
pF
Output resistive load
Analog output
200k
∞
Ohm
Output, max
U OUT ,Ω max
Analog output
4.5
V
Output, min
U OUT ,Ω min
Analog output
0.5
V
Voltage Reference load current Note 3
IREF
Analog output
-10
10
µA
Logic Input, Low Voltage
VIL
SS , MOSI
0
0.3 x VDD
V
Logic Input, High Voltage
VIH
SS , MOSI
0.7 x VDD
VDD
V
Clock Input, Low Voltage
VILC
SCLK
0
0.8
V
Clock Input, High Voltage
VIHC
SCLK
2.8
VDD
V
Clock Input, Hysteresis Voltage
VHC
SCLK
Logic Output, Low Voltage
VOL
MISO, ERROR, IO < 8 mA
0
0.4
V
Logic Output, High Voltage
VOH
MISO, ERROR, IO < 8 mA
2.4
VDD
V
Input high current with pull-up
IIH_UP
SS , SCLK, VIN = VDD
-10
10
µA
Input low current with pull-up
IIL_UP
SS , SCLK, VIN = VSS
-10
-200
µA
Input high current with pull-down
IIH_DOWN
MOSI, VIN = VDD
200
10
µA
Input low current with pull-down
IIL_DOWN
MOSI, VIN = VSS
-10
10
µA
Tri-State Output Leakage current
IOZ
MISO
-10
10
µA
1.1
V
Table 3. DC Electrical Characteristics
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MLX90609
Angular Rate Sensor (Standard version)
4. MLX90609 Sensor Specific Specifications
DC Operating Parameters TA = -40°C to 85°C, VDD = 4.75V to 5.25V (unless otherwise specified)
Parameter
Symbol
Output Full Scale
(on OUTAR pin)
FS OUT = U OUT , Ω max
− U OUT , Ω min
Full Scale Range
FSin
Min
Factory set for N2 version
Factory set for E2 version
Factory set for R2 version
Linearity Note 2
Typ
FS
S0 = OUT
FS IN
Zero Rate Output (Bias)
ZRO
1920
LSB
±75
±150
±300
°/s
Zero Rate Temperature drift
(Bias drift) Note 1
-40...+85ºC temperature
range, VDD=5V
Zero Rate Supply Drift
4.75..5.25V at 25°C
-5
% FSOUT
26.67
13.33
6.67
mV/°/sec
12.8
6.4
3.2
LSB/°/sec
-5
at 25ºC, VDD=5V
Units
V
+/- 0.5
Data are given for
N2, E2 and R2 versions
respectively and
according to the Full
Scale Range Setting.
At 25°C, VDD=5V.
-40..+85ºC temperature
range, supply voltage
variation included
drift) Note 1
Max
4
Output, best fit based
Initial Scale Factor (sensitivity)
Scale Factor drift (sensitivity
Test Conditions
5
%S0
2.5
V
1008
LSB
0
5
% FSOUT
250
mV/V
120
LSB/V
Bandwidth (-3 dB) Note 2
Selectable by external
capacitor (section 7)
FLT to OUTAR capacitor value Note 2
7 Hz Bandwidth
(-4.5 to -1 dB)
100
±5%
nF
Output Noise power spectral density
At 250C
0.03
°/sec/√Hz
Angular Rate Cross-sensitivity
for 0x,0y Note 2
for a full-scale angular
rate along 0x,0y
1
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75
2
Hz
%FSOUT
Data Sheet
January/08
MLX90609
Angular Rate Sensor (Standard version)
Parameter
Symbol
Resonance Frequency
FRES
Test Conditions
Min
Max
8.2
MLX90609 operational, all
parameters are in spec.,
CFLT=10nF, C3=100nF.
Capacitors names are
referred to Fig.6-1
Wake-up time at power up Note 2
Typ
150
Resolution of the internal ADC
KHz
250
11
ADC conversion time Note 2
TCONV
Includes Track/Hold
Acquisition Time
Voltage Reference
VREF0
at 25°C
Voltage Reference TC
TCVREF
VREF =
VREF0 (1 + TCVREF × ∆T)
Temperature Sensor
VTEMP0
at 25°C
Temperature Sensor TC
TCTEMP
VOUTTEMP =
VTEMP0 + TCTEMP × ∆T
2.45
ms
bit
90
115
µs
2.5
2.55
V
90
2.3
Units
2.5
10
ppm/K
2.7
V
mV/K
Table 4. Sensor Specific Specifications
Notes:
1. Better performance can be obtained. Please contact Melexis.
2. These numbers are guaranteed by design and/or characterization.
3. The voltage reference should ideally not be loaded, as there is an internal ESD resistor of about 1.5 kOhm
in series with the output.
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MLX90609
Angular Rate Sensor (Standard version)
5. Detailed Description
5.1 The Working Principle
The MLX90609 is a Z-axis rate-sensing device, also called yaw-rate sensing. It produces an analog
positive going output voltage for clockwise (CW) rotation around the axis normal to the package
top, i.e., clockwise when looking down at the package lid as well as a digital SPI signal proportional
to the angular rate.
Figure 5-1. Angular rate (positive for clockwise rotation) to voltage output
The sensor is a MEMS gyroscope sensitive to Coriolis forces. To create a Coriolis force a
movement must be induced. The gyro has an actuated oscillating mechanical structure (primary
mode). The Coriolis force creates a second oscillating movement when the gyroscope rotates
(secondary mode). As Coriolis force is usually extremely weak the primary mode is driven into
resonance to keep the mechanical noise level low for the signal bandwidth used and to have a
good sensitivity. A capacitance change in the secondary mode is detected and transformed into an
output voltage by the electronic interface circuitry.
The electronic interface must convert a change in the sensor capacitance ∆C into a change in
transducer output voltage VOUT according to the following transfer equation:
VOUT = Bias + Gain ∗ AngularRat e
The bias and gain are adjustable over temperature in order to compensate for the TC of sensor and
readout. After adjusting the bias and gain values and after setting operating mode switches during
the calibration process the transducer output voltage versus angular rate must stay as shown in
Figure 5-1 over the specified temperature range.
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MLX90609
Angular Rate Sensor (Standard version)
5.2 Communication with the MLX90609 through the SPI
The MLX90609 has a serial communication interface compatible with Serial Peripheral Interface
(SPI). Likewise SPI the Serial Interface of the MLX90609 specifies four signals:
serial clock (SCLK);
master data output, slave data input (MOSI);
master data input, slave data output (MISO); and
slave select ( SS ).
The MLX90609 always operates as a slave. Therefore only MISO pin is an output.
The MLX90609 is selected when the SS pin is low (see Figure 5-2Figure 5-2). When SS pin is high,
data will not be accepted via the MOSI pin. The serial output pin (MISO) will remain in a high
impedance state. High level of SS forces the serial interface into the start state of data exchange.
Data is serially transmitted to the MLX90609 in 8 bit words (an instruction byte) and in 16 bit data
words. Data is serially received from the MLX90609 in 16 bit words (an answer word). Most
Significant Bit (MSB) is the first bit transmitted and received.
Transmission:
After the device is selected with SS going low, the instruction byte will be received by the
MLX90609. On each rising edge of SCLK data from MOSI enter into an internal 8-bit shift register.
The accepted instruction byte contains the op-code that defines the operations to be performed.
Along with op-code this byte can also contain information such as EEPROM address or ADC mode
(to be setup).
Reception:
After the 8th bit is received to the shift register, the command will be executed by the MLX90609.
The format of the outgoing data is defined by the received instruction. All instructions evoke an
answer. A full communication cycle (transmitting an instruction and receiving the full answer) is
finished after 24th clock of the SCLK. Communication can be terminated by putting SS high.
Some remarks:
If an invalid op-code is received, it is rejected and the corresponding data is ignored. In this
case a special “refusal answer” will be generated.
It's recommended to use synchronization by SS after every data exchange to prevent a data
distortion.
If high level is applied to SS during an instruction byte transmission, the command will be
ignored.
If high level is applied to SS during the answer reception, the answer will be truncated. This
can be used to limit the reading of the answer to e.g. one byte only (see Figure 5-3).
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MLX90609
Angular Rate Sensor (Standard version)
Figure 5-2. Serial Exchange Sequence (full answer reading)
Figure 5-3. Serial Exchange Sequence (the reading of the higher half of the answer)
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MLX90609
Angular Rate Sensor (Standard version)
Figure 5-4. Synchronous Data Timing
Parameter
Limit
Units
Test Conditions/Comments
t1
Minimum 30
ns
SS to SCLK Rising Edge Setup Time
t2
Minimum 80
ns
SCLK High Duration
t3
Minimum 80
ns
SCLK Low Duration
t4
Minimum 0
ns
SS Hold Time
t5
Minimum 50
ns
SS High Duration
t6
Minimum 80
ns
Data In Setup Time
t7
Minimum 50
ns
Data In Hold Time
t8
Maximum 50
ns
Output Valid
t9
Minimum 0
ns
Output Hold Time
t10
Maximum 40
ns
Output Disable Time
Table 5. SPI Timing Characteristics (see Figure 5-4Figure 5-4)
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MLX90609
Angular Rate Sensor (Standard version)
5.3 Usage of the ADC
The MLX90609 has the unique feature of simultaneously delivering an analog and a digital output
signal.
The MLX90609 includes an internal 11-bit successive-approximation-register ADC with a sampleand-hold circuit and a programmable 2-channel analog multiplexer. The multiplexer connects the
OUTAR pin or the OUTTEMP pin to the sample-and-hold circuit.
After a power-up the ADC is in a sleep mode. Before usage of the sleeping ADC it's recommended
to use an initial dummy conversion. The result of this dummy conversion should be skipped but the
next conversions will be valid. After conversions the ADC can be put in the sleep mode again.
A conversion must be initiated by means of the SPI command ADCC. This command turns the
ADC on, sets a necessary channel and starts a conversion. To read a status of the conversion the
ADCR or STATR commands can be used. As soon as the conversion is completed, its result
should be read in the answer of the command ADCR (see tables 8, 9 and 10).
There are two conversion formulas below. The formulas reflect the typical ADC behavior and can
be used to evaluate the voltage on the OUTAR and OUTTEMP pins:
25
ADCcode + 400
12
25
VOUTTEMP (mV ) =
ADCcode + 300
16
VOUTAR ( mV ) =
The ADCcode represents the 11-bit result of the conversion (see Table 10).
Table 6 gives a description of the bits that are mentioned in this section.
ADEN
The ADEN bit selects the power management mode of the ADC:
ADEN=0: ADC is switched to the sleep mode, no AD-conversion is allowed.
ADEN=1: AD-conversion is allowed.
This bit is set by the ADCC-command. After power-up bit ADEN is cleared.
BUSY
This bit will be set after a reset and will be toggled to zero after all initialization procedures inside
the MLX90609. While BUSY=1, only refusal answers will be sent.
CHAN
The CHAN bit is used to select the input source for the ADC.
CHAN=0: the angular rate channel.
CHAN=1: the temperature sensor channel.
This bit is set by the ADCC-command. After power-up bit CHAN is cleared.
EOC
End of AD-conversion bit. EOC bit indicates an ADC state.
EOC=0 : ADC in progress and can not be restarted.
EOC=1 : AD-conversion has been completed and can be restarted.
As a result, any attempt of the ADC starting will be rejected if EOC has a “0” state.
OPC
Unknown Operation Code. This bit is set when a received operation code was not recognized.
X
These bits are reserved or have an undefined state.
Table 6. SPI bits
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MLX90609
Angular Rate Sensor (Standard version)
5.3.1 ADC Instructions and Answers
There are three SPI commands that are used to control embedded ADC of the MLX90609: STATR,
ADCC and ADCR.
•
The Refusal Answer
Every instruction sent to the MLX90609 has an answer. If the MLX90609 is not able to accept the
instruction a refusal answer will be transmitted out. This answer has a unique format which is
shown in the Table 7. The refusal answer is the only one that has a set MSB. The other bits help to
understand a possible reason for the instruction rejection.
Bit15
1
Bit14
OPC
Bit13
EOC
Bit12
X
Bit11
X
Bit10
BUSY
Refusal answer
Bit 8
Bit 7
X
X
Bit 9
X
Bit 6
X
Bit 5
X
Bit 4
X
Bit 3
X
Bit 2
X
Bit 1
X
Bit 0
X
Table 7. Refusal answer format
•
Command of the Status Reading (STATR)
Instruction
Bit 7
1
Bit15
0
Bit 6
0
Bit14
X
Bit13
EOC
Bit12
X
Bit 5
0
Bit11
X
Bit10
X
Bit 4
0
Bit 9
X
Bit 3
1
Bit 8
X
Answer
Bit 7
X
Bit 2
0
Bit 6
X
Bit 5
X
Bit 1
0
Bit 4
X
Bit 3
CHAN
Bit 0
0
Bit 2
ADEN
Bit 1
X
Bit 0
X
Table 8. Format of the STATR command
•
Command of the ADC Control (ADCC)
Instruction
Bit 7
1
Bit15
0
Bit 6
0
Bit14
X
Bit13
EOC
Bit12
X
Bit 5
0
Bit11
X
Bit10
X
Bit 4
1
Bit 9
X
Bit 3
CHAN
Bit 8
X
Answer
Bit 7
X
Bit 6
X
Bit 2
ADEN
Bit 5
X
Bit 4
X
Bit 1
0
Bit 3
CHAN
Bit 2
ADEN
Bit 0
0
Bit 1
X
Bit 0
X
Table 9. Format of the ADCC command (The answer is the same as for the STATR command)
•
Command of the ADC Reading (ADCR)
Instruction
Bit 7
1
Bit15
0
Bit14
X
AD10…AD0
Bit 6
0
Bit13
EOC
Bit12
X
Bit 5
0
Bit11
AD10
Bit10
AD9
Bit 4
0
Bit 9
AD8
Bit 3
0
Answer
Bit 8
Bit 7
AD7
AD6
Bit 6
AD5
Bit 2
0
Bit 5
AD4
Bit 4
AD3
Bit 1
0
Bit 3
AD2
Bit 2
AD1
Bit 0
0
Bit 1
AD0
Bit 0
0
A result of the AD-conversion. These bits are valid only when EOC bit is set.
Table 10. Format of the ADCR command
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MLX90609
Angular Rate Sensor (Standard version)
5.3.2 Reading the Digital Angular Rate or Temperature (suggested procedure)
There is a recommended sequence below to obtain digital data from the ADC.
Notes:
- The bit with leftmost position should be shifted first.
- Below “x” means any value: “0” or “1”.
•
Step 1 (put ADC to the active mode if it wasn’t)
Use SPI to send ADCC instruction (MOSI): 1 0 0 1 x 1 0 0 x x x x x x x x x x x x x x x x
And check 15th bit of the answer (MISO):
0 x x x x x x x x x x x x x x x
If 15th bit is zero, the instruction is accepted.
Before to go to the Step 2 provide a delay > 115 µs or wait till the EOC bit is set.
•
Step 2 (conversion start)
Use SPI to send ADCC instruction(MOSI):1 0 0 1 CHAN 1 0 0 x x x x x x x x x x x x x x x x
And check 15th bit of the answer (MISO):
0 x x x x x x x x x x x x x x x
th
If 15 bit is zero, the instruction is accepted.
CHAN bit specifies the input source of the ADC.
CHAN=0: The angular rate signal.
CHAN=1: The temperature sensor signal.
Go to the Step 3.
•
Step 3 (polling and result obtaining)
Use SPI to send ADCR instruction and check 15th and 13th bits of the answer:
1 0 0 0
0 0 0 0
x x x x
x
x
x
x
x
x
x
x
x
x
x x
0 x EOC x AD10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 0
If 15th bit is zero, the instruction is accepted.
If 13th bit (EOC) is zero, the conversion is still in progress and the result of the
conversion (bits AD10…AD0) is not valid. As soon as the EOC bit is set the conversion is
completed and the result is valid.
Instead of the polling of the EOC bit one can use a simple delay that should be bigger
than a maximal conversion time (>115 µs, see table 4).
Go to the Step 2 to do the next conversion or to the Step 4 to put ADC to the sleep mode.
•
Step 4 (put ADC to the sleep mode if it’s necessary)
Use SPI to send ADCC instruction (MOSI): 1 0 0 1 x 0 0 0 x x x x x x x x x x x x x x x x
And check 15th bit of the answer (MISO):
0 x x x x x x x x x x x x x x x
If 15th bit is zero, the instruction is accepted.
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Data Sheet
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MLX90609
Angular Rate Sensor (Standard version)
6. Applications Examples
Figure 6-1. MLX90609 with simultaneous analog and digital output
The MLX90609 can simultaneously output analog and digital signals.
The analog output signal can be fed to a microcontroller (µC) that contains an analog-to-digital
converter. A multiplexer can be used to select between the temperature and the angular rate
signals. The MLX90609 generates an internal reference voltage used for supplying the ADC,
thereby maintaining accuracy regardless of the supply voltage of the µC.
Whilst supplying the analog output signal, the MLX90609 can simultaneously send a digital output
signal to the µC through the SPI.
Notes:
1.
The bandwidth of the MLX90609 can be selected by connecting an appropriate capacitor in
the FLT pin. CFLT implements a first order low pass filter cascaded with an internal 4-th order
SC filter. The –3dB bandwidth set by CFLT is: fOUT =0.16 / (ROUT*CFLT), with ROUT = 200kΩ (typ).
It is recommended to use CFLT even if the cut-off frequency is not specified to reduce
switching spikes at the output.
2.
It is recommended to use X5R or X7R type capacitors. Min. voltage for C3 should be 25V or
more, and 10V or more for the other capacitors. Recommended values of decoupling
capacitors C1 and C2 are 1.0µF and 0.1µF for C3. These capacitors should be placed as close
as possible to their respective pins.
3.
HVIN is a high impedance node. Be sure that an equivalent leakage resistance at this node
isn’t less then 2MΩ
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MLX90609
Angular Rate Sensor (Standard version)
Figure 6-2. MLX90609 with analog output only
If only an analog output signal is required, the MLX90609 doesn’t need to communicate through the
SPI pins. All other pins continue to be used as described above.
Figure 6-3. MLX90609 with digital output only
If only a digital output signal is required the MLX90609 uses the SPI to send the temperature and
the angular rate in a digital format. The operation mode only through the SPI allows a reduction of
cost and complexity in the interfacing to system microcontroller or microprocessor. All the pins in
the above schematics continue to be used as described above.
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MLX90609
Angular Rate Sensor (Standard version)
In order to adapt the MLX90609 for a 3.3V Microcontroller one can use the below schematic:
Figure 6-4. Possible interfacing with 3.3V µC
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Angular Rate Sensor (Standard version)
7. Standard Information Regarding Manufacturability of Melexis
Products with Different Soldering Processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(Classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(Reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
8. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor
products.
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Angular Rate Sensor (Standard version)
9. Package Information
The MLX90609 is packaged in a 32 pin JESD30C compliant Ceramic Quad Flat None leaded CQFN32 -ceramic housing. The CQFN32 is commonly called CLCC32 or LCCC32.
Note: All dimensions are given in mm (inch).
Figure 9-1. Package Dimensions, Bottom View
Figure 9-2. Side and Top View of the MLX90609
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MLX90609
Angular Rate Sensor (Standard version)
Figure 9-3. MLX90609 Bottom View
Figure 9-4. Land Pattern Design (top view)
10. Glossary of Terms
Angular Rate Sensor
A sensor that measures rotational velocity measured in degrees per second around its sensitive
axis. Angular rate sensors are sometimes referred to as gyro or gyroscope.
Bandwidth
The input signal frequency range from DC (zero frequency) up to the frequency where a -3dB
amplitude decay (between mechanical input and rate output) is observed. In the case of the
present device, the bandwidth is user selectable by means of an external capacitor.
Coriolis Effect
Coriolis Effect is an inertial force described by the 19th-century engineer-mathematician GustaveGaspard Coriolis in 1835. Coriolis showed that, if the ordinary Newtonian laws of motion of bodies
are to be used in a rotating frame of reference, an inertial force, acting to the right of the direction of
body motion for counterclockwise rotation of the reference frame or to the left for clockwise rotation,
must be included in the motion equations.
In effect, the Coriolis force is an apparent deflection of the path of an object that moves within a
rotating coordinate system. The object does not actually deviate from its path, but it appears to do
so because of the motion of the coordinate system.
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Angular Rate Sensor (Standard version)
Primary and Secondary Frame
In vector notation the Coriolis force FCoriolis is given by:
FCoriolis = 2m (v × Ω )
Where m is the mass of the object, v its velocity and Ω is the angular rate of the rotating coordinate
system.
To create a Coriolis Force (FCoriolis), a movement or velocity (v) must be induced. The gyroscope
system has got an electrically actuated oscillating mechanical structure, called primary frame (m).
When the gyroscope rotates (Ω) a Coriolis force FCoriolis acts on this frame. To measure the Coriolis
force, a part of the frame - called the secondary frame - is designed to allow a motion as a reaction
to the applied Coriolis force. This synchronous motion is sensed electrically by a capacitive readout
circuit.
The gyroscope is a vibratory system with two orthogonal vibrating frames: the primary actuated
vibrating frame and the secondary sensed vibrating frame.
Zero Rate Output (ZRO) Drift
The bounds within which the circuit output signal may vary as the temperature varies across the
operating temperature range with no applied angular rate.
List of Acronyms
ADC
EEPROM
EMC
ESD
HBM
JEDEC
MEMS
SMD
SO
SPI
TC
CDF-AEC-100
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Analog to Digital Converter
Electrically Erasable PROM
Electro Magnetic Compatibility
Electrostatic Discharge
Human Body Model of ESD
Joint Electronics Design Engineering Council
Micro Electro-Mechanical Sensor
Surface Mounted Device
Swiss Outline or Small Outline
Serial Peripheral Interface
Temperature Coefficient
Automotive Electronics Council –
Stress Test Qualification for Integrated Circuits
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MLX90609
Angular Rate Sensor (Standard version)
11. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
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