IMDS ID / Version: 164665700 / 2 User: Steinebrunner, Udo Page: Date: 1/5 7/1/11 3:47:19 PM MDS Report Substances of assemblies and materials 1. Company and Product Name 1.1 Supplier Data Name [ID]: DUNS Number: Street/Postal Code: Nat./ZipCode/City: Supplier Code: Contact Person: - Phone: - Fax No.: - e-mail address: 1.2 Product Identification Diotec Semiconductor AG [2845] Kreuzmattenstraße 4 DE 79423 Heitersheim Brigitte Kelpe +49 7634 5266 77 +49 7634 5266 277 [email protected] m 2. Recyclate Information Since IMDS release 3.0, recyclate information is stored on the reference to certain materials. Hewlett-Packard GmbH Part/Item No.: D 6.3 x 21 Article Name: Report No.: Date of Report: Purchase Order No.: Bill of Delivery No.: Development Sample Report: IMDS ID / Version: Node ID: Diode axial No MDS Status (Change Date): Internally released (07/01/2011) 164665700 / 2 164667131 IMDS ID / Version: User: 164665700 / 2 Steinebrunner, Udo Page: Date: 2/5 7/1/11 3:47:19 PM MDS Report Substances of assemblies and materials Materials which are subject to legal prohibitions must not be included! Dangerous substances formed or released during use must also be declared Please note: GADSL list for substances that require declaration 3. Characterization of the Component Part/Item No.: Article Name: D 6.3 x 21 Diode axial Report No.: IMDS ID / Version: Node ID: 164665700 / 2 164667131 Article Name Article Name Name Substance name Part/Item No. Item- /Mat.-No. Material-No. CAS No. Diode axial D 6.3 x 21 164665700 / 2 1.9 Anschlussdraht/lead wire K18.3130 (not available) 1.3937 Cu-OF CW008A 10418884 / 4 4 Copper 7440-50-8 99.97475 4 Silver 7440-22-4 0.0075 0 - 0.015 4 Bismuth 7440-69-9 0.00025 0 - 0.0005 Tree Level 1 2 3 Hewlett-Packard GmbH Classif. IMDS ID / Version Quantity Weight Portion [g] [%] Portion (from - to) [%] GADSL, SVHC Parts Marking Recyclate (Indust./Consumer) Application Not Applicable 3.1 95.9 D No IMDS ID / Version: User: Article Name Article Name Name Substance name Part/Item No. Item- /Mat.-No. Material-No. CAS No. 4 Lead 7439-92-1 4 Misc., not to declare system Tree Level 3 2 164665700 / 2 Steinebrunner, Udo SSn96Ag3Cu1(Sn96,5Ag3Cu0,5) 711 Page: Date: 3/5 7/1/11 3:47:19 PM Classif. IMDS ID / Version Quantity Weight Portion [g] [%] 58809831 / 2 Portion (from - to) [%] 0.0025 0 - 0.005 0.015 0 - 0.03 GADSL, SVHC D/P 4.2 4.1 4 Tin 7440-31-5 96.243 4 Lead 7439-92-1 0.05 0 - 0.1 4 Antimony 7440-36-0 0.05 0 - 0.1 4 Bismuth 7440-69-9 0.05 0 - 0.1 4 Cadmium 7440-43-9 0.001 4 Copper 7440-50-8 4 Indium 4 Parts Marking Recyclate (Indust./Consumer) Application Concentration within acceptable GADSL limits No D/P Concentration within acceptable GADSL limits 0 - 0.002 D/P Concentration within acceptable GADSL limits 0.5 0.3 - 0.7 D 7440-74-6 0.05 0 - 0.1 Silver 7440-22-4 3 2.8 - 3.2 4 Aluminium (metal) 7429-90-5 0.0005 0 - 0.001 4 Arsenic 7440-38-2 0.015 0 - 0.03 4 Iron 7439-89-6 0.01 0 - 0.02 4 Zinc (metal) 7440-66-6 0.0005 0 - 0.001 4 Gold 7440-57-5 0.025 0 - 0.05 4 Nickel 7440-02-0 0.005 0 - 0.01 Semiconductor Chip PRC40 Hewlett-Packard GmbH (not available) 0.003198 D D Not applicable IMDS ID / Version: User: 164665700 / 2 Steinebrunner, Udo Page: Date: 4/5 7/1/11 3:47:19 PM Article Name Article Name Name Substance name Part/Item No. Item- /Mat.-No. Material-No. CAS No. gold alloy 30xx.x 4 Gold 7440-57-5 92 4 Nickel 7440-02-0 8 Tree Level 3 3 4 3 4 2 3 4 Polydimethyl Silicone Fluid Classif. IMDS ID / Version Weight Portion [g] [%] 115408108 / 1 63148-62-9 Silicon 30xx.x Silicon 7440-21-3 Gehäuse/case 3078 (not available) duromer EP 3078 8790399 / 5 Epoxy resin - Portion (from - to) [%] 11.9 98398329 / 1 Dimethylsilicone Lot/solder RoHS konform/compliant Pb92.5Ag5Sn2.5 Quantity Other application (Surface not routinely touched or nickel release rate < 0.5µg/cm2/week) 100 115401386 / 4 62.9 4.2 No 5.4.3 No 4.2 No 100 0.504 100 100 S-Pb93Sn5Ag2 191 1443140 / 3 4 Tin 7440-31-5 5 4 Lead 7439-92-1 93.203 4 Antimony 7440-36-0 0.1 0 - 0.2 4 Bismuth 7440-69-9 0.05 0 - 0.1 Hewlett-Packard GmbH No 9.2 25.2 (not available) 3 4.2 D 302x 2 GADSL, SVHC Parts Marking Recyclate (Indust./Consumer) Application 0.002 100 4.8 - 5.2 D/P Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) - 8e) IMDS ID / Version: User: 164665700 / 2 Steinebrunner, Udo Page: Date: 5/5 7/1/11 3:47:19 PM Article Name Article Name Name Substance name Part/Item No. Item- /Mat.-No. Material-No. CAS No. 4 Cadmium 7440-43-9 0.001 0 - 0.002 D/P 4 Copper 7440-50-8 0.04 0 - 0.08 D 4 Indium 7440-74-6 0.05 0 - 0.1 4 Silver 7440-22-4 1.5 1.2 - 1.8 4 Aluminium (metal) 7429-90-5 0.0005 0 - 0.001 4 Arsenic 7440-38-2 0.015 0 - 0.03 4 Iron 7439-89-6 0.01 0 - 0.02 4 Zinc (metal) 7440-66-6 0.0005 0 - 0.001 4 Gold 7440-57-5 0.025 0 - 0.05 4 Nickel 7440-02-0 0.005 0 - 0.01 Tree Level Classif. IMDS ID / Version Quantity Weight Portion [g] [%] Portion (from - to) [%] This is an uncontrolled copy of a document created by IMDS. End of the report. Hewlett-Packard GmbH GADSL, SVHC Parts Marking Recyclate (Indust./Consumer) Application Concentration within acceptable GADSL limits D D Not applicable