AP21410 / AP21510 0.2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP21410 and AP21510 are integrated high-side power switches (Top View) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and is available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and undervoltage lockout functionality. GND 1 6 OUT IN 2 5 OUT EN 3 4 NC All devices are available in U-DFN2018-6 packages. U-DFN2018-6 Features Applications Single USB Port Power Switches Overcurrent and Thermal Protection 0.4A Typical Current Limiting Reverse Current Blocking 95mΩ On-Resistance Input Voltage Range: 2.7V to 5.5V 0.4ms Typical Rise Time Very Low Shutdown Current: 1µA (Max) ESD Protection: 4KV HBM, 400V MM Active Low (AP21410) or Active High (AP21510) Enable Ambient Temperature Range -40°C to +85°C U-DFN2018-6: Available in “Green” Molding Compound (No Br, Sb) 15kV ESD Protection per IEC 61000-4-2 (with External Capacitance) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Notes: Consumer Electronics – LCD TVs & Monitors, Game Machines Communications – Set-Top Boxes, GPS, Smartphones Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit Power Supply 2.7V to 5.5V IN 10μF Load OUT AP21410 0.1μF 0.1μF 120μF OFF ON EN GND AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 1 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Available Options Part Number Channel Enable Pin (EN) Current Limit (Typical) Recommended Maximum Continuous Load Current AP21410 1 Active Low 0.4A 0.2A AP21510 1 Active High 0.4A 0.2A Pin Descriptions Pin Number Pin Name Function 1 GND 2 IN Voltage Input Pin (all IN pins must be tied together externally). 3 EN Enable Input. Active Low (AP21410) and Active High (AP21510) 4 NC No internal connection 5, 6 OUT Exposed Pad Exposed Pad Ground Voltage Output Pin (all OUT pins must be tied together externally). Exposed Pad. It should be externally connected to GND plane and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. Functional Block Diagram AP21410, AP21510 Current Sense IN OUT UVLO EN Driver Current Limit Thermal Sense GND AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 2 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter HBM Human Body Model ESD Protection MM Machine Model ESD Protection IEC System Level Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) ESD VIN Ratings Units 4 kV 400 V Air 15 kV Contact 8 kV 6.5 V Input Voltage VOUT Output Voltage VIN +0.3 V VEN Enable Voltage 6.5 V ILOAD Maximum Continuous Load Current Internal Limited A +150 °C -65 to +150 °C TJ(MAX) TST Maximum Junction Temperature Storage Temperature Range (Note 4) Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Notes: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). 5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2μF 50V 0805. This level is a pass test only and not a limit. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input Voltage IOUT Output Current Min Max Units 2.7 5.5 V 0 200 mA -40 +85 °C TA Operating Ambient Temperature VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 3 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Electrical Characteristics Symbol (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Parameter Conditions Min Typ Max Unit VUVLO Input UVLO RLOAD = 1kΩ 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA ILEAK Input Leakage Current Disabled, OUT Grounded — — 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.01 1 µA — 80 110 RDS(ON) U-DFN2018-6 VIN = 5V, IOUT = 0.2A TA = +25°C -40°C ≤ TA ≤ +85°C — — 140 VIN = 3.3V, IOUT = 0.2A TA = +25°C — 100 140 -40°C ≤ TA ≤ +85°C — — 170 Switch On-Resistance mΩ Short-Circuit Current Limit Enabled into Short Circuit — 250 — mA Short-Circuit Response Time VOUT = 0V to IOUT = ISHORT (OUT shorted to ground) Note: See Figure 2 — 2 — µs ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.5V, -40C ≤ TA ≤ +85°C 300 400 500 mA ISINK EN Input Leakage VEN = 5V — — 1 µA tD(ON) Output Turn-On Delay Time RLOAD = 25Ω — 0.05 — ms tR Output Turn-On Rise Time RLOAD = 25Ω — 0.4 1.5 ms tD(OFF) Output Turn-Off Delay Time RLOAD = 25Ω — 0.14 — ms Output Turn-Off Fall Time RLOAD = 25Ω — 0.04 0.1 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — +140 — °C THYS Thermal Shutdown Hysteresis — — +25 — °C Thermal Resistance Junction-toAmbient U-DFN2018-6 (Note 6) — 70 — °C/W ISHORT TSHORT tF θJA Note: 6. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0” x 1.4” ground plane. AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 4 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Performance Characteristics VEN 50% VEN 50% 50% 50% tD(OFF) tR tD(ON) 90% tD(OFF) tR tF tF tD(ON) 90% VOUT 90% 90% VOUT 10% 10% 10% 10% Figure 1. Voltage Waveforms: AP21410 (Left), AP21510 (Right) Figure 2. Response Time to Short Circuit Waveform Turn-On Delay and Rise time Turn-Off Delay and Fall time VEN 5V/div VEN 5V/div TA = +25°C RL =25Ω CL = 1µF VOUT 2V/div VOUT 2V/div TA = +25°C RL =25Ω CL = 1µF 500µs/div 100µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div TA = +25°C RL =25Ω CL = 100µF VOUT 2V/div VOUT 2V/div TA = +25°C RL =25Ω CL = 100µF 500µs/div AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 2ms/div 5 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Performance Characteristics (continued) Turn On Delay and Rise Time Turn Off Delay and Fall time VEN 5V/div VEN 5V/div VOUT 2V/div TA = +25°C RL = 25Ω CL = 0µF TA = +25°C RL = 25Ω CL = 0µF VOUT 2V/div 500µs/div 500us/div Short Circuit Current, Device Enabled Into Short Short Circuit Current Device Enabled Into Short VEN 5V/div VEN 5V/div IOUT 100mA/div VIN = 5V TA = +25°C CL = 120µF IOUT 100mA/div VIN = 5V TA = +25°C CL = 0µF 20ms/div 20ms/div Inrush Current Over Load Current Limit VEN 5V/div VOUT 2V/div CL = 120µF IIN 200mA/div CL = 220µF IOUT 100mA/div CL = 470µF VIN = 5V TA = +25°C CL = 120µF VIN = 5V TA = +25°C 20ms/div 200us/div AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 6 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Performance Characteristics (cont.) Power On Power On VEN 5V/div VEN 5V/div VOUT 2V/div VOUT 2V/div IOUT 100mA/div IOUT 100mA/div TA = +25°C CL = 120µF RL = 25Ω 500us/div TA = +25°C RL = 25Ω CL = 0µF 500us/div UVLO Increasing UVLO Decreasing VIN 2V/div VIN 2V/div TA = +25°C RL = 25Ω CL = 1µF IOUT 100mA/div TA = +25°C RL = 25Ω CL = 1µF IOUT 100mA/div 1ms/div AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 10ms/div 7 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Performance Characteristics (cont.) CL = 1uF RL = 25Ω TA = +25°C CL = 1uF RL = 25Ω TA = +25°C CL = 1uF RL = 25Ω TA = +25°C CL = 1uF RL = 25Ω TA = +25°C VIN = 5.5V VIN = 5.0V VIN = 5.0V VIN = 5.5V VIN = 3.3V VIN = 2.7V VIN = 2.7V VIN = 3.3V AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 8 of 14 www.diodes.com June 2015 © Diodes Incorporated TA = +25°C AP21410 / AP21510 Performance Characteristics (cont.) VIN = 2.7V VIN = 2.7V VIN = 3.3V VIN = 5.5V VIN = 5.0V VIN = 5.0V UVLO Rising UVLO Falling AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 9 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Application Information Power Supply Considerations A 0.01μF to 0.1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01μF to 0.1μF ceramic capacitor improves the immunity of the device to short-circuit transients. Overcurrent and Short Circuit Protection An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP21410 / AP21510 short circuit and clamps output current to a certain safe level namely ISHORT. In the second condition, an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current-limit function can react. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded. The AP21410 / AP21510 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into overload current limiting mode and is set at ILIMIT. If the load current keeps going higher, the device will switch into short-circuit current limiting mode and is set at ISHORT. Note that when the output has been shorted to GND at extremely low temperatures (< -30°C), a minimum 120μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that the capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) × I2 Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA = Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 10 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Application Information (continued) Thermal Protection Thermal protection prevents the IC from damage when heavy overload or short-circuit faults are present for extended periods of time. The AP21410 / AP21510 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an overcurrent or short-circuit condition, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP21410 / AP21510, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP21410 / AP21510 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP21410 / AP21510 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. Dual-Purpose Port Applications AP21410/AP21510 is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the AP21410/AP21510 is ramped to its operating voltage prior to enabling the output. No Output Capacitor Applications For certain applications, no output capacitor is allowed. It is recommended to add a schottky diode at the output pin to prevent the device damaged by output accidently short to ground. Note: All previous Typical Performance Characteristics charts marked CL=0µF have the schottky diode added. Power Supply 2.7V to 5.5V IN 10μF 0.1μF Load OUT AP21510 B320A OFF ON EN GND Figure 3. No Output Capacitor Application AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 11 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Ordering Information (Note 7) AP21X10 XX - X Enable Package 4: Active Low 5: Active High FM : U-DFN2018-6 Packing 7 : 7" Tape & Reel 7” Tape and Reel Part Number Note: Package Code Packaging Quantity Part Number Suffix AP21410FM-7 FM U-DFN2018-6 3,000/Tape & Reel -7 AP21510FM-7 FM U-DFN2018-6 3,000/Tape & Reel -7 7. For packaging details, go to our website at http://www.diodes.com/products/packages.html. . Marking Information (1) U-DFN2018-6 (Top View) XX YWX AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code Device Package Type Identification Code AP21410FM U-DFN2018-6 GA AP21510FM U-DFN2018-6 GP 12 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (1) Package Type: U-DFN2018-6 A3 U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm A SEATING PLANE A1 Pin#1 ID D D2 L E2 E z b e Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: U-DFN2018-6 X C Y Dimensions C G X X1 Y Y1 Y1 G Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 13 of 14 www.diodes.com June 2015 © Diodes Incorporated AP21410 / AP21510 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. 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Copyright © 2015, Diodes Incorporated www.diodes.com AP21410 / AP21510 Document number: DS37707 Rev. 2 - 2 14 of 14 www.diodes.com June 2015 © Diodes Incorporated