AP2161A - Diodes Incorporated

AP2161A/ AP2171A
1A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2161A and AP2171A are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and undervoltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting and
does not require any external components.
( Top View )
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
SO-8
All devices are available in SO-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages.
Features
•
•
Single USB Port Power Switches
Over-Current and Thermal Protection
1.5A Accurate Current Limiting
Reverse Current Blocking
95mΩ On-Resistance
Input Voltage Range: 2.7V – 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active Low (AP2161A) or Active High (AP2171A) Enable
Ambient Temperature Range: -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
•
•
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
•
•
•
•
•
•
•
•
•
•
•
•
•
Applications
•
•
•
Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top-Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
Notes:
( Top View )
GND
1
6
OUT
IN
2
5
OUT
EN
3
4
FLG
U-DFN2018-6
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Typical Applications Circuit
Available Options
Part Number
Channel
Enable Pin (EN)
Current Limit
(typ)
Recommended Maximum Continuous
Load Current
AP2161A
AP2171A
1
1
Active Low
Active High
1.5A
1.5A
1.0A
1.0A
Pin Descriptions
Pin Number
Pin
Name
SO-8
MSOP-8EP
SOT25
U-DFN2018-6
GND
IN
EN
1
2, 3
4
1
2, 3
4
2
5
4
1
2
3
FLG
5
5
3
4
OUT
NC
6, 7
8
6, 7
8
1
N/A
5, 6
N/A
Exposed tab
-
Exposed tab
-
Exposed tab
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
Function
Ground
Voltage input pin (all IN pins must be tied together externally)
Enable input, active low (AP2161A) or active high (AP2171A)
Over-current and over-temperature fault report; open-drain flag is active low when
triggered
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal
impedance. It should not be used as electrical ground conduction path.
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AP2161A/ AP2171A
Functional Block Diagram
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
for MSOP-8EP, SOT25 packages
Machine Model ESD Protection
for U-DFN2018-6, SO-8 packages
Input Voltage
Ratings
Units
4
kV
400
V
300
V
6.5
V
VOUT
Output Voltage
VIN +0.3
V
VEN , VFLG
Enable Voltage
6.5
V
ILOAD
TJ(MAX)
TST
Maximum Continuous Load Current
Internal Limited
A
150
°C
-65 to +150
°C
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
VIN
Input Voltage
IOUT
Output Current
Min
2.7
Max
5.5
Units
V
0
1.0
A
Operating Ambient Temperature
-40
+85
°C
VIH
High-Level Input Voltage on EN or EN
2.0
VIN
V
VIL
Low-Level Input Voltage on EN or EN
0
0.8
V
TA
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol
Parameter
Min
Typ
Max
RLOAD = 1kΩ
Test Conditions
1.6
1.9
2.5
V
Disabled, IOUT = 0
—
0.5
1
uA
Enabled, IOUT = 0
—
45
70
µA
Disabled, OUT grounded
—
—
1
µA
—
1
—
µA
—
—
95
90
115
110
VUVLO
Input UVLO
ISHDN
Input Shutdown Current
IQ
Input Quiescent Current
ILEAK
Input Leakage Current
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
RDS(ON)
Switch On-Resistance
VIN = 5V,
IOUT = 1A
VIN = 3.3V,
IOUT = 1A
ISHORT
Short-Circuit Current Limit
TA = +25°C
SOT25, MSOP-8EP, SO-8
U-DFN2018-6
-40°C ≤ TA ≤ +85°C
—
—
140
TA = +25°C
—
120
140
-40°C ≤ TA ≤ +85°C
—
—
170
Enabled into short circuit, CL = 68µF
—
1.2
—
Unit
mΩ
A
Over-Load Current Limit
VIN = 5V, VOUT = 4.6V, CL = 68µF, -40°C ≤ TA ≤ +85°C
1.1
1.5
1.9
A
Current Limiting Trigger Threshold
Output Current Slew rate (<100A/s) , CL=68µF
—
2.0
—
A
ISINK
EN Input Leakage
VEN = 5V
—
—
1
µA
tD(ON)
Output Turn-On Delay Time
CL = 1µF, RLOAD = 10Ω
—
0.05
—
ms
tR
Output Turn-On Rise Time
CL = 1µF, RLOAD = 10Ω
—
0.6
1.5
ms
tD(OFF)
Output Turn-Off Delay Time
CL = 1µF, RLOAD = 10Ω
—
0.01
—
ms
Output Turn-Off Fall Time
CL = 1µF, RLOAD = 10Ω
—
0.05
0.1
ms
ILIMIT
ITrig
tF
Fault Flag
RFLG
FLG Output FET On-Resistance
IFLG = 10mA
—
20
40
Ω
tBlank
FLG Blanking Time
CIN = 10µF, CL = 68µF
4
7
15
ms
—
140
—
°C
—
25
—
°C
—
—
—
—
110
60
157
—
—
—
—
°C/W
°C/W
°C/W
Over-Temperature Protection
TSHDN
Thermal Shutdown Threshold
THYS
Thermal Shutdown Hysteresis
θJA
Thermal Resistance Junction-toAmbient
Enabled, RLOAD = 1kΩ
SO-8 (Note 5)
MSOP-8EP (Note 6)
SOT25 (Note 7)
U-DFN2018-6 (Note 8)
Notes:
70
°C/W
5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0”x1.4” ground plane.
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Typical Performance Characteristics
VEN
50%
50%
VEN
50%
50%
TD(OFF)
OFF)
TR
TD(ON)
ON)
TD(OFF)
OFF)
TR
TF
90%
90%
50%
50%
50%
50%
TF
TD(ON)
ON)
90%
90%
VOUT
90%
90%
90%
90%
VOUT
10%
10%
10%
10%
10%
10%
10%
10%
Figure 1 Voltage Waveforms: AP2161A (left), AP2171A (right)
All Enable Plots are for AP2171A Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL = 1µF
TA = +25°C
RL = 10Ω
CL = 1µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL = 100µF
TA = +25°C
RL = 10Ω
CL = 100µF
TA = +25°C
RL = 10Ω
500µs/div
500µs/div
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Typical Performance Characteristics (continued)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
Ven
5V/div
Ven
5V/div
CL=100µF
VIN = 5V
TA = +25°C
RL = 5Ω
Iout
200mA/div
VIN = 5V
CL=470µF
TA = +25°C
Iout
500mA/div
CL = 68µF
CL=220µF
500µs/div
1ms/div
2Ω Load Connected to Enabled Device
1 Ω Load Connected to Enabled Device
Vflag
2V/div
VIN = 5V
VIN = 5V
TA = +25°C
TA = +25°C
CL = 68µF
Iout
1A/div
Vflag
2V/div
CL= 68µF
Iout
1A/div
2ms/div
2ms/div
Short Circuit with Blanking Time and Recovery
Power On
VIN = 5V
TA = +25°C
Vout
5V/div
CL = 68µF
Vflag
5V/div
Iout
500mA/di
v
Vflag
5V/div
TA = +25°C
CL = 68µF
RL = 5Ω
Ven
5V/div
Iout
1A/div
Vin
5V/div
20ms/div
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
1ms/div
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AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
UVLO Increasing
UVLO Decreasing
TA = +25°C
Vin
2V/div
CL = 68µF
Vin
2V/div
RL = 5Ω
TA = +25°C
CL = 68µF
RL = 5Ω
Iout
500mA/div
1ms/div
10ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
750
30
700
29
650
29
Turn-Off Time (us)
Turn-On Time (us)
Iout
500mA/div
600
550
500
450
400
CL = 1µF
350
CL = 1µF
RL = 10Ω
28
TA = +25°C
28
27
27
26
RL = 10Ω
300
26
TA = +25°C
25
250
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Fall Time vs Input Voltage
Rise Time vs Input Voltage
22
650
600
22
Fall Time (us)
Rise Time (us)
550
500
450
400
CL = 1µF
350
RL = 10Ω
300
TA = +25°C
21
21
CL = 1µF
20
RL = 10Ω
20
TA = +25°C
19
250
2
2.5
3
3.5
4
4.5
5
5.5
6
2
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
63
Supply Current, Output Disabled (uA)
Supply Current, Output Enabled (uA)
68
Vin=5.0V
58
Vin=5.5V
53
48
43
38
33
Vin=3.3V
Vin=2.7V
Vin=5.5V
0.8
Vin=3.3V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Vin=2.7V
0.0
28
-60
-40
-20
0
20
40
60
80
-60
100
-40
-20
Static Drain-Source On-State Resistance vs Ambient
Temperature
20
40
60
1.56
Short-Circuit Output Current (A)
Vin=2.7V
160
150
140
130
Vin=3.3V
110
100
Vin=5V
90
80
-40
-20
0
20
40
100
CL=100µF
1.55
Vin=3.3V
1.54
Vin=2.7V
Vin=5.0V
1.53
1.52
1.51
1.50
1.49
1.48
1.47
1.46
Vin=5.5V
1.45
-60
80
Short-Circuit Output Current vs Ambient Temperature
170
Static Drain-Source On-State
Resistance (mΩ)
0
Ambient Temperature (°C)
Ambient Temperature (°C)
120
Vin=5.0V
60
80
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
1.99
2.20
Threshold Trip Current (A)
Undervoltage Lockout (V)
1.98
2.10
UVLO Rising
2.00
1.90
1.80
UVLO Falling
1.70
1.97
1.96
1.95
1.94
1.93
1.92
TA = +25°C
1.91
CL = 68µF
1.90
1.89
1.88
1.60
-60
-40
-20
0
20
40
60
80
100
2.8
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
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AP2161A/ AP2171A
Typical Performance Characteristics (cont.)
Current Limit Response vs Peak Current
Current Limit Response (us)
120
100
80
VIN = 5V
60
TA = +25°C
40
20
0
0
2
4
6
8
10
12
Peak Current (A)
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Application Information
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2161A/AP2171A senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2161A/AP2171A is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at ILIMIT.
Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2161A/AP2171A is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2161A/AP2171A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 145°C due to excessive power dissipation in an over-current or short-circuit condition, the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Application Information (continued)
Undervoltage Lockout (UVLO)
The undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered And Bus-Powered HUBs
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power
supply must provide from 5.25V to 4.75V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs
are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors,
printers, and stand-alone hubs.
Figure 2 Typical One-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2161A/AP2171A, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161A/AP2171A also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2161A/AP2171A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP2161A/AP2171A is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and
peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL
(Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a
charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the AP2161A/AP2171A is ramped
to its operating voltage prior to enabling the output.
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Ordering Information
Part Number
Package Code
Packaging
AP21X1AW-7
AP21X1AS-13
AP21X1AMP-13
AP21X1AFM-7
W
S
MP
FM
SOT25
SO-8
MSOP-8EP
U-DFN2018-6
Quantity
7”/13” Tape and Reel
Part Number Suffix
3,000/Tape & Reel
2,500/Tape & Reel
2,500/Tape & Reel
3,000/Tape & Reel
-7
-13
-13
-7
Marking Information
(1)
SO-8
(2)
MSOP-8EP
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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AP2161A/ AP2171A
Marking Information (continued)
(3)
SOT25
( Top View )
4
7
5
XX Y W X
1
(4)
2
3
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Device
Package type
Identification Code
AP2161AW
AP2171AW
SOT25
SOT25
VV
VW
Device
Package type
Identification Code
AP2161AFM
AP2171AFM
U-DFN2018-6
U-DFN2018-6
ZV
ZW
U-DFN2018-6
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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© Diodes Incorporated
AP2161A/ AP2171A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Package Type: SO-8
0.254
(1)
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
θ
0°
8°
All Dimensions in mm
Package Type: MSOP-8EP
D
x
E
E2
4X
10
°
0.25
D1
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
L
c
A2
A
D
E1
See Detail C
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
March 2015
© Diodes Incorporated
AP2161A/ AP2171A
Package Outline Dimensions (continued) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(3)
Package Type: SOT25
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D

 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°
α

All Dimensions in mm
B C
H
K
J
(4)
M
N
L
D
Package Type: U-DFN2018-6
A3
A
U-DFN2018-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1
0
0.05 0.02
A3

 0.13
b
0.15 0.25 0.20
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e

 0.50
E
1.95 2.075 2.00
E2 0.90 1.10 1.00
L
0.20 0.30 0.25
z

 0.30
All Dimensions in mm
SEATING PLANE
A1
Pin#1 ID
D
D2
L
E2
E
z
e
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
b
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March 2015
© Diodes Incorporated
AP2161A/ AP2171A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1)
Package Type: SO-8
X
Dimensions
X
Y
C1
C2
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
(2)
Package Type: MSOP-8EP
X
C
Y
G
Dimensions
Y2
C
G
X
X1
Y
Y1
Y2
Y1
X1
(3)
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
Package Type: SOT25
C2
Z
C2
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
G
C1
Y
C2
2.40
0.95
X
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
16 of 18
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March 2015
© Diodes Incorporated
AP2161A/ AP2171A
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4)
Package Type: U-DFN2018-6
X
C
Y
Dimensions
C
G
X
X1
Y
Y1
Y1
G
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
X1
Taping Orientation (Note 9)
For U-DFN2018-6
Notes:
9. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
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March 2015
© Diodes Incorporated
AP2161A/ AP2171A
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
AP2161A/AP2171A
Document number: DS37617 Rev. 1 - 2
18 of 18
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March 2015
© Diodes Incorporated