AP2141D/ AP2151D 0.5 SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE Description Pin Assignments The AP2141D and AP2151D are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and is available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SOT25, SO-8, MSOP-8EP, and U-DFN2018-6 packages. ( Top View ) GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG SOSO-8 Features • • • • • • • • • • • • • • • • • • • Single USB Port Power Switches with Output Discharge Over-Current and Thermal Protection 0.8A Accurate Current Limiting Fast Transient Response Reverse Current Blocking 90mΩ On-Resistance Input Voltage Range: 2.7V - 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (max) Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 4kV HBM, 300V MM Active High (AP2151D) or Active Low (AP2141D) enable Ambient Temperature Range -40°C to +85°C SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6: Available in “Green” Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) 15kV ESD Protection per IEC 61000-4-2 (with external capacitance) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified ( Top View ) OUT 1 GND 2 FLG 3 5 IN 4 EN SOT25 Applications • • • Consumer Electronics – LCD TVs & Monitors, Game Machines Communications – Set-Top-Boxes, GPS, Smartphones Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 1 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Applications Circuit AP2151D Enable Active High IN Power Supply 2.7V to 5.5V 10k 10uF Load OUT 0.1uF 0.1uF 120uF FLG ON EN GND OFF Part Number Channel Enable Pin (EN) Current Limit (Typical) Recommended Maximum Continuous Load Current AP2141D AP2151D 1 1 Active Low Active High 0.8A 0.8A 0.5A 0.5A Pin Descriptions Pin Number MSOP-8EP SOT25 Pin Name SO-8 GND IN EN 1 2, 3 4 1 2, 3 4 2 5 4 1 2 3 FLG 5 5 3 4 OUT NC 6, 7 8 6, 7 8 1 N/A 5, 6 N/A Exposed tab - Exposed tab - Exposed tab AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 Descriptions U-DFN2018-6 Ground Voltage Input Pin. (all IN pins must be tied together externally) Enable Input, active low (AP2141D) or active high (AP2151D). Over-current and over-temperature fault report; open-drain flag is active low when triggered. Voltage Output Pin (all OUT pins must be tied together externally). No Internal Connection; recommend tie to OUT pins. Exposed pad. Internally connected to GND. It should be externally connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Functional Block Diagram Current Sense IN OUT Discharge Control UVLO Current Limit Driver EN FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol HBM Parameter Human Body Model ESD Protection MM Machine Model ESD Protection IEC System Level Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) ESD Ratings 4 Units kV 300 V Air 15 kV Contact 8 kV 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V Internal Limited A +150 °C -65 to +150 °C VIN ILOAD TJ(MAX) TST Input Voltage Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 4) Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Notes: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) 5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2µF 50V 0805. This level is a pass test only and not a limit. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input Voltage IOUT Output Current Min Max Unit 2.7 5.5 V 0 500 mA TA Operating Ambient Temperature -40 +85 °C VIH High-Level Input Voltage on EN or EN 2.0 VIN V VIL Low-Level Input Voltage on EN or EN 0 0.8 V AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 3 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.) Symbol Min Typ Max Unit VUVLO Input UVLO — 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded — 0.1 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.1 1 µA — 95 115 — 90 110 -40°C ≤ TA ≤ +85°C — — 140 TA = +25°C — 120 140 170 RDS(ON) Parameter Switch On-Resistance Test Conditions SOT25, MSOP-8, TA = +25°C MSOP-8EP, SO-8 U-DFN2018-6 VIN = 5V, IOUT = 0.5A VIN = 3.3V, IOUT = 0.5A ISHORT ILIMIT Short-Circuit Current Limit Over-Load Current Limit mΩ — — Enabled into short circuit, CL = 22µF — 0.6 — A VIN = 5V, VOUT = 4.0V, CL = 120µF, -40°C ≤ TA ≤ +85°C 0.6 0.8 1.0 A -40°C ≤ TA ≤ +85°C ITRIG Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s) , CL = 22µF — 1.0 — A ISINK EN Input Leakage VEN = 5V — — 1 µA tD(ON) Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms tR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω — 0.6 1.5 ms tD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω — 0.05 0.1 ms RFLG FLG Output FET On-Resistance IFLG =10mA — 20 40 Ω tBLANK FLG Blanking Time CIN = 10µF, CL = 22µF 4 7 15 ms RDIS Discharge Resistance (Note 6) VIN = 5V, disabled, IOUT = 1mA — 100 — Ω tDIS ms tF Discharge Time CL = 1µF, VIN = 5V, disabled to VOUT < 0.5V — 0.6 — TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — 140 — °C THYS Thermal Shutdown Hysteresis — — 25 — °C SOT25 (Note 7) — 170 — SO-8 (Note 7) — 127 — MSOP-8EP (Note 8) — 67 — U-DFN2018-6 (Note 8) — 70 — θJA Notes: Thermal Resistance Junction-toAmbient °C/W 6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. 7. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 4 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Performance Characteristics Figure 1 Voltage Waveforms: AP2141D (left), AP2151D (right) All Enable Plots are for AP2151D Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div CL = 1uF TA = +25°C RL = 10Ω CL = 1uF TA = +25°C RL = 10Ω VOUT 2V/div 100µs/div 100µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div CL = 120µF TA = +25°C RL = 10Ω CL = 120µF TA = +25°C RL = 10Ω VOUT 2V/div 500µs/div AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 500µs/div 5 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Performance Characteristics (continued) Short Circuit Current, Device Enabled Into Short Short Circuit with Blanking Time and Recovery VOUT 5V/div VEN 5V/div VFLAG 5V/div VIN = 5V TA = +25°C CL = 22µF IOUT 200mA/div VIN = 5V TA = +25°C CL = 22µF IOUT 1A/div 100µs/div 20ms/div 3Ω Load Connected to Enabled Device 2Ω Load Connected to Enabled Device VFLAG 2V/div VFLAG 2V/div VIN = 5V TA = +25°C CL = 22µF VIN = 5V TA = +25°C CL = 22µF IOUT 500mA/div IOUT 500mA/div 1ms/div 1ms/div Power On Power Off TA = +25°C CL = 120µF RL = 10Ω VFLAG 5V/div VFLAG 5V/div TA = +25°C CL = 120µF RL = 10Ω IOUT 200mA/div IOUT 200mA/div VEN 5V/div VEN 5V/div VOUT 5V/div VOUT 5V/div 2ms/div AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 2ms/div 6 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Performance Characteristics (cont.) UVLO Increasing UVLO Decreasing TA = +25°C CL = 22µF RL = 10Ω VIN 2V/div TA = +25°C CL = 22µF RL = 10Ω VIN 2V/div IOUT 200mA/div IOUT 200mA/div VOUT 2V/div 2ms/div 20ms/div Discharge Time No Load Resistance Inrush Current CL = 470µF TA = +25°C VIN = 5V No Load Resistance CL = 680µF CL = 120µF CL = 220µF IIN 200mA/div VEN 2V/div CL = 100µF VIN = 5V TA = +25°C RL = 10Ω R = 10Ω CL = 22µF VEN 5V/div 1ms/div 100ms/div AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 7 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Performance Characteristics (cont.) Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 500 400 CL = 1µF RL = 10Ω TA = +25°C 300 200 30 CL = 1µF RL = 10Ω TA = +25°C 30 29 29 28 100 0 28 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 4 4.5 5 5.5 6 Fall Time vs Input Voltage 600 25 500 24 400 Fall Time (us) Rise Time (us) Rise Time vs Input Voltage CL = 1µF RL = 10Ω TA = +25°C 300 200 23 CL = 1µF RL = 10Ω TA = +25°C 22 21 20 100 0 19 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature 1.60 Supply Current, Output Disabled (uA) 65 Supply Current, Output Enabled (uA) 3.5 Input Voltage (V) Input Voltage (V) 60 VIN = 5.0V 55 VIN = 5.5V 50 45 VIN = 2.7V 40 VIN = 3.3V 35 VIN = 5.5V 1.40 1.20 VIN = 5.0V 1.00 VIN = 3.3V 0.80 0.60 VIN = 2.7V 0.40 0.20 0.00 30 -60 -40 -20 0 20 40 60 80 100 -45 AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 -25 -5 15 35 55 75 95 Ambient Temperature (°C) Ambient Temperature (°C) 8 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Typical Performance Characteristics (cont.) Static Drain-Source On-State Resistance vs Ambient Temperature Short-Circuit Output Current vs Ambient Temperature 710 Short-Circuit Output Current (mA) 200 Static Drain-Source On-State Resistance (mΩ) 190 VIN = 3.3V 180 VIN = 2.7V 170 160 150 140 130 120 110 VIN = 5V 100 VIN = 3.3V 700 VIN = 5V VIN = 2.7V 690 VIN = 5V 680 670 660 650 VIN = 5.5V 640 630 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 1.15 2.05 2.03 Threshold Trip Current (A) Undervoltage Lockout (V) 2.04 UVLO Rising 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA = +25°C CL = 22µF 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) 9 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Application Information The AP2141D and AP2151D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, make these power switches ideal for hot-swap or hot-plug applications. Protection Features: Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2141D/2151D are outlined below: S.NO 1 Conditions Explanation Output is shorted before input Short circuit condition at start-up voltage is applied or before the part is enabled Behavior of the AP2141D/2151D The IC senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. 2 Short-circuit or Overcurrent condition At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can Short-Circuit or Overload condition react. that occurs when the part is After the current limit function has tripped (reached the overenabled. current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. 3 Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold.(ITRIG) The current rises until ITRIG or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperatures (< -20oC), a minimum 120 µF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or shortcircuit faults are present for extended periods of time. The AP2141D/AP2151D implements thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back on. The builtin thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch. Reverse Current Protection In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks reverse current flow from the output back to the input. AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 10 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Application Information (continued) Special Functions: Discharge Function When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FLG Response The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Temperature. The time from when a fault condition is encountered to when the FLG output goes low is 7-ms (typ). The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery. The AP2141D/AP2151D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC delay network. Power Supply Considerations A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents the output from going negative during turn-off due to inductive parasitics. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 The junction temperature can be calculated by: TJ = PD x RθJA + TA Where: TA= Ambient Temperature °C RθJA = Thermal Resistance PD = Total Power Dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall times of the AP2141D/AP2151D, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2141D/AP2151D also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2141D/AP2151D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the system surge current and provides a hot-plugging mechanism for any device. Dual-Purpose Port Applications AP2141D/AP2151D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a nonrecommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2141D/AP2151D includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2141D/AP2151D is disabled. An overstress condition to the device's discharge MOS transistor may result. In addition, if the output of the AP2141D/AP2151D is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device may result. AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 11 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Ordering Information Note: Part Number Package Code Packaging AP21X1DSG-13 AP21X1DMPG-13 AP21X1DWG-7 AP21X1DFMG-7 S MP W FM SO-8 MSOP-8EP SOT25 U-DFN2018-6 7”/13” 13” Tape and Reel Quantity Part Number Suffix 2,500/Tape & Reel -13 2,500/Tape & Reel -13 3,000/Tape & Reel -7 3,000/Tape & Reel -7 9. For packaging details, ails, go to our website at http: http://www.diodes.com/products/packages.html. Marking Information (1) SO-8 ( Top View ) 8 7 6 5 1 : 1 Channel YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code G : Green Logo Part Number 4 : Active Low 5 : Active High AP21X X D YY WW X X 1 AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 2 3 4 12 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Marking Information (continued) (2) MSOP-8EP (3) SOT25 ( Top View ) 4 7 5 XX Y W X 1 (4) 2 3 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Device AP2141D AP2141DW AP2151D AP2151DW Package Type SOT25 SOT25 Identification Code JA JB Device AP2141DFM AP2151DFM Package type U-DFN2018-6 U-DFN2018-6 Identification Code JA JB U-DFN2018-6 AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 13 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. Package type: SO-8 0.254 (1) E1 E A1 L SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0° 8° θ All Dimensions in mm Gauge Plane Seating Plane Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D (2) Package Type: MSOP-8EP D x E E2 4X 10 ° 0.25 D1 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 14 of 18 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm March 2015 © Diodes Incorporated AP2141D/ AP2151D Package Outline Dimensions (continued) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (3) Package Type: SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° α All Dimensions in mm B C H K J (4) M N L D Package Type: U-DFN2018-6 A3 A U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm SEATING PLANE A1 Pin#1 ID D D2 L E2 E z e AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 b 15 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package Type: MSOP-8EP X C Dimensions C G X X1 Y Y1 Y2 Y G Y2 Y1 X1 (3) Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 Package Type: SOT25 C2 Z C2 Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 2.40 C2 0.95 C1 G Y X AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 16 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D Suggested Pad Layout (continued) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) Package type: U-DFN2018-6 X C Y Dimensions C G X X1 Y Y1 Y1 G Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 Taping Orientation (Note 10) For U-DFN2018-6 Note: 10. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf. AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 17 of 18 www.diodes.com March 2015 © Diodes Incorporated AP2141D/ AP2151D IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. 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A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com AP2141D/ AP2151D Document number: DS32242 Rev. 6 - 2 18 of 18 www.diodes.com March 2015 © Diodes Incorporated