Blackfin ADSP-BF70x Series of DSP Processors Industry’s Performance Leading Ultralow Power DSP Solution Overview Target Applications Include The new ADSP-BF70x Blackfin® processor series is a high performance DSP that delivers a class leading 800 MMACS of processing power at less than 100 mW. The cost-effective eight member series includes up to 1 MB of internal L2 SRAM, eliminating external memory in many applications, while a second configuration features an optional DDR2/LPDDR memory interface. Using the enhanced Blackfin+ core, the combination of performance, power efficiency, memory integration, security, and value allows designers to incorporate advanced 16- and 32-bit fixed-point processing into a range of new use cases, including industrial imaging and building controls as well as portable and automotive audio. The ADSP-BF70x series offers designers unparalleled flexibility and functionality through an array of advanced connectivity options (including USB, SDIO, CAN, ePPI, SPORT, QuadSPI) while enabling bus-powered applications and extending the life of battery-powered devices. • Intelligent lighting and occupancy detection SYSTEM CONTROL BLOCKS EMULATOR TEST AND CONTROL PERIPHERALS FAULT MANAGEMENT EVENT CONTROL • Portable audio, DJ equipment, and effects • Automotive audio • Communications • Military and aerospace • Portable healthcare Industry’s Performance Leading Ultralow Power DSP Solution 1× TWI PLL AND POWER MANAGEMENT • Industrial imaging and biometrics WATCHDOG 8× TIMER 1× COUNTER 200mW L2 MEMORY 2× CAN SPI HOST PORT SYSTEM FABRIC MEMORY PROTECTION DYNAMIC MEMORY CONTROLLER LPDDR DDR2 16 HARDWARE FUNCTIONS OTP MEMORY ADI 1× MSI (SD/SDIO) ANALOG SUBSYSTEM 200 MMACS 400 MMACS 600 MMACS 800 MMACS 1× PPI STATIC MEMORY CONTROLLER SYSTEM PROTECTION CRYPTO ENGINE (SECURITY) HADC 3× MDMA STREAMS ADI 50mW 2× SPORT EXTERNAL BUS INTERFACES LESS POWER 100mW GP I/O COMP 1× DUAL SPI 50% ADI 2× QUAD SPI ADSP-BF70x COMP 136kB PARITY BIT PROTECTED L1 SRAM INSTRUCTION/DATA 150mW 2× UART ADI ECC-PROTECTED (AND DMA MEMORY PROTECTION) COMP UP TO 1MB SRAM 512kB ROM 2× CRC 1× RTC 1× USB 2.0 HS OTG www.analog.com/BF70x Generic Device Package ADSP-BF700 ADSP-BF702 ADSP-BF704 12 mm × 12 mm, 88-lead LFCSP 300 MHz 400 MHz 100 MHz 200 MHz Max Speed Grades L1 Cache/SRAM (with Parity) L2 SRAM (with ECC) L2 ROM DDR2/LPDDR USB 2.0 HS (MAC/PHY) ADSP-BF706 ADSP-BF701 ADSP-BF703 ADSP-BF705 ADSP-BF707 12 mm × 12 mm, 0.8p, 184-ball CSP_BGA 100 MHz 300 MHz 200 MHz 400 MHz 136 kB 128 kB 256 kB 136 kB 512 kB 1024 kB 128 kB 256 kB 512 kB No 512 kB 1024 kB 512 kB 16 bit 1× OTG/device 1× OTG/device 4-bit 8-bit No Yes 43 47 ePPI for video I/O, SPORT with I2S (2), quad/dual SPI (2/1) including host mode, I2C, UART (2), CAN 2.0B (2) Security cryptographic accelerators, OTP, WDT, RTC, timer (8), counter SD/SDIO/MMC/eMMC 4-Channel 12-Bit ADC GPIOs Key Common Peripherals Other Features Features and Benefits Up to 400 MHz Blackfin+ core with single cycle MAC (2 × 16-bit, 32-bit, or complex); many efficiency improvements and Blackfin family code compatibility; benchmark example for 1024 pt cFFT: 23 μs (16-bit), 94 μs (32-bit) Scalable DSP Performance Best-in-Class Power Efficiency 118 μW/MMAC @ 400 MHz delivering 95 mW at 800 MMACs (40 nm LP) Large SRAM (up to 1 MB L2), multiple glueless connectivity options, 4-channel, 12-bit ADC and DDR2/LPDDR option, and cost optimized packaging IP protection and run-time security including AES128/256 and SHA-2 (224/256); fast secure boot (<55 ms for 512 kB boot image) Lowest BOM Cost Advanced Security Increased L1 cache bandwidth: Up to 3× from L2 SRAM and DDR2/LPDDR; high speed memory mapped quad-SPI with HOST and execute in place modes SRAM parity and ECC for safety providing best-in-class SER-FIT performance USB2.0HS, SDIO/eMMC, CAN 2.0, and more Efficient C compiler, optimized libraries, and hardware reference designs Other New Features to Blackfin Memory Protection Industry Standard Connectivity Fast Time to Market CrossCore Embedded Studio • CrossCore® Embedded Studio™ is ADI’s New Eclipse™-based tool chain • IDE and debugger • Compilers, assemblers, linker, loader • Algorithms and DSP libraries Analog Devices, Inc. Europe Headquarters Analog Devices, Inc. Wilhelm-Wagenfeld-Str. 6 80807 Munich Germany Tel: 49.89.76903.0 Fax: 49.89.76903.157 • Add-ins enable graphical configuration and code generation • Seamless integration with middleware • Micrium µC/OS-III,™ µC/OS-II™ real time kernels • Micrium µC/USB™ device, host stacks and class drivers • Micrium µC/FS™ file system • Low cost ADSP-BF70x development board • ADZS-BF707-EZLITE Analog Devices, Inc. Japan Headquarters Analog Devices, KK New Pier Takeshiba South Tower Building 1-16-1 Kaigan, Minato-ku, Tokyo, 105-6891 Japan Tel: 813.5402.8200 Fax: 813.5402.1064 • Optional EZ-Extenders for increased features • USB-based JTAG Emulators • Low cost ICE-1000 (ADZS-ICE-1000) • High performance ICE-2000 (ADZS-ICE-2000) • USB powered and JTAG/SWD up to 46 MHz • ARM® CoreSight™-based trace for program and system debug ADI’s EngineerZone® Support Community helps engineers get answers to technical questions about Analog Devices products and connect with their fellow engineers and experts around the globe. ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. Printed in the U.S.A. PH12511-.4-7/14 Analog Devices, Inc. Worldwide Headquarters Analog Devices, Inc. One Technology Way P.O. Box 9106 Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 (800.262.5643, U.S.A. only) Fax: 781.461.3113 www.analog.com/BF70x Analog Devices, Inc. Asia Pacific Headquarters Analog Devices 5F, Sandhill Plaza 2290 Zuchongzhi Road Zhangjiang Hi-Tech Park Pudong New District Shanghai, China 201203 Tel: 86.21.2320.8000 Fax: 86.21.2320.8222