BAV99BRLP SURFACE MOUNT SWITCHING DIODE ARRAY Features Mechanical Data • • • • • NEW PRODUCT • • • Fast Switching Speed Low Profile DFN Package (0.575mm typical thickness) is Much Thinner than Conventional SOT Style Packages Thermally Efficient DFN Package Features 500mW Power Dissipation Capability in a Compact 2.0 * 2.0mm Footprint Two “BAV99” Circuits In One Package Lead Free/RoHS Compliant (Note 1) "Green" Device (Note 2) DFN2020B-6 Top View • • • • Case: DFN2020B-6 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: NiPdAu over Copper leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Weight: 0.006 grams (approximate) AC1 C2 A2 6 5 4 1 2 3 A1 C1 AC2 Top View Internal Schematic Bottom View Pin 1 = A1 (anode 1, right below the notch indication) Pin 2 = C1 (cathode 1) Pin 3 = AC2 (internally connected to rectangular pad) Pin 4 = A2 (anode 2) Pin 5 = C2 (cathode 2) Pin 6 = AC1 (internally connected to the pad with a notch) Ordering Information (Note 3) Part Number BAV99BRLP-7 Notes: Case DFN2020B-6 Packaging 3000/Tape & Reel 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information CK = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September) Date Code Key Year Code Month Code 2011 Y Jan 1 2012 Z Feb 2 BAV99BRLP Document number: DS35317 Rev. 4 - 2 Mar 3 2013 A Apr 4 May 5 2014 B Jun 6 1 of 4 www.diodes.com 2015 C Jul 7 Aug 8 2016 D Sep 9 Oct O 2017 E Nov N Dec D July 2011 © Diodes Incorporated BAV99BRLP Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM NEW PRODUCT Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 4) Non-Repetitive Peak Forward Surge Current @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFSM Value 100 Unit V 75 V 53 300 3.0 2.0 0.5 V mA Value 500 250 -65 to +150 Unit mW °C/W °C A Thermal Characteristics Characteristic Power Dissipation Thermal Resistance Junction to Ambient Air Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG (Note 4) (Note 4) Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Symbol V(BR)R Min 75 Max ⎯ Unit V V Forward Voltage VF ⎯ 0.715 0.855 1.0 1.25 Reverse Current (Note 5) IR ⎯ 2.5 50 30 25 Total Capacitance CT ⎯ 2.0 μA μA μA nA pF Reverse Recovery Time trr ⎯ 4.0 ns Notes: Test Condition IR = 2.5μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 20V, TJ = 150°C VR = 20V VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 4. Device mounted on FR-4 PCB, on minimum recommended, 2oz copper pad layout. 5. Short duration pulse test used to minimize self-heating effect. BAV99BRLP Document number: DS35317 Rev. 4 - 2 2 of 4 www.diodes.com July 2011 © Diodes Incorporated BAV99BRLP 450 PD, POWER DISSIPATION (mW) Note 4 400 350 300 250 200 150 100 50 0 0.1 0.01 0.001 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (° C) 150 Fig. 1 Power Derating Curve, Total Package 10,000 0.5 1.0 1.5 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element 2 f=1MHz CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (nA) NEW PRODUCT 1 IF, INSTANTANEOUS FORWARD CURRENT (A) 500 1,000 100 10 1 0.1 1.6 1.2 0.8 0.4 0 60 80 100 20 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0 0 10 20 30 40 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element Package Outline Dimensions A A3 SEATING PLANE A1 D D2 z d E E2 f f L e b DFN2020B-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 ⎯ ⎯ b 0.20 0.30 0.25 D 1.95 2.075 2.00 d 0.45 ⎯ ⎯ D2 0.50 0.70 0.60 e 0.65 ⎯ ⎯ E 1.95 2.075 2.00 E2 0.90 1.10 1.00 f 0.15 ⎯ ⎯ L 0.25 0.35 0.30 z 0.225 ⎯ ⎯ All Dimensions in mm Bottom View BAV99BRLP Document number: DS35317 Rev. 4 - 2 3 of 4 www.diodes.com July 2011 © Diodes Incorporated BAV99BRLP Suggested Pad Layout C Y Dimensions Value (in mm) Z 1.67 G 0.20 G1 0.40 X1 1.0 X2 0.45 Y 0.37 Y1 0.70 C 0.65 G X2 G1 NEW PRODUCT X1 G Y1 Z IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com BAV99BRLP Document number: DS35317 Rev. 4 - 2 4 of 4 www.diodes.com July 2011 © Diodes Incorporated