STTH6010-Y Automotive ultrafast recovery - high voltage diode Datasheet - production data Description $ The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability like automotive applications. . $ These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. . '2 The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. Features AEC-Q101 qualified Table 1. Device summary Ultrafast, soft recovery IF(AV) 60 A Very low conduction and switching losses VRRM 1000 V High frequency and/or high pulsed current operation Tj (max.) 175 °C High reverse voltage capability VF (typ) 1.3 V High junction temperature trr (typ) 49 ns ECOPACK®2 compliant component April 2015 This is information on a product in full production. DocID018924 Rev 2 1/9 www.st.com Characteristics 1 STTH6010-Y Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 1000 V 80 A IF(AV) Average forward current Tc = 75 °C, = 0.5, square wave 60 A IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 450 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 400 A Tstg Storage temperature range -65 to + 175 °C Operating junction temperature range -40 to + 175 °C Value Unit 0.78 °C/W Tj Table 3. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 100 °C IF = 60 A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 µs, < 2% To evaluate the conduction losses use the following equation: P = 1.3 x IF(AV) + 0.0067 IF2(RMS) DocID018924 Rev 2 Unit 20 µA - 20 - Tj = 150 °C 2/9 Typ. Max. VR = VRRM Tj = 25 °C VF(2) Min. 200 2.0 - 1.4 1.8 - 1.3 1.7 V STTH6010-Y Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IF = 1 A, dlF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C - IF = 1 A, dlF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C - 61 80 IF = 1 A, dlF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C - 49 65 Reverse recovery current IF = 60 A, dlF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C - 31 40 A S Softness factor IF = 60 A, dlF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C - 1 tfr Forward recovery time IF = 60 A, dlF/dt = 100 A/µs, VFR = 1.5 x VFmax, Tj = 25 °C - 750 ns Forward recovery voltage IF = 60 A, dlF/dt = 100 A/µs, Tj = 25 °C - Reverse recovery time trr IRM VFP Figure 1. Conduction losses versus average current 115 4 ns V Figure 2. Forward voltage drop versus forward current ,)0$ 3: 7M & 0D[LPXPYDOXHV 7M & 7\SLFDOYDOXHV 7M & 0D[LPXPYDOXHV 7 ,)$9 $ 9)09 DocID018924 Rev 2 3/9 9 Characteristics STTH6010-Y Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dlF/dt (typical values) =WKMF5WKMF ,50$ 6LQJOHSXOVH 9 9 5 7M & , [, ) )$9 , , ) )$9 , ) [, )$9 W S V ( ( GO)GW$V ( ( Figure 5. Reverse recovery time versus dlF/dt (typical values) Figure 6. Reverse recovery charges versus dlF/dt (typical values) W UU QV 4UU& 95 9 7M & ,) [,)$9 , [, ) )$9 95 9 7M & ,) ,)$9 , , ) )$9 ,) [,)$9 , [, ) )$9 GO)GW$V GO)GW$V Figure 7. Softness factor versus dlF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature 6IDFWRU ,) [,)$9 95 9 7M & ,) ,)$9 95 9 5HIHUHQFH7M & 6IDFWRU ,50 W55 455 GO)GW$V 4/9 7M& DocID018924 Rev 2 STTH6010-Y Characteristics Figure 9. Transient peak forward voltage versus dlF/dt (typical values) Figure 10. Forward recovery times versus dlF/dt (typical values) WIUQV 9)39 ,) ,)$9 9)5 [9)PD[ ,) ,)$9 7M & 7M & GO)GW$V GO)GW$V Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Threshold voltage versus junction temperature &S) 9W9 ) 0+] 926& P9506 7M & 0D[LPXPYDOXHV 7\SLFDOYDOXHV 959 7M& Figure 13. Dynamic resistance versus junction temperature 5GPȍ 0D[LPXPYDOXHV 7\SLFDOYDOXHV 7M& DocID018924 Rev 2 5/9 9 Package information 2 STTH6010-Y Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 N·m Maximum torque value: 1.0 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DO-247 package information Figure 14. DO-247 package outline 9 'LD 9 $ + / / / ) / / / ) ' 9 ) * 6/9 DocID018924 Rev 2 0 ( STTH6010-Y Package information Table 6. DO-247 package mechanical data Dimensions Ref. Inches(1) Millimeters Typ. Min. Max. A 4.85 D Min. Max. 5.15 0.191 0.203 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 0.078 0.094 F2 2.00 F3 G Typ. 0.078 2.00 2.40 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 0.559 0.582 0.078 0.118 0.139 0.143 L2 18.50 L3 0.728 14.20 14.80 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 V 5° 5° V2 60° 60° Dia. 3.55 3.65 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID018924 Rev 2 7/9 9 Ordering information 3 STTH6010-Y Ordering information Table 7. Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STTH6010WY STTH6010WY DO-247 4.4 g 30 Tube Revision history Table 8. Document revision history 8/9 Date Revision Changes 04-Nov-2011 1 Initial release. 22-Apr-2015 2 Added Figure 12 and Figure 13. Document updated to current standard. 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All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID018924 Rev 2 9/9 9