TC2117 800 mA Fixed Low Dropout Positive Regulator Features: General Description: • • • • • • • The TC2117 is a fixed, high-accuracy (typically ±0.5%) CMOS low dropout regulator. Designed specifically for battery operated systems, the TC2117’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 µA at full load (20 to 60 times lower than in bipolar regulators). Fixed Output Voltages: 1.8V, 2.5V, 3.0V, 3.3V Very Low Dropout Voltage Rated 800 mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection Space Saving SOT-223 Package Applications: 5V to 3.3V Linear Regulator Portable Computers Instrumentation Battery Operated Systems Linear Post-Regulator for SMPS Core Voltage Supply for FPGAs, PLDs, CPUs and DSPs Package Types 3-Pin SOT-223 Front View Typical Application 2010 Microchip Technology Inc. GND 1 2 3 VIN TC2117 VOUT TC2117 GND GND 2 TC2117 Battery C2 1µF VIN 1 VOUT VOUT Tab is VOUT 3 Tab is VOUT VIN C1 1µF 3-Pin DDPAK Front View VOUT • • • • • • TC2117 key features include ultra low noise, very low dropout voltage (typically 450 mV at full load), and fast response to step changes in load. The TC2117 incorporates both overtemperature and overcurrent protection. The TC2117 is stable with an output capacitor of only 1 µF and has a maximum output current of 800 mA. This device is available in 3-Pin SOT-223 and 3-Pin DDPAK packages. DS21665D-page 1 TC2117 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Input Voltage .........................................................6.5V Output Voltage.................... (VSS – 0.3) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin .........VIN +0.3V to -0.3V Operating Temperature ............... -40°C < TJ < +125°C Storage temperature ..........................-65°C to +150°C † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Input Operating Voltage Maximum Output Current Output Voltage Sym Min Typ Max Units VIN 2.7 — 6.0 V — — mA IOUTMAX 800 VOUT VR – 2.5% VR – 2% VR ± 0.5% VR + 2.5% VR ± 0.5% Conditions Note 2 VR 2.5V V VR + 3% VR = 1.8V VOUT/T — 40 — ppm/°C Line Regulation VOUT/VIN — 0.007 0.35 % Load Regulation (Note 4) VOUT/VOUT -0.01 0.002 0 %/mA IL = 0.1 mA to IOUTMAX Dropout Voltage (Note 5) VIN–VOUT — 20 30 mV VR 2.5V, IL = 100 µA VOUT Temperature Coefficient Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise Note 1: 2: 3: 4: 5: 6: 7: Note 3 (VR + 1V) VIN6V — 50 160 VR 2.5V, IL = 100 mA — 150 480 VR 2.5V, IL = 300 mA — 260 800 VR 2.5V, IL = 500 mA — 450 1300 VR 2.5V, IL = 800 mA VR = 1.8V, IL = 500 mA — 1000 1200 — 1200 1400 IL = 800 mA IDD — 80 130 µA SHDN = VIH, IL = 0 PSRR — 55 — db F 1 kHz IOUTSC — 1200 — mA VOUT = 0V VOUT/PD — 0.04 — V/W Note 6 eN — 300 — nV/Hz IL = 100 mA, F = 10 kHZ VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 6 V OUTMAX – V OUTMIN – 10 TCV OUT = ------------------------------------------------------------------------V OUT T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.2 “Thermal Considerations” for more details. DS21665D-page 2 2010 Microchip Technology Inc. TC2117 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 3L-SOT-223 JA — 59 — °C/W Thermal Resistance, 3L-DDPAK JA — 71 — °C/W Conditions Temperature Ranges (Note 1) Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C). 2010 Microchip Technology Inc. DS21665D-page 3 TC2117 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 LINE REGULATION (%) 0.018 0.016 150 VIN = 3.5V to 6.0V VOUT = 2.5V IOUT = 0.1mA VIN = VOUT +1V IOUT = 0.1mA 135 120 0.014 105 0.012 I DD(A) 2.0 0.010 0.008 0.006 VOUT = 5V 90 75 VOUT = 2.5V 60 45 0.004 30 0.002 15 0.000 -40°C 0°C 25°C 70°C 85°C 0 125°C Line Regulation vs. NOISE (μV/√Hz) 10.0 CIN = 1 μF C OUT = 1 μF V IN = 6.0V VOUT = 5V I OUT = 100 mA 1.0 85°C 70°C 125°C TEMPERATURE (°C) 0.1 FIGURE 2-4: DROPOUT VOLTAGE (V) FIGURE 2-1: Temperature. 25°C -40°C 0°C TEMPERATURE (°C) 0.600 0.550 0.500 0.450 0.400 0.350 0.300 IDD vs. Temperature. 125°C 85°C 70°C 25°C VOUT = 3V 0°C 0.250 0.200 0.150 0.100 -40°C 0.050 0.0 0.01 0.01 1 10 100 0.000 1000 0 100 200 300 400 500 600 700 800 I LOAD (mA) FREQUENCY (kHz) FIGURE 2-2: Output Noise vs. Frequency. FIGURE 2-5: 3.030 3.020 0.0090 0.0070 0.0060 0.0050 1 mA to 800 mA VOUT = 3V 0.0040 2.980 2.960 2.950 2.940 0.0010 2.930 0°C 25°C 70°C 85°C 125°C 2.920 -40°C 0°C DS21665D-page 4 ILOAD = 800 mA 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) Load Regulation vs. ILOAD = 500 mA 2.970 0.0020 0.0100 -40°C ILOAD = 300 mA 2.990 0.0030 FIGURE 2-3: Temperature. ILOAD = 0.1 mA 3.010 3.000 0.0080 VOUT (V) LOAD REGULATION %/mA 0.0100 Dropout Voltage vs. ILOAD. FIGURE 2-6: 3.0V VOUT vs.Temperature. 2010 Microchip Technology Inc. TC2117 -10 IOUT=300 mA VIN=4.0V to 5.0V PSRR (dB) -20 COUT=10 µF Tantalum (0.25 ESR) CIN=NA -30 -40 -50 VOUT -60 -70 50 mV/DIV 10 100 1k 10k 100k 1M f (Hz) FIGURE 2-7: Ratio. Power Supply Rejection FIGURE 2-9: Line Step Response VIN=4.0V VOUT=3.0V CIN=1 µF Ceramic COUT=10 µF Ta 50 mV/DIV 600 mA/DIV FIGURE 2-8: Load Step Response. 2010 Microchip Technology Inc. DS21665D-page 5 TC2117 3.0 PIN DESCRIPTIONS The descriptions for the pins are listed in Table 3-1. TABLE 3-1: Pin No. (3-Pin SOT-223) (3-Pin DDPAK) 3.1 PIN FUNCTION TABLE Symbol Description 1 GND Ground Terminal. 2 VOUT Regulated output voltage. 3 VIN Unregulated Supply input. Ground (GND) Ground terminal. 3.2 Regulated Output Voltage (VOUT) Regulated voltage output. 3.3 Unregulated Supply (VIN) Unregulated supply input. DS21665D-page 6 2010 Microchip Technology Inc. TC2117 4.0 DETAILED DESCRIPTION 4.2.2 The TC2117 is a precision, positive output LDO. Unlike bipolar regulators, the TC2117 supply current does not increase proportionally with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to 800 mA operating load range. POWER DISSIPATION The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate the worst-case actual power dissipation: EQUATION 4-1: P D = V INMAX – VOUTMIN ILOADMAX VIN C1 1µF VOUT VOUT TC2117 Battery C2 1µF GND FIGURE 4-1: 4.1 Typical Application Circuit. Output Capacitor A 1 µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.2 to 10. A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.2 4.2.1 Thermal Considerations THERMAL SHUTDOWN Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (+125°C) and the thermal resistance from junction-to-air (JA). EQUATION 4-2: PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Table 4-2 shows various values of JA for the TC2117 mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper foil. TABLE 4-2: THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN SOT-223 PACKAGE Copper Area (Topside)* Copper Area (Backside) Board Area Thermal Resistance 2500 sq mm 2500 sq mm 2500 sq mm 45°C/W 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W 225 sq mm 2500 sq mm 2500 sq mm 53°C/W 100 sq mm 2500 sq mm 2500 sq mm 59°C/W 1000 sq mm 1000 sq mm 1000 sq mm 52°C/W 1000 sq mm 0 sq mm 1000 sq mm 55°C/W * Tab of device attached to topside copper. 2010 Microchip Technology Inc. DS21665D-page 7 TC2117 TABLE 4-3: THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN DDPAK PACKAGE Copper Area (Topside)* Copper Area (Backside) Board Area Thermal Resistance (JA) 2500 sq mm 2500 sq mm 2500 sq mm 25°C/W 1000 sq mm 2500 sq mm 2500 sq mm 27°C/W 125 sq mm 2500 sq mm 2500 sq mm 35°C/W *Tab of device attached to topside copper. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 5.0V ± 5% VOUTMIN = 3.3V ± 0.5% ILOADMAX = 400 mA TJMAX = 125°C TAMAX = 55°C JA = 59°C/W (SOT-223) Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX – VOUTMIN)ILOADMAX = [(5.0 x 1.05) – (3.3 x .995)] 400 x 10-3 = 786 mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) JA = (125 – 55) 59 = 1.186W In this example, the TC2117 dissipates a maximum of only 786 mW, which is below the allowable limit of 1.186W. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate the maximum current and/or input voltage limits. DS21665D-page 8 2010 Microchip Technology Inc. TC2117 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Lead DDPAK Example XXXXXXXXX XXXXXXXXX YYWWNNN 3-Lead SOT-223 XXXXXXX XXXYYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: TC2117 e3 1.8VEB^^ 1034256 Example 2117-25 VDB1034 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010 Microchip Technology Inc. DS21665D-page 9 TC2117 /HDG3ODVWLF(%>''3$.@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ E E1 L1 D1 D H 1 N b BOTTOM VIEW e TOP VIEW b1 CHAMFER OPTIONAL C2 A φ c A1 L 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ %6& ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± ([SRVHG3DG:LGWK ( ± ± 0ROGHG3DFNDJH/HQJWK ' ± 2YHUDOO/HQJWK + ± ([SRVHG3DG/HQJWK ' ± ± /HDG7KLFNQHVV F ± 3DG7KLFNQHVV & ± /RZHU/HDG:LGWK E ± 8SSHU/HDG:LGWK E ± )RRW/HQJWK / ± 3DG/HQJWK / ± ± )RRW$QJOH ± 1RWHV 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21665D-page 10 2010 Microchip Technology Inc. TC2117 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. DS21665D-page 11 TC2117 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D b2 E1 E 3 2 1 e e1 A2 A b c φ L A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± ± 6WDQGRII $ ± 0ROGHG3DFNDJH+HLJKW $ 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' /HDG7KLFNQHVV F /HDG:LGWK E 7DE/HDG:LGWK E )RRW/HQJWK / ± ± /HDG$QJOH ± %6& 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21665D-page 12 2010 Microchip Technology Inc. TC2117 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 2010 Microchip Technology Inc. DS21665D-page 13 TC2117 NOTES: DS21665D-page 14 2010 Microchip Technology Inc. TC2117 APPENDIX A: REVISION HISTORY Revision D (September 2010) The following is the list of modifications: 1. 2. Updated Figure 2-4. Updated package drawings (C04-011B, C04-2011A, C04-032B, C04-2032A). Revision C (October 2006) The following is the list of modifications: 1. 2. 3. 4. Section 1.0 “Electrical Characteristics”: Changed dropout voltage typical value for IL = 500 mA from 700 to 1000 and maximum value from 1000 to 1200 for. Changed typical value for IL = 800 mA from 890 to 1200. Section 5.0 “Packaging information”: Added package marking information and package outline drawings. Added disclaimer to package outline drawings. Added Appendix A Revision History. Revision B (May 2002) • Undocumented Changes. Revision A (May 2001) • Original Release of this Document. 2010 Microchip Technology Inc. DS21665D-page 15 TC2117 NOTES: DS21665D-page 16 2010 Microchip Technology Inc. TC2117 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X.XX XX XX Device Voltage Option Package Tape and Reel Examples: a) b) c) Device TC2117 Fixed Output CMOS LDO Positive Regulator Voltage Option:* 1.8V 2.5V 3.0V 3.3V = = = = 1.8V 2.5V 3.0V 3.3V * Other output voltages are available. Please contact your local Microchip sales office for details. Package DB = DBTR = EB = EBTR = Plastic (SOT-223), 3-lead Plastic (SOT-223), 3-lead, Tape and Reel Plastic Transistor Outline (DDPAK), 3-Lead Plastic Transistor Outline (DDPAK), 3-Lead, Tape and Reel 2010 Microchip Technology Inc. d) a) b) c) d) e) f) g) h) TC2117-1.8VEBTR 1.8V LDO, DDPAK-3 pkg., Tape and Reel TC2117-2.5VEBTR 2.5V LDO, DDPAK-3 pkg., Tape and Reel TC2117-3.0VEBTR 3.0V LDO, DDPAK-3 pkg., Tape and Reel TC2117-3.3VEBTR 3.3V LDO, DDPAK-3 pkg., Tape and Reel TC2117-1.8VDB 1.8V LDO, SOT-223 pkg. TC2117-1.8VDBTR 1.8V LDO, SOT-223 pkg., Tape and Reel TC2117-2.5VDB 2.5V LDO, SOT-223 pkg. TC2117-2.5VDBTR 2.5V LDO, SOT-223 pkg., Tape and Reel TC2117-3.0VDB 3.0V LDO, SOT-223 pkg. TC2117-3.0VDBTR 3.0V LDO, SOT-223 pkg., Tape and Reel TC2117-3.3VDB 3.3V LDO, SOT-223 pkg. TC2117-3.3VDBTR 3.3V LDO, SOT-223 pkg., Tape and Reel DS21665D-page 17 TC2117 NOTES: DS21665D-page 18 2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-563-3 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010 Microchip Technology Inc. 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