TC1108 300mA CMOS LDO Features General Description • • • • • • The TC1108 is a fixed output, high accuracy (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). Extremely Low Supply Current (50µA, Typ.) Very Low Dropout Voltage 300mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection The TC1108 incorporates both over temperature and over current protection. The TC1108 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA. It is available in a SOT-223 package. Applications • • • • • • • TC1108 key features include ultra low noise operation, very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VIN 1 Device Selection Table VIN VOUT TC1108 Part Number Package Junction Temp. Range TC1108-xxVDB 3-Pin SOT-223 -40°C to +125°C 2 3 VOUT + C1 1µF GND NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages are available. Please contact Microchip Technology Inc. for details. Package Type SOT-223 TC1108VDB 1 2 3 VIN GND VOUT 2002 Microchip Technology Inc. DS21357B-page 1 TC1108 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C TC1108 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 300 — — mA VOUT Output Voltage — VR – 2.5% VR ±0.5% — — VR + 2.5% V ∆VOUT/∆T VOUT Temperature Coefficient — 40 — Test Conditions Note 7 Note 1 ppm/°C Note 2 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 % (VR + 1V) ≤ VIN ≤ 6V ∆VOUT/VOUT Load Regulation — 0.5 2.0 % IL = 0.1mA to IOUTMAX (Note 3) VIN-VOUT Dropout Voltage — — — 20 80 240 30 160 480 mV IDD Supply Current — 50 90 µA IL = 0.1mA IL = 100mA IL = 300mA (Note 4) PSRR Power Supply Rejection Ratio — 60 — dB FRE ≤ 1kHz IOUTSC Output Short Circuit Current — 550 650 mA VOUT = 0V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W Note 5 eN Output Noise — 260 — Note 1: 2: 3: 4: 5: 6: 7: nV/√Hz F = 10kHz, COUT = 1µF, RLOAD = 50Ω VR is the regulator output voltage setting. TC VOUT = (VOUT MAX – VOUT MIN) x 10 6 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to I OUT MAX. DS21357B-page 2 2002 Microchip Technology Inc. TC1108 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (3-Pin SOT-223) 3.0 Symbol Description 1 VIN 2 GND Ground terminal. 3 VOUT Regulated voltage output. Unregulated supply input. DETAILED DESCRIPTION 3.1 The TC1108 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1108’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT 1 + + Battery C1 1µF VOUT TC1108 2 – VIN 3 + VOUT C2 1µF Output Capacitor A 1µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. GND 2002 Microchip Technology Inc. DS21357B-page 3 TC1108 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Given: VINMAX = 3.3V + 10% VOUTMIN = 2.7V – 0.5% ILOADMAX = 275mA TJMAX = 125°C TAMAX = 95°C θJA = 59°C/W Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD = VINMAX = VOUTMIN = ILOADMAX = Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3 = 260mW Worst case actual power dissipation Maximum voltage on VIN Minimum regulator output voltage Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). EQUATION 4-2: PDMAX = (T JMAX – TAMAX) θJA Where all terms are previously defined. Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 95) 59 = 508mW In this example, the TC1108 dissipates a maximum of 260mW; below the allowable limit of 508mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by sustituting the maximum allowable power dissipation of 508mW into Equation 4-1, from which VINMAX = 4.6V. Table 4-1 shows various values of θJA for the TC1108 versus board copper area. TABLE 4-1: Copper Area (Topside)* THERMAL RESISTANCE GUIDELINES FOR TC1108 Copper Area (Backside) Board Area 2500 sq mm 2500 sq mm 2500 sq mm Thermal Resistance (θJA) 45°C/W 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W 225 sq mm 2500 sq mm 2500 sq mm 53°C/W 100 sq mm 2500 sq mm 2500 sq mm 59°C/W 1000 sq mm 1000 sq mm 1000 sq mm 52°C/W 1000 sq mm 55°C/W 0 sq mm 1000 sq mm NOTE: *Tab of device attached to topside copper DS21357B-page 4 2002 Microchip Technology Inc. TC1108 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.00 10.0 RLOAD = 50Ω COUT = 1µF 1.80 LOAD REGULATION (%) 0.010 0.008 NOISE (µV/√HZ) LINE REGULATION (%) Load Regulation Output Noise Line Regulation 0.012 0.006 0.004 0.002 1.0 0.1 0.000 -0.002 1.40 1 to 300mA 1.20 1.00 0.80 0.60 1 to 100mA 0.40 1 to 50mA 0.20 0.0 0.01 -0.004 -40° -20° 0° 20° 40° 60° 80° 100° 120° 0.01 TEMPERATURE (°C) 10 1 Supply Current 60.0 50.0 VOUT vs. Temperature 3.075 85°C C 0.30 70°C 0.25 VIN = 4V ILOAD = 100µA CLOAD = 3.3µF 3.025 VOUT (V) DROPOUT VOLTAGE (V) 70.0 TEMPERATURE (°C) 125°C 0.35 80.0 0.00 -40° -20° 0° 20° 40° 60° 80° 100° 120° 1000 Dropout Voltage vs. Load Current 0.40 90.0 100 FREQUENCY (kHz) 100.0 SUPPLY CURRENT (µA) 1.60 25°C 0.20 0°C C 0.15 2.975 0.10 -40°C 0.05 40.0 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) 2002 Microchip Technology Inc. 0.00 0 50 100 150 200 LOAD CURRENT (mA) 250 300 2.925 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) DS21357B-page 5 TC1108 6.0 PACKAGING INFORMATION 6.1 Package Marking Information “1” = part number code “2” = represents temperature + date code + lot identity + subcontractor identity TC1108 (V) 6.2 Code TC1108-2.5VDB 110825 TC1108-2.8VDB 110828 TC1108-3.0VDB 110830 TC1108-3.3VDB 110833 TC1108-5.0VDB 110850 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 3-Pin SOT-223 DS21357B-page 6 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 4000 13 in 2002 Microchip Technology Inc. TC1108 6.3 Package Dimensions 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) .033 (0.84) PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .013 (0.33) .009 (0.24) 10° MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP. .036 (0.91) MIN. Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21357B-page 7 TC1108 NOTES: DS21357B-page 8 2002 Microchip Technology Inc. TC1108 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21357B-page 9 TC1108 NOTES: DS21357B-page 10 2002 Microchip Technology Inc. TC1108 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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