TC1264 DATA SHEET (10/01/2010) DOWNLOAD

TC1264
800 mA Fixed-Output CMOS LDO with Shutdown
Features:
Description:
•
•
•
•
•
The TC1264 is a fixed-output, high-accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1264’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
Very Low Dropout Voltage
800 mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Overcurrent and Overtemperature Protection
Applications:
•
•
•
•
•
•
•
TC1264 key features include ultra low noise operation,
very low dropout voltage (typically 450 mV at full load),
and fast response to step changes in load.
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
The TC1264 incorporates both over temperature and
over current protection. The TC1264 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 800 mA. It is available in 3-pin
SOT-223, 3-pin TO-220 and 3-pin DDPAK packages.
Package Type
Typical Application
3-Pin DDPAK
3-Pin TO-220
VIN
VIN
VOUT
TC1264
+
FRONT VIEW
VOUT
TAB IS GND
C1
1 µF
TC1264
TC1264
1 2
1 2
3
GND
VOUT
FRONT VIEW
3 VOUT
2 GND
TC1264
 2010 Microchip Technology Inc.
VIN
3-Pin SOT-223
TAB IS GND
GND
3
VOUT
VIN
GND
1 VIN
DS21375D-page 1
TC1264
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 8)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Input Operating Voltage
Maximum Output Current
Output Voltage
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
IOUTMAX
800
—
—
mA
VOUT
VR – 2.5%
VR ± 0.5% VR + 2.5%
Conditions
Note 2
VR  2.5V
V
VR – 2%
VR ± 0.5%
VR + 3%
VR = 1.8V
VR – 7%
—
VR + 3%
IL = 0.1 mA to 800 mA
(Note 3)
VOUT/T
—
40
—
ppm/°C
Line Regulation
VOUT/VIN
—
0.007
0.35
%
Load Regulation (Note 5)
VOUT/VOUT
-0.01
0.002
0
%/mA
IL = 0.1 mA to IOUTMAX
Dropout Voltage (Note 6)
VIN–VOUT
—
20
30
mV
VR  2.5V, IL = 100 µA
—
50
160
VR  2.5V, IL = 100 mA
—
150
480
VR  2.5V, IL = 300 mA
—
260
800
VR  2.5V, IL = 500 mA
—
450
1300
VR  2.5V, IL = 800 mA
VR = 1.8V, IL = 500 mA
VOUT Temperature Coefficient
Supply Current
—
1000
1200
—
1200
1400
Note 4
(VR + 1V) VIN6V
IL = 800 mA
IDD
—
80
130
µA
SHDN = VIH, IL = 0
Power Supply Rejection Ratio
PSRR
—
64
—
db
F 1 kHz
Output Short Circuit Current
IOUTSC
—
1200
—
mA
VOUT = 0V
Note 1:
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
5:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
6:
7:
8:
6
 V OUTMAX – V OUTMIN  – 10
TCV OUT = ------------------------------------------------------------------------V OUT  T
DS21375D-page 2
 2010 Microchip Technology Inc.
TC1264
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Thermal Regulation
Output Noise
Note 1:
Min
Typ
Max
Units
VOUT/PD
—
0.04
—
V/W
eN
—
260
—
nV/Hz
Conditions
Note 7
IL = IOUTMAX, F = 10 kHZ
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
6
TCV OUT
5:
6:
7:
8:
 V OUTMAX – V OUTMIN  – 10
= ------------------------------------------------------------------------V OUT  T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 3L-SOT-223
JA
—
59
—
°C/W
Thermal Resistance, 3L-DDPAK
JA
—
71
—
°C/W
Thermal Resistance, 3L-TO-220
JA
—
71
—
°C/W
Conditions
Temperature Ranges
(Note 1)
Thermal Package Resistances
Note 1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
 2010 Microchip Technology Inc.
DS21375D-page 3
TC1264
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
LINE REGULATION (%)
Note:
0.020
150
0.018
135
0.016
120
0.014
105
0.012
90
IDD (—A)
2.0
0.010
0.008
60
0.006
45
0.004
30
0.002
15
0.000
-40°C
0°C
25°C
70°C
VOUT = 3V
75
0
-40°C
85°C 125°C
0°C
TEMPERATURE (°C)
FIGURE 2-1:
Temperature.
Line Regulation vs.
RLOAD = 50Ω
COUT = 1 μF
FIGURE 2-4:
DROPOUT VOLTAGE (V)
NOISE (μV/√Hz)
10.0
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
1.0
0.1
IDD vs. Temperature.
0.600
0.550
0.500
0.450
0.400
0.350
125°C
85°C
70°C
25°C
0.300
0°C
0.250
0.200
-40°C
0.150
0.100
0.050
0.000
0.0
0.01
0.01
1
10
100
1000
0 100 200 300 400 500 600 700 800
ILOAD (mA)
FREQUENCY (kHz)
FIGURE 2-2:
Output Noise vs. Frequency.
FIGURE 2-5:
ILOAD.
0.0100
3.030
3.020
ILOAD = 0.1 mA
3.010
3.000
0.0080
0.0070
0.0060
VOUT = 3V
1 mA to 800 mA
0.0040
0.0030
VOUT (V)
LOAD REGULATION (%/mA)
0.0090
0.0050
3.0V Dropout Voltage vs.
2.980
2.960
2.950
2.940
0.0010
2.930
0°C
25°C
70°C
85°C
125°C
2.920
-40°C
DS21375D-page 4
Load Regulation vs.
ILOAD = 800 mA
0°C
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
ILOAD = 500 mA
2.970
0.0020
0.0100
-40°C
ILOAD = 300 mA
2.990
FIGURE 2-6:
3.0V VOUT vs.Temperature.
 2010 Microchip Technology Inc.
TC1264
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
3-Pin SOT-223
3-Pin TO-220
3-Pin DDPAK
Symbol
1
VIN
2
GND
Ground terminal
3
VOUT
Regulated voltage output
3.1
Description
Unregulated supply input
Unregulated Supply (VIN)
Unregulated supply input.
3.2
Ground (GND)
Ground terminal.
3.3
Regulated Output Voltage (VOUT)
Regulated voltage output.
 2010 Microchip Technology Inc.
DS21375D-page 5
TC1264
4.0
DETAILED DESCRIPTION
The TC1264 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1264’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
VIN
VIN
VOUT
TC1264
GND
FIGURE 4-1:
DS21375D-page 6
+
VOUT
C1
1 µF
4.1
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1 and less than 5. A 1 µF
capacitor should be connected from VIN to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
SHDN
Typical Application Circuit.
 2010 Microchip Technology Inc.
TC1264
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
EQUATION 5-1:
P D =  V INMAX – VOUTMIN ILOADMAX
Where:
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
EQUATION 5-2:
Copper
Area
(Backside)
Thermal
Resistance
JA)
Board
Area
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
* Tab of device attached to topside copper
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 3.3V ± 10%
TJMAX = 125°C
TAMAX = 95°C
JA = 59°C/W (SOT-223)
Find:
1. Actual power dissipation.
2. Maximum allowable dissipation.
Actual power dissipation:
P D   VINMAX – V OUTMIN I LOADMAX
Table 5-1 and Table 5-2 show various values of JA for
the TC1264 packages.
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
SOT-223 PACKAGE
Copper
Area
(Backside)
Board
Area
–3
P D = 260 mW
Where all terms are previously defined.
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm
45°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm
2500 sq mm 2500 sq mm
53°C/W
100 sq mm
2500 sq mm 2500 sq mm
59°C/W
1000 sq mm 1000 sq mm 1000 sq mm
52°C/W
1000 sq mm
55°C/W
0 sq mm
ILOADMAX = 275 mA
P D =  3.3  1.1  –  2.7  .995  275  10
PDMAX = (TJMAX – TAMAX)
JA
Copper
Area
(Topside)*
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
3-PIN DDPAK/TO-220
PACKAGE
VOUTMIN = 2.7V ± 0.5%
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
TABLE 5-1:
TABLE 5-2:
1000 sq mm
Maximum allowable power dissipation:
T JMAX – T AMAX
P DMAX = -------------------------------------- JA
 125 – 95 
P DMAX = ------------------------59
P DMAX = 508 mW
In this example, the TC1264 dissipates a maximum of
260 mW, which is below the allowable limit of 508 mW.
In a similar manner, Equation 5-1 and Equation 5-2 can
be used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by substituting the maximum allowable
power dissipation of 508 mW into Equation 5-1, from
which VINMAX = 4.6V.
* Tab of device attached to topside copper
 2010 Microchip Technology Inc.
DS21375D-page 7
TC1264
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Lead DDPAK
Example
XXXXXXXXX
XXXXXXXXX
YYWWNNN
3-Lead SOT-223
XXXXXXX
XXXYYWW
NNN
3-Lead TO-220
XXXXXXXXX
XXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21375D-page 8
TC1264
e3
1.8VEB^^
1030256
Example
1264-25
VDB1030
256
Example
TC1264
e3
3.0VAB^^
1030256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2010 Microchip Technology Inc.
TC1264
/HDG3ODVWLF(%>''3$.@
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
E
E1
L1
D1
D
H
1
N
b
BOTTOM VIEW
e
TOP VIEW
b1
CHAMFER
OPTIONAL
C2
A
φ
c
A1
L
8QLWV
'LPHQVLRQ/LPLWV
1XPEHURI3LQV
,1&+(6
0,1
1
120
0$;
3LWFK
H
2YHUDOO+HLJKW
$
%6&
±
6WDQGRII†
$
±
2YHUDOO:LGWK
(
±
([SRVHG3DG:LGWK
(
±
±
0ROGHG3DFNDJH/HQJWK
'
±
2YHUDOO/HQJWK
+
±
([SRVHG3DG/HQJWK
'
±
±
/HDG7KLFNQHVV
F
±
3DG7KLFNQHVV
&
±
/RZHU/HDG:LGWK
E
±
8SSHU/HDG:LGWK
E
±
)RRW/HQJWK
/
±
3DG/HQJWK
/
±
±
)RRW$QJOH
ƒ
±
ƒ
1RWHV
†6LJQLILFDQW&KDUDFWHULVWLF
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
 2010 Microchip Technology Inc.
DS21375D-page 9
TC1264
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21375D-page 10
 2010 Microchip Technology Inc.
TC1264
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
D
b2
E1
E
3
2
1
e
e1
A2
A
b
c
φ
L
A1
8QLWV
'LPHQVLRQ/LPLWV
1XPEHURI/HDGV
0,//,0(7(56
0,1
120
0$;
1
/HDG3LWFK
H
%6&
2XWVLGH/HDG3LWFK
H
2YHUDOO+HLJKW
$
±
±
6WDQGRII
$
±
0ROGHG3DFNDJH+HLJKW
$
2YHUDOO:LGWK
(
0ROGHG3DFNDJH:LGWK
(
2YHUDOO/HQJWK
'
/HDG7KLFNQHVV
F
/HDG:LGWK
E
7DE/HDG:LGWK
E
)RRW/HQJWK
/
±
±
/HDG$QJOH
ƒ
±
ƒ
%6&
1RWHV
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
 2010 Microchip Technology Inc.
DS21375D-page 11
TC1264
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
DS21375D-page 12
 2010 Microchip Technology Inc.
TC1264
/HDG3ODVWLF7UDQVLVWRU2XWOLQH$%>72@
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
CHAMFER
OPTIONAL
φP
E
A
A1
Q
H1
D
D1
L1
L
b2
1
2
N
b
c
e
A2
e1
8QLWV
'LPHQVLRQ/LPLWV
1XPEHURI3LQV
,1&+(6
0,1
1
120
0$;
3LWFK
H
%6&
2YHUDOO3LQ3LWFK
H
%6&
2YHUDOO+HLJKW
$
±
7DE7KLFNQHVV
$
±
%DVHWR/HDG
$
±
2YHUDOO:LGWK
(
±
0RXQWLQJ+ROH&HQWHU
4
±
2YHUDOO/HQJWK
'
±
0ROGHG3DFNDJH/HQJWK
'
±
7DE/HQJWK
+
±
0RXQWLQJ+ROH'LDPHWHU
3
±
/HDG/HQJWK
/
±
/HDG6KRXOGHU
/
±
±
/HDG7KLFNQHVV
F
±
/HDG:LGWK
E
6KRXOGHU:LGWK
E
1RWHV
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
 2010 Microchip Technology Inc.
DS21375D-page 13
TC1264
NOTES:
DS21375D-page 14
 2010 Microchip Technology Inc.
TC1264
APPENDIX A:
REVISION HISTORY
Revision D (September 2010)
The following is the list of modifications:
1.
2.
Updated Figure 2-4.
Updated package drawings (C04-011B,
C04-2011A, C04-032B, C04-2032A,
C04-034B).
Revision C (October 2006)
The following is the list of modifications:
1.
2.
3.
Section 1.0 “Electrical Characteristics”:
Changed dropout voltage typical value for IL =
500 mA from 700 to 1000 and maximum value
from 1000 to 1200 for. Changed typical value for
IL = 800 mA from 890 to 1200.
Section 6.0 “PackAging Information”: Added
package marking information and package
outline drawings.
Added disclaimer to package outline drawings.
Revision B (May 2002)
• Undocumented Changes.
Revision A (March 2002)
• Original Release of this Document.
 2010 Microchip Technology Inc.
DS21375D-page 15
TC1264
NOTES:
DS21375D-page 16
 2010 Microchip Technology Inc.
TC1264
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X.XX
XX
XX
Device
Voltage
Option
Package
Tape and
Reel
Device
TC1264 Fixed Output CMOS LDO
Voltage Option:*
1.8V
2.5V
3.0V
3.3V
Examples:
a)
b)
c)
d)
TC1264-1.8VAB
TC1264-2.5VAB
TC1264-3.0VAB
TC1264-3.3VAB
a)
TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg.,
Tape and Reel
TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg.,
Tape and Reel
b)
=
=
=
=
1.8V
2.5V
3.0V
3.3V
* Other output voltages are available. Please contact your local
Microchip sales office for details.
Package
AB
=
DB
=
DBTR =
EB
=
EBTR =
Plastic (TO-220), 3-Lead
Plastic (SOT-223), 3-lead
Plastic (SOT-223), 3-lead,
Tape and Reel
Plastic Transistor Outline (DDPAK), 3-Lead
Plastic Transistor Outline (DDPAK), 3-Lead,
Tape and Reel
c)
d)
a)
b)
c)
d)
e)
f)
g)
h)
 2010 Microchip Technology Inc.
1.8V LDO, TO-220-3 pkg.
2.5V LDO, TO-220-3 pkg.
3.0V LDO, TO-220-3 pkg.
3.3V LDO, TO-220-3 pkg.
TC1264-1.8VDB
1.8V LDO, SOT-223 pkg.
TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-2.5VDB
2.5V LDO, SOT-223 pkg.
TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-3.0VDB
3.0V LDO, SOT-223 pkg.
TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg.,
Tape and Reel
TC1264-3.3VDB
3.3V LDO, SOT-223 pkg.
TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg.,
Tape and Reel
DS21375D-page 17
TC1264
NOTES:
DS21375D-page 18
 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-564-0
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2010 Microchip Technology Inc.
DS21375D-page 19
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
08/04/10
DS21375D-page 20
 2010 Microchip Technology Inc.