MX69GL642E/640E-I Industrial Temperature, 3 Volt, MCP Products Parallel NOR Flash + Pseudo Static RAM (pSRAM) 64Mb Page Mode Flash Memory (4M x 16Bit) and 32Mb pSRAM (2M x 16Bit) MX69GL642E (Top Boot), MX69GL640E (Uniform Sector), P/N:PM1700 REV. 1.4, NOV. 27, 2015 1 MX69GL642E/640E-I 1. MCP FEATURES • Supply Voltage of 2.7 to 3.6 Voltage - 7x9x1.2mm 56 Ball FBGA • Speed • Operating Temperature Range - Flash: - Industrial, -40°C to +85°C - 64Mb: 70ns - pSRAM: 70ns • Package Flash Memory General Features • • • • • • • • • Sector architecture - MX69GL642E Top Boot:127 x 32Kword(64KB) + 8 x 4Kword(8KB) boot sector - MX69GL640E Uniform Sector:128 x 32Kword(64KB) 16-byte/8-word page read buffer 32-byte/16-word write buffer Extra 128-word sector for security - Features factory locked and identifiable, and customer lockable Advanced sector protection function (Solid and Password Protect) Latch-up protected to 100mA from -1V to 1.5xVcc Low Vcc write inhibit : Vcc ≤ VLKO Compatible with JEDEC standard - Pinout and software compatible to single power supply Flash Deep power down mode - Deep power down current(max): 10uA (except MX69GL642EEXGI-70G/MX69GL640EEXGI-70G) Pseudo SRAM General Features • • • • • • • Organization: 2M x 16 Power Supply Voltage: 2.7~3.6V Separated I/O power(VccQ) & Core power(Vcc) Three state outputs Byte read/write control by UB#/LB# Auto-TCSR for power saving 8 page mode & DPD 2. Product Description The MX69GL642E/640E-I product series combine MX29GL640E NOR Flash Memory with pSRAM in a MultiChip package. For detailed specifications, please refer to the individual datasheet for MX29GL640E flash and pSRAM. P/N:PM1700 REV. 1.4, NOV. 27, 2015 2 MX69GL642E/640E-I 3. Ordering Information Device MX69GL642EJXGI-70G MX69GL642EEXGI-70G MX69GL640EEXGI-70G Flash Density 64Mb (Top) 64Mb(Top) 64Mb (Uniform Sector) Flash Access Time 70 70 32Mb 32Mb pSRAM Access Time 70 70 32Mb 70 pSRAM Density 70 P/N:PM1700 Package type Industrial Grade 7x9 56FBGA 7x9 56FBGA V V 7x9 56FBGA V REV. 1.4, NOV. 27, 2015 3 MX69GL642E/640E-I 4. BLOCK DIAGRAM VCCf VCC CE1#f WP#/ACC RESET# Flash-only Address Flash Shared Address OE# WE# VSS RY/BY# Q 15 to Q 0 VCCS VCC pSRAM IO15-IO0 CE1#s CE# UB# UB# LB# LB# CE2s ZZ# P/N:PM1700 REV. 1.4, NOV. 27, 2015 4 MX69GL642E/640E-I 5. PIN CONFIGURATIONS 56-ball Fine-Pitch Ball Grid Array (Top view through package) 1 2 3 4 5 6 7 8 A7 LB# WP/ACC WE# A8 A11 A3 A6 UB# RST#f CE2s A19 A12 A15 A2 A5 A18 RY/BY# A20 A9 A13 A21 A1 A4 A17 A10 A14 RFU A0 VSS DQ1 DQ6 RFU A16 CE1#f OE# DQ9 DQ3 DQ4 DQ13 DQ15 RFU CE1#s DQ0 DQ10 VCCf VCCs DQ12 DQ7 VSS DQ8 DQ2 DQ11 RFU DQ5 DQ14 A B C D E F G H Flash only pSRAM only Reserved for Future Use Notes: 1. The addess shared by MCP combination as show in the table below: MCP MX69GL642EA MX69GL642EJ MX69GL640EA MX69GL640EJ MX69GL642EE MX69GL640EE Flash-only Addresses Shared Addresses A21 A20~A0 P/N:PM1700 REV. 1.4, NOV. 27, 2015 5 MX69GL642E/640E-I PIN DESCRIPTION SYMBOL A21~A0 Q15~Q0 CE1#f CE1#s CE2s OE# WE# RY/BY# UB# LB# RESET# WP#/ACC Vccf VCCS VSS NC DESCRIPTION 22 Address Inputs for Flash 64Mb (A20~A0 are shared with pSRAM) 16 Data Inputs/Outputs (Common) Chip Enable Input 1 (Flash) Chip Enable Input 1 (pSRAM) Chip Enable Input 2 (pSRAM) Output Enable Input (Common) Write Enable Input (Common) Ready/Busy Output (Flash 1) Upper Byte Control (pSRAM) Lower Byte Control (pSRAM) Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) Flash 3.0 volt-only single power supply pSRAM Power Supply Device Ground (Common) Pin Not Connected Internally P/N:PM1700 REV. 1.4, NOV. 27, 2015 6 MX69GL642E/640E-I 6. PART NAME DESCRIPTION MX 69GL 642 E A XG I 70 G OPTION: G: RoHS Compliant SPEED: 70: 70ns TEMPERATURE RANGE: I: Industrial (-40°C to +85°C) PACKAGE: XG: FBGA with 0.4Ball Size, 0.8Ball-Pitch, 1.2mm Total Height pSRAM A: pSRAM Vendor 1 J: pSRAM Vendor 2 E: pSRAM Vendor 3 Generation E Flash DENSITY & MODE: 642: 64Mb, top boot, MCP package: 7x9mm, 56Ball-FBGA 640: 64Mb, uniform sector, MCP package: 7x9mm, 56Ball-FBGA DEVICE: 69GL: Multi-Chip Package 3.0Volt Page Mode Flash Memory and pSRAM P/N:PM1700 REV. 1.4, NOV. 27, 2015 7 MX69GL642E/640E-I 7. PACKAGE INFORMATION 56 Ball-FBGA P/N:PM1700 REV. 1.4, NOV. 27, 2015 8 MX69GL642E/640E-I 8. REVISION HISTORY Revision No.Description 0.00 1. Initial released 1.0 1. Removed Advanced Information state 1.1 1. Removed MX69GL638EAXGI-70G/MX69GL638EJXGI-70G 2. Added MX69GL640EEXGI-70G/MX69GL642EEXGI-70G 1.2 1. Removed Advanced Information state for MX69GL642EEXGI-70G Page Date AllAPR/11/2011 P2APR/19/2011 All SEP/17/2014 All P3 JAN/09/2015 1.3 1. Removed Advanced Information "*" for MX69GL640EEXGI-70G P3 OCT/29/2015 1.4 1. Removed the following three part numbers: MX69GL642EAXGI-70G MX69GL640EAXGI-70G MX69GL640EJXGI-70G P3 NOV/27/2015 P/N:PM1700 REV. 1.4, NOV. 27, 2015 9 MX69GL642E/640E-I Except for customized products which has been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. 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