pSRAM - Macronix

MX69GL642E/640E-I
Industrial Temperature, 3 Volt, MCP Products Parallel NOR Flash + Pseudo Static RAM (pSRAM)
64Mb Page Mode Flash Memory (4M x 16Bit) and 32Mb pSRAM (2M x 16Bit)
MX69GL642E (Top Boot), MX69GL640E (Uniform Sector),
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
1. MCP FEATURES
• Supply Voltage of 2.7 to 3.6 Voltage
- 7x9x1.2mm 56 Ball FBGA
• Speed
• Operating Temperature Range
- Flash:
- Industrial, -40°C to +85°C
- 64Mb: 70ns
- pSRAM: 70ns
• Package
Flash Memory General Features
•
•
•
•
•
•
•
•
•
Sector architecture
- MX69GL642E Top Boot:127 x 32Kword(64KB) + 8 x 4Kword(8KB) boot sector
- MX69GL640E Uniform Sector:128 x 32Kword(64KB)
16-byte/8-word page read buffer
32-byte/16-word write buffer
Extra 128-word sector for security
- Features factory locked and identifiable, and customer lockable
Advanced sector protection function (Solid and Password Protect)
Latch-up protected to 100mA from -1V to 1.5xVcc
Low Vcc write inhibit : Vcc ≤ VLKO
Compatible with JEDEC standard
- Pinout and software compatible to single power supply Flash
Deep power down mode
- Deep power down current(max): 10uA (except MX69GL642EEXGI-70G/MX69GL640EEXGI-70G)
Pseudo SRAM General Features
•
•
•
•
•
•
•
Organization: 2M x 16
Power Supply Voltage: 2.7~3.6V
Separated I/O power(VccQ) & Core power(Vcc)
Three state outputs
Byte read/write control by UB#/LB#
Auto-TCSR for power saving
8 page mode & DPD
2. Product Description
The MX69GL642E/640E-I product series combine MX29GL640E NOR Flash Memory with pSRAM in a MultiChip package. For detailed specifications, please refer to the individual datasheet for MX29GL640E flash and
pSRAM.
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
3. Ordering Information
Device
MX69GL642EAXGI-70G
MX69GL642EJXGI-70G
MX69GL640EAXGI-70G
MX69GL640EJXGI-70G
MX69GL642EEXGI-70G
MX69GL640EEXGI-70G*
Flash Density
64Mb (Top)
64Mb (Top)
64Mb
(Uniform Sector)
64Mb
(Uniform Sector)
64Mb(Top)
64Mb
(Uniform Sector)
Flash
Access
Time
70
70
32Mb
32Mb
pSRAM
Access
Time
70
70
70
32Mb
70
7x9 56FBGA
V
70
32Mb
70
7x9 56FBGA
V
70
32Mb
70
7x9 56FBGA
V
70
32Mb
70
7x9 56FBGA
V
pSRAM
Density
Package type
Industrial
Grade
7x9 56FBGA
7x9 56FBGA
V
V
* Advanced Information.
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
4. BLOCK DIAGRAM
VCCf
VCC
CE1#f
WP#/ACC
RESET#
Flash-only Address
Flash
Shared Address
OE#
WE#
VSS
RY/BY#
Q 15 to Q 0
VCCS
VCC
pSRAM
IO15-IO0
CE1#s
CE#
UB#
UB#
LB#
LB#
CE2s
ZZ#
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
5. PIN CONFIGURATIONS
56-ball Fine-Pitch Ball Grid Array
(Top view through package)
1
2
3
4
5
6
7
8
A7
LB#
WP/ACC
WE#
A8
A11
A3
A6
UB#
RST#f
CE2s
A19
A12
A15
A2
A5
A18
RY/BY#
A20
A9
A13
A21
A1
A4
A17
A10
A14
RFU
A0
VSS
DQ1
DQ6
RFU
A16
CE1#f
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
RFU
CE1#s
DQ0
DQ10
VCCf
VCCs
DQ12
DQ7
VSS
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
A
B
C
D
E
F
G
H
Flash only
pSRAM only
Reserved for
Future Use
Notes:
1. The addess shared by MCP combination as show in the table below:
MCP
MX69GL642EA
MX69GL642EJ
MX69GL640EA
MX69GL640EJ
MX69GL642EE
MX69GL640EE
Flash-only
Addresses
Shared
Addresses
A21
A20~A0
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
PIN DESCRIPTION
SYMBOL
A21~A0
Q15~Q0
CE1#f
CE1#s
CE2s
OE#
WE#
RY/BY#
UB#
LB#
RESET#
WP#/ACC
Vccf
VCCS
VSS
NC
DESCRIPTION
22 Address Inputs for Flash 64Mb (A20~A0 are shared with pSRAM)
16 Data Inputs/Outputs (Common)
Chip Enable Input 1 (Flash)
Chip Enable Input 1 (pSRAM)
Chip Enable Input 2 (pSRAM)
Output Enable Input (Common)
Write Enable Input (Common)
Ready/Busy Output (Flash 1)
Upper Byte Control (pSRAM)
Lower Byte Control (pSRAM)
Hardware Reset Pin, Active Low (Flash)
Hardware Write Protect/Acceleration Pin (Flash)
Flash 3.0 volt-only single power supply
pSRAM Power Supply
Device Ground (Common)
Pin Not Connected Internally
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
6. PART NAME DESCRIPTION
MX 69GL 642 E
A XG I
70 G
OPTION:
G: RoHS Compliant
SPEED:
70: 70ns
TEMPERATURE RANGE:
I: Industrial (-40°C to +85°C)
PACKAGE:
XG: FBGA with 0.4Ball Size, 0.8Ball-Pitch, 1.2mm Total Height
pSRAM
A: pSRAM Vendor 1
J: pSRAM Vendor 2
E: pSRAM Vendor 3
Generation
E
Flash DENSITY & MODE:
642: 64Mb, top boot, MCP package: 7x9mm, 56Ball-FBGA
640: 64Mb, uniform sector, MCP package: 7x9mm, 56Ball-FBGA
DEVICE:
69GL: Multi-Chip Package
3.0Volt Page Mode Flash Memory and pSRAM
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
7. PACKAGE INFORMATION
56 Ball-FBGA
P/N:PM1700
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
8. REVISION HISTORY
Revision No.Description
0.00
1. Initial released 1.0
1. Removed Advanced Information state 1.1
1. Removed MX69GL638EAXGI-70G/MX69GL638EJXGI-70G
2. Added MX69GL640EEXGI-70G/MX69GL642EEXGI-70G
1.2
1. Removed Advanced Information state for MX69GL642EEXGI-70G
P/N:PM1700
Page
All
P2
All
All
P3
Date
APR/11/2011
APR/19/2011
SEP/17/2014
JAN/09/2015
REV. 1.2, JAN. 09, 2015
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MX69GL642E/640E-I
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