High Reliability Radiation Hardened Semiconductors • Rectifiers & Diodes • BiPolar Transistors • Power MOSFETs HiREL Product Guide Contents Page Introduction 3 MIL-PRF-19500 Radiation Test Requirements 4 • • • • Total Ionizing Dose (TID) or Gamma Irradiation Enhanced Low Dose Rate Sensitivity (ELDRS) Neutron Irradiation Single Event Effects (SEE) High Reliability Radiation H Hardened arde ar den ne ed R Re Rectifier ec cttiifi fie err & D Diode i de P io Products r du ro duct cts s • • • • 5 Rectifiers Zeners and Transient Voltage ge Suppressors ge Sup ppr pressso orrs s (TVS) ((TV T S)) TV Schottky Rectifiers Temperature Compensated d Zeners Zen Ze ne ers rs (TCZ (TC TCZ Z High Reliability Radiation H Hardened arrde d ne ned d Bi B Bipolar ipo pola ar Tr T Transistors ansi an ns siist sto ors or 6-7 6--7 • Product Listing • Total Dose Irradiation Effects cts s on on Bipolar B po Bi p la ar Transistors T an Tr a si s st s or os High Reliability Radiation H Hardened arde ar dene ned d Po Powe Power werr MO MOSF MOSFETs FET Ts 8-9 8--9 8 • Product Listing • Single Event Capability High Reliability Radiation H Hardened arde ar d ne ned d Se Semi Semiconductor m co cond nd ducto ucto uc tor or Ch C Chip Chips hip ps Blank Note Pages 10 10 11-14 11 1 1-1 - 4 15 Updates/Inserts Pocket 15 Contents Tools for Learning About M Microsemi’s High Reliability Products icro ic rose s mi mi’s ’s H Hig igh h Re Reli liab abil ilit ity y Pr Prod od du uc cts ts 2 Leader in Radiation Hardened Products Microsemi Corporation (MSCC) is the world’s leading supplier of High Reliability Discrete Semiconductors. Microsemi was the first diode manufacturer selected by the U.S. military services as a source of supply to qualify product to the highest specified reliability level—JANS. Our heritage in supplying space compliant semiconductor products in accordance with MIL-PRF-19500 extends over 30 years. Microsemi has expanded its space product offering to include a wide variety of hermetic diodes, transistors, and MOSFETs. Microsemi has been involved in numerous military and commercial space programs involving radiation hardened product specifications with stringent performance requirements. This now includes the largest selection of JANS qualified products in the world; a portfolio that has become predominant in satellite and launch vehicle programs. With recent design trends, the ability to assemble in a variety of packaging styles has become essential. This includes surface mount packaging options for virtually any product, as well as chips for hybrid use. • • • • • • Diodes Power Mosfets Rectifiers Schottkys Transistors Zeners Key Application Specific Products • Thermally activated battery bypass switches for satellites • Solar cell bypass diodes for bypassing faulty solar cells • Zero temperature coefficient radiation hardened compensated zener diodes Custom Products • Complete solutions from die selection and screening through module assembly • Custom test, environmental and screening capabilities • Full range of Total Dose, ELDRs and Single Event Effects (SEE) characterizations available Overview 3 Radiation Services MIL-PRF-19500 is the General Performance Specification for Semiconductor Devices. This specification is maintained by the Defense Logistics Agency (DLA) to provide the supplier requirements for manufacturing high reliability semiconductors. MIL-PRF-19500, along with the detailed part requirements found in related slashsheets, and MIL-STD-750 (“Test Methods for Semiconductor Devices” published by the United States Department of Defense) combine to fully specify the scope of Radiation test requirements for discrete semiconductor part types. The following is a brief description of the key radiation tests detailed in these documents. Radiation Tests Services Available Microsemi is capable of performing all the methods listed below and offers these test services to our customers. Please contact Microsemi Sales for a review of your unique radiation test requirements. RHA Prefix Total Ionizing Dose Level M D P L R F G H 3K RADS 10K RADS 30K RADS 50K RADS 100K RADS 300K RADS 500K RADS 1000K RADS Example: JANSR2N2222A (100K RADS) JANSF2N7261 (300K RADS) Total Ionizing Dose (TID) or Gamma Irradiation Per Mil-Std-750 Method 1019 Dose rate 50-200RAD(Si)/s nominal 100RAD(Si)/s Typically 3kRAD(Si) to 1MRAD(Si) or 300Gy(Si) to 10000Gy(Si) Note Gy = Gray where 100RAD = Gray ELDRS (Enhanced Low Dose Rate Sensitivity) Reference Mil-Std-833 Method 1019 Dose rate either 0.01RAD(Si)/s to 0.020RAD(Si)/s Typically 10kRAD(Si) which takes 7 days at 0.020RAD(Si)/s Radiation Services Neutron Irradiation (Fast Neutrons) Per Mil-Std-750 Method 1017 Typically 1E12 n/cm2 to 1E15n/cm2 Large 12 x 12 x 12 inch Target Chamber (can test small systems) Single Event Effects (SEE) with Heavy Ions Per Mil-Std-750 Method 1080 Single Event Gate Response (SEGR) Single Event Burnout (SEB) K500 Cyclotron with a wide variety of LETs and Ranges Radiation Services Available Microsemi is capable of performing all of the radiation test methods listed above and offers these test services to our customers. Please contact the Microsemi Sales department for review of your unique radiation test requirements. 7 4 High Reliability Radiation Hardened Rectifier & Diode Products Most Microsemi Space-level rectifier and diode products are inherently radiation hardened. This fact has been understood by our major customers for many years. As a result, our heritage of usage in space programs is unsurpassed in the industry. Due to the inherent capability of rectifiers and diodes, MIL-PRF-19500 in general does not specify radiation hardness levels for this product family (some exceptions do exist). Microsemi’s portfolio of JANS qualified rectifiers and diodes is far too extensive to list in this shortfom catalog. The following provides a broad overview of the radiation hardened performance of our core space level diode families. For specific performance information, please visit our website at www.microsemi.com or Microsemi Sales. Rectifiers are naturally radiation hard up to 106 or 107 RAD(Si) and 1014 n/cm2. This depends heavily on breakdown voltage (VBR), lifetime (switching speed), etc. with forward voltage (VF) and reverse leakage current (IR) being the affected parameters. The “fast” and “ultrafast” recovery rectifiers (FRR and UFR) will have much less effect from high radiation. Zeners and Transient Voltage Suppressors (TVS) are naturally very radiation hard as they employ majority carrier avalanche breakdown. These easily perform up to 107 RAD(Si) and 1014 n/cm2 for products up to 200 volts. Below 100 volts, they exceed 108 RAD(Si) and 1015 n/cm2. Schottky Rectifiers also operate on a majority carrier principle with natural radiationhard performance and are comparable to zeners less than 100 volts described above. Typically, reverse leakage current (IR) is affected although not enough to affect performance. Exposure of 106 RAD(Si) is considered acceptable as well as 1013 n/cm2 or higher. Temperature Compensated Zeners (TCZ) are manufactured with process to improve stability and this process makes these parts naturally radiation hard. These reference diodes are capable of performance up to 106 RAD and 1014 n/cm2. Rectifiers & Diodes 5 High Reliability Radiation Hardened Bipolar Transistors Part Number V(BR) CEO IC Max TID MIL-PRFRating 19500 SMD-0.5 (Surface Mount) NPN Power JANSF2N5152U3 JANSF2N5154U3 80V 80V 10.0A 300K RAD 10.0A 300K RAD /544 /544 PNP Power JANSF2N5151U3 JANSF2N5153U3 80V 80V 10.0A 300K RAD 10.0A 300K RAD /545 /545 TO-18 Part Number NPN Silicon Switcher JANSH2N2221A 50V JANSH2N2221AL 50V JANSH2N2222A 50V JANSH2N2222AL 50V JANSF2N2369A 15V JANSR2N3700 80V JANSF2N4449 15V PNP Silicon Switcher JANSR2N2906A JANSR2N2906AL JANSR2N2907A JANSR2N2907AL 60V 60V 60V 60V 0.8A 0.8A 0.8A 0.8A 0.1A 1.0A 0.1A 1 MEG RAD 1 MEG RAD 1 MEG RAD 1 MEG RAD 300K RAD 100K RAD 300K RAD /255 /255 /255 /255 /317 /391 /317 0.6A 0.6A 0.6A 0.6A 100K RAD 100K RAD 100K RAD 100K RAD /291 /291 /291 /291 TO-39 NPN Silicon Switcher JANSR2N2218 30V JANSR2N2218A 50V JANSR2N2219 30V JANSR2N2219A 50V JANSR2N3019S 80V JANSR2N3439L 350V JANSR2N3440L 250V JANSR2N3498 100V JANSR2N3499 100V JANSR2N3500 150V JANSR2N3501 150V 0.8A 0.8A 0.8A 0.8A 1.0A 1.0A 1.0A 0.3A 0.3A 0.3A 0.3A 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD /251 /251 /251 /251 /391 /368 /368 /366 /366 /366 /366 V(BR) CEO IC Max TID MIL-PRFRating 19500 TO-5 NPN Silicon Switcher JANSR2N2218AL 50V JANSR2N2219AL 50V JANSR2N3019 80V JANSR2N3439 350V JANSR2N3440 250V JANSR2N3498L 100V JANSR2N3499L 100V JANSR2N3500L 150V JANSR2N3501L 150V 0.8A 0.8A 1.0A 1.0A 1.0A 0.3A 0.3A 0.3A 0.3A 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD /251 /251 /391 /368 /368 /366 /366 /366 /366 PNP Silicon Switcher JANSR2N3634L 140V JANSR2N3635L 140V JANSR2N3636L 175V JANSR2N3637L 175V 1.0A 1.0A 1.0A 1.0A 100K RAD 100K RAD 100K RAD 100K RAD /357 /357 /357 /357 NPN Power JANSF2N5152L JANSF2N5154L 80V 80V 10.0A 300K RAD 10.0A 300K RAD /544 /544 PNP Power JANSF2N5151L JANSF2N5153L 80V 80V 10.0A 300K RAD 10.0A 300K RAD /545 /545 80V 80V 10.0A 300K RAD 10.0A 300K RAD /534 /534 60V 60V 60V 60V 0.1A 0.1A 0.1A 0.1A /336 /336 /336 /336 TO-59 Bipolar PNP Silicon Switcher JANSR2N3634 140V JANSR2N3635 140V JANSR2N3636 175V JANSR2N3637 175V 1.0A 1.0A 1.0A 1.0A 100K RAD 100K RAD 100K RAD 100K RAD /357 /357 /357 /357 NPN Power JANSF2N5152 JANSF2N5154 80V 80V 10.0A 300K RAD 10.0A 300K RAD /544 /544 PNP Power JANSF2N5151 JANSF2N5153 80V 80V 10.0A 300K RAD 10.0A 300K RAD /545 /545 NPN Power JANSF2N5002 JANSF2N5004 TO-78 PNP DUAL JANSF2N3810 JANSF2N3810L JANSF2N3811 JANSF2N3811L 300K RAD 300K RAD 300K RAD 300K RAD Products are listed with the highest qualified radiation hardness assurance designation as described on Page 4 of this brochure. 6 Part Number V(BR) CEO IC Max TID Rating MIL-PRF19500 3 Pin LCC (Surface Mount) NPN Silicon Switcher JANSH2N2221AUB JANSH2N2221AUBC JANSH2N2222AUB JANSH2N22222AUBC JANSF2N2369AUB JANSF2N2369AUBC JANSR2N3501UB JANSR2N3700UB 50V 50V 50V 50V 15V 15V 150V 80V 0.8A 0.8A 0.8A 0.8A 0.1A 0.1A 0.3A 1.0A 1 MEG RAD 1 MEG RAD 1 MEG RAD 1 MEG RAD 300K RAD 300K RAD 100K RAD 100K RAD /255 /255 /255 /255 /317 /317 /366 /391 PNP Silicon Switcher JANSR2N2906AUB JANSR2N2906AUBC JANSR2N2907AUB JANSR2N2907AUBC JANSR2N3634UB JANSR2N3635UB JANSR2N3636UB JANSR2N3637UB 60V 60V 60V 60V 140V 140V 175V 175V 0.6A 0.6A 0.6A 0.6A 1.0A 1.0A 1.0A 1.0A 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD 100K RAD /291 /291 /291 /291 /357 /357 /357 /357 4 Pin LCC (Surface Mount) NPN Silicon Switcher JANSH2N2221AUA JANSH2N22222AUA JANSF2N2369AUA JANSR2N3439UA JANSR2N3440UA 50V 50V 15V 350V 250V PNP Silicon Switcher JANSR2N2906AUA 60V JANSR2N2907AUA 60V 0.8A 0.8A 0.1A 1.0A 1.0A 1 MEG RAD 1 MEG RAD 300K RAD 100K RAD 100K RAD /255 /255 /317 /368 /368 0.6A 100K RAD 0.6A 100K RAD /291 /291 6 Pin LCC (Surface Mount) NPN Silicon Switcher JANSF2N2369AU 15V JANSF2N3810U 60V 0.1A 300K RAD 0.1A 300K RAD /317 /336 PNP DUAL JANSF2N3811U 0.1A 300K RAD /336 60V Ionizing radiation damage in semiconductor devices is mainly the result of charges trapped on or near the surfaces of their insulating layers and interfaces. In bipolar devices, a trapped charge at their surface layers produce inversion layers that expand the effective surface area, hence, modifying the surface potential at the Si-SiO2 interfaces. This means that there will be a reduction in the minority carrier life-time and hence a corresponding decrease in the DC current gain (hFE) of the DUT. Therefore, bipolar transistors require special calculations to report their post-irradiation performance: (a) Delta (1/hFE): Let hFE1 be the measured hFE at a specific test point (Vce, Ic) prior to irradiation. Let hFE2 be the measured hFE post-irradiation at that same test point. Then: Delta (1/hFE) = ∆(1/hFE) = 1/hFE2 – 1/hFE1 and is unitless as is hFE. Example: hFE1 = 200 before irradiation and at post-irradiation testing it has decreased to hFE2 = 125.Then: ∆ (1/hFE) = 1/125 – 1/200 = 0.00300. (b) [hFE] calculation is not a directly measured value of hFE, but rather a calculated value used by system analysis engineers. It signifies exactly how well the bipolar transistor will perform in the system after exposure to a radiation fluence. This [hFE] is denoted in square brackets [ ] to delineate it from any measured value of hFE and uses the calculated value of Delta (1/hFE) but adds one additional term. Calculate as follows: Let hFE(min) be the pre-irradiation spec minimum hFE limit at the same test point in the Delta(1/hFE) calculation shown above. Then: [hFE] = inverse { ∆(1/hFE) + 1/hFE)min} TO-254AA NPN Power JANSF2N7373 Total Dose Irradiation Effects on Bipolar Transistors 80V 10.0A 300K RAD /613 Then: [hFE] = inverse { 0.00300 + 1/100 } = inverse { 0.003 + 0.01 } = 1 / { 0.013} = 76.92. TO-46 NPN Silicon Switcher JANSR2N3057A 80V Example: hFE(min) = 100 and, in accordance with the above expample, ∆(1/hFE) = 0.00300. 1.0A 100K RAD /391 Note that [hFE] can never exceed hFE (min). Products are listed with the highest qualified radiation hardness assurance designation as described on Page 4 of this brochure. 7 Bipolar (c) When ∆(1/hFE), [hFE] or both are required by the control specification, these calculations will only be required on the irradiation test samples. The test report shall then contain, in spreadsheet fashion, the appropriate pre and post hFE measurements as well as the required calculation results. Unless otherwise specified, all devices shall adhere to the specification maximum hFE limits that were imposed pre-irradiation. NEW TION IFICA QUAL High Reliability Radiation Hardened Power MOSFETs Microsemi has recently qualified its first generation of Radiation Hardened Power MOSFETs. The post irradiation test requirements for MOSFETs are clearly defined in the controlling MIL-PRF-19500 slashsheets. Typically, MOSFETs show movement in threshold voltage (Vth) after exposure to Total Ionizing Dose (TID) Irradiation. Following is a listing of our current MIL-PRF-19500 radiation hardened qualified devices. Check our website for the latest product offerings as we continue to expand this product portfolio. TO-205AF (TO-39) Part Number JANSR2N7389 JANSF2N7389 JANSR2N7261 JANSF2N7261 JANSR2N7262 JANSF2N7262 P P N N N N BVDSS MIN V -100 -100 100 100 200 200 VGS MAX V ±20 ±20 ±20 ±20 ±20 ±20 RDS(on) MAX mΩ 300 300 180 180 350 350 P P N N N N -100 -100 100 100 200 200 ±20 ±20 ±20 ±20 ±20 ±20 -100 -100 100 100 200 200 Channel MIL-PRF19500 Spec. W 25 25 25 25 25 25 MAX TID Rating (K RAD) 100 300 100 300 100 300 11.0 11.0 14.4 14.4 9.4 9.4 75 75 75 75 75 75 100 300 100 300 100 300 /615 /615 /614 /614 /614 /614 300 300 180 180 350 350 6.5 6.5 8.0 8.0 5.5 5.5 25 25 25 25 25 25 100 300 100 300 100 300 /630 /630 /601 /601 /601 /601 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 27 27 27 27 65 65 100 100 35 35 35 35 34.0 34.0 26.0 26.0 150 150 150 150 150 150 150 150 100 300 100 300 100 300 100 300 N/A N/A /603 /603 /603 /603 /603 /603 ±20 ±20 ±20 ±20 ±20 ±20 27 27 65 65 100 100 35 35 34 34 26 26 150 150 150 150 150 150 100 300 100 300 100 300 N/A /603 /603 /603 /603 /603 ID MAX PD MAX A 6.5 6.5 8.0 8.0 5.5 5.5 300 300 180 180 400 400 ±20 ±20 ±20 ±20 ±20 ±20 60 60 60 60 100 100 200 200 60 60 100 100 200 200 /630 /630 /601 /601 /601 /601 TO-257AA JANSR2N7382 JANSF2N7382 JANSR2N7380 JANSF2N7380 JANSR2N7381 JANSF2N7381 18-Pin LCC (Surface Mount) JANSR2N7389U JANSF2N7389U JANSR2N7261U JANSF2N7261U JANSR2N7262U JANSF2N7262U P P N N N N Power Powe Po werr MOSFETs MOSF MO SFET ETs s SMD-1 (TO-267AB Surface Mount) MSR2N7394U** MSF2N7394U** JANSR2N7394U* JANSF2N7394U* JANSR2N7268U JANSF2N7268U JANSR2N7269U JANSF2N7269U N N N N N N N N TO-254AA MSR2N7394** N JANSF2N7394* N JANSR2N7268 N JANSF2N7268 N JANSR2N7269 N JANSF2N7269 N * DLA qualification in progress ** Microsemi qualified part 48 Single Event Capability In addition to TID, Microsemi routinely performs Single Event Effects (SEE) testing using Heavy Ions. Microsemi MOSFETs are sample tested for Single Event Gate Rupture (SEGR) and Single Event Burnout (SEB). The following graphs summarize the SEE results obtained for each of the MOSFET groups. 100V N-channel: 2N7261, 2N7268, 2N7380 110 TAMU Ar LET=8.3 Range =192um Total Energy=531MeV 100 90 80 TAMU Kr LET=27.8 Range =134um Total Energy=1032MeV Drain Bias, V 70 60 50 TAMU Ag LET=42.2 Range =119um Total Energy=1289MeV 40 30 20 TAMU Au LET=85.4 Range =118um Total Energy=2247MeV 10 0 0 -5 -10 -15 Gate Bias, V -20 -25 200V N-channel: 2N7262, 2N7269, 2N7381 TAMU Ar LET=8.3 Range =192um Total Energy=531MeV 220 200 180 TAMU Kr LET=27.8 Range =134um Total Energy=1032MeV Drain Bias, V 160 140 120 100 TAMU Ag LET=42.2 Range =119um Total Energy=1289MeV 80 60 40 TAMU Au LET=85.4 Range =118um Total Energy=2247MeV 20 0 0 -5 -10 -15 Gate Bias, V -20 -25 -100V P-channel: 2N7382, 2N7389 -110 -100 -90 Drain Bias, V -70 -60 -50 -40 -30 -20 -10 0 0 5 10 Gate Bias, V 15 59 20 25 Power MOSFETs -80 TAMU Ar LET=8.3 Range =192um Total Energy=531MeV TAMU Kr LET=27.8 Range =134um Total Energy=1032MeV TAMU Ag LET=42.2 Range =119um Total Energy=1289MeV TAMU Au LET=85.4 Range =118um Total Energy=2247MeV High Reliability Radiation Hardened Semiconductor Chips Microsemi Corporation is a leader in the sale of semiconductor chips to the high reliability military and space community for hybrid circuit applications. We also regularly sell commercial chip and JANHC/JANKC equivalents to meet customer specific needs. Semiconductor Chips We are continuously adding to our qualified product listings. If you are unable to find the chip you are looking for, please contact our Sales Department for the latest updates. 10 Solar Flare NASA Solar Dynamics Observatory High Reliability, Radiation Hardened Semiconductors Microsemi has a team of specialists available to provide application support for you High Reliability requirements. Call for more information or visit our website. America Sales Direct Europe / Asia Sales Direct Microsemi Corporation 6 Lake Street Lawrence, MA 01841 Ph: 978-620-2600 Fax: 978-689-0803 Email: [email protected] Microsemi Corporation Gort Road Business Park Ennis, County Clare Ireland Ph: 353 65 684 044 Email: [email protected] www.microsemi.com © 2011 Microsemi Corporation. Specifications subject to change without notice. 9