SmartFusion®2 SoC FPGAs ARM® Cortex™- M3 | HS USB OTG | 10/100/1000 Ethernet | PCI Express Gen 2 | Up to 150K LEs CO LO A B C D CIN _BYP EN NC_SR CLK RST LUT4 OVFL UB ADD_S ] A[17:0 D EN RO D +/- X EN ] C[43:0 SL ] B[17:0 0 17 SHIFT >> 17 ASC SEL_C :0] SN-1[43 More Resources in Low Density Devices Lowest Power Proven Security Exceptional Reliability SN[43: SmartFusion2 SoC FPGAs SmartFusion2 FPGA Architecture Microsemi SmartFusion2 SoC FPGAs Offer More Resources in Low Density Devices With The Lowest Power, Proven Security and Exceptional Reliability These devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microsemi FPGAs are used by customers in in Communications, Industrial, Medical, Defense, and Aviation markets. SmartFusion2 SoC FPGAs offer 5K-150K LEs with a 166MHz ARM® Cortex™-M3 processor, including ETM and Instruction Cache with on-chip eSRAM & eNVM and a complete Microcontroller Subsystem with extensive peripherals including CAN, TSE, USB. • 16x 5Gbps SERDES, PCIe, XAUI / XGXS+ Native SERDES • Power as low as 7mW Standby, Typical • Up to 150K LEs, 5Mbit SRAM, 4Mbit eNVM • DPA Hardened, AES256, SHA256, On-Demand NVM Data • Integrated DSP processing blocks Communications Industrial Defense Integrity Check • Hard 667 mbps DDR2/3 controllers • SEU Protected/Tolerant Memories: eSRAMs, DDR Bridges Automotive SmartFusion2 Advantages More Resources in Low Density Devices • ARM Cortex-M3 with embedded flash • PCIe Gen2 support in 10K LE • Comprehensive microcontroller subsystem With Clear Advantages • Lowest Power • Reduce total power by ~20-40% • 70mW per 5G SERDES • Proven Security • Protection from overbuilding and cloning • Secure boot for FPGA & processors • Exceptional Reliability • SEU immune zero FIT flash FPGA configuration • Reliability safety critical and mission critical systems AES Advanced Encryption Standard AHB Advanced High-Performance Bus APB Advanced Peripheral Bus AXI Advanced eXtensible Interface COMM_BLK DDR Double Data Rate DPA Differential Power Analysis ECC Elliptical Curve Cryptography EDAC ETM FDDR MMUART DDR2/3 Controller in MSS Multi-Mode UART MPU Memory Protection Unit MSS Microcontroller Subsystem SECDED Single Error Correct Double Error Detect SEU Single Event Upset SHA Secure Hashing Algorithm SMC_FIC Soft Memory Controller Error Detection And Correction TSE Triple Speed Ethernet (10/100/1000 Mbps) Embedded Trace Macrocell ULPI UTMI + Low Pin Interface DDR2/3 controller in FPGA fabric UTMI USB 2.0 Transceiver Macrocell Interface FIC Fabric Interface Controller WDT Watchdog Timer FIIC Fabric Interface Interrupt Controller XAUI 10 Gbps Attachment Unit Interface High Speed USB (2.0) On-The-Go XGMII 10 Gigabit Media Independent Interface In-Application Programming XGXS XGMII Extended Sublayer HS USB OTG IAP MACC 1 Communication Block MDDR Multiply-Accumulate 2 General Purpose Applications General Purpose Applications PCIe 1G Control Plane Board Initialization • PCIe Gen2 in 10K LE devices with I/O Expansion • PMBus, Instant-on, MSS peripherals GigaBit Ethernet PHY RJ45 / SFP 10/100 Ethernet PHY PCIe SPI SERDES SPI SPI Flash I2C GPIO SGMII PoE PD69208 SGMII Host Processor Peripherals ARM® Cortex™- M3 Processor O O O DDR3 DRAM SGMII I2C Controller LCD FPGA Fabric CPU SmartFusion2 SoC FPGA MCU RJ45 / SFP Ethernet PHY System Control SGMII PoE PD69208 RJ45 / SFP Multi-Axis Motor Control • Deterministic and Secure Multi-axis/High RPM Solutions • Motor Control IP & Development Kit Ethernet PHY eSPI 5V PoL Supply e SPI Controller PMBus Ethernet Switch Flash, SRAM To PoE Managers I2C USB Security DDR3 DRAM Ethernet PHY PMBus Interface 3.3V PoL Supply 2.5V PoL Supply SmartFusion2 SoC FPGA 1.5V PoL Supply SGMII Clock Management PoE PD69208 To Status LEDs Secure Connectivity – Gaming • Security, Anti-Tamper, Ethernet MAC Low Power Timing SmartFusion2 SoC FPGA Automation Controller/ Host CPU System Control Host Interface eNVM, eSRAM Power Supply/ Conversion PWM Timing Power Management Battery Monitor Battery Inverter Bridge, IGBTs, SiC MOSFETS Anti-Tamper Monitor Anti-Tampering Sensors PID Control Loop Sensors: Speed, Torque, Position A/D Conversion Transforms SmartFusion2 SoC FPGA PCIe Interface DDR Memory I/O Expander Status LEDs, Serial IO, ZL30722 Diagnostics Port System Diagnostics Ethernet MAC HMI Interface IEEE 1588 Slave / Client Host Processor Memory Controller System Monitoring Ethernet PHY PCIe Speaker, Key Pad, Joy Stick • IEEE 1588 IP & Small Form Factor, M3, Low Power Audio Processing, Storage and Retrieval SmartFusion2 SoC FPGA SPI Flash 1588 PTP OC IP • I2S to SPI bridge allows multiple audio recordings & playbacks Algorithm Time and Synch IP DDR3 Transport Layer Protocols VSC8572 PHY Time Stamp Unit Time Stamp Unit ARM® Cortex™- M3 Processor SmartFusion2 SoC FPGA SPI ZL30722 SPI Interface IEEE 1588 PLL Clock Out PPS Out Timberwolf ZL38051 Audio Processor I2S Interface Conversion, buffering & Formatter SPI Interface SPI Flash Host Interface SynchE PLL 3 2 Digital MEMS Microphones Oscillator Audio Jack 4 Clear Advantages SmartFusion2 Design Resources Lowest Power Microsemi’s Libero System-on-Chip (SoC) is a comprehensive software toolset for designing with Microsemi SmartFusion2 SoC FPGAs. Libero SoC manages the entire design flow from design entry, synthesis and simulation, through place-and-route, timing and power analysis, with enhanced integration of the embedded design flow. SmartFusion2 Reduces Total Power • Flash FPGAs Deliver Lowest Power Without Sacrificing Performance • 70mW per 5G SERDES • Flash*Freeze Ultra Low Power Mode 12mW System Builder makes it easy to configure various subsystems and generate required Application Programming Interface (API) that implements a correct-by-construction infrastructure for your application. SmartDebug provides probe capability to debug logic elements. http://www.microsemi.com/products/fpga-soc/design-resources/design-software/libero-soc#downloads System Builder Wizard Proven Security Protect Systems From Over-Building and Cloning • HSMs Protect From Overbuilding • DPA Countermeasures Protect Bitstream From Cloning • Only FPGA Vendor With Validated DPA Countermeasures • Secure Boot for FPGAs & Processors Software IDE SoftConsole Keil MDK IAR Embedded Workbench® Free Versions from Microsemi Free with Libero SoC 32 K Code Limited 32 K Code Limited Available from Vendor N/A Full version Full Version Compiler GNU GCC RealView® C/C++ IAR ARM Compiler Debugger GDB Debug µVision Debugger C-SPY® Debugger Instruction Set Simulator No µVision Simulator Yes Debug Hardware FlashPro4 ULINK 2 or ULINK-ME J-LINK or J-LINK Lite Trace Capability No ULINKpro JTAGjet-Trace The following logo is a trademark of Cryptography Research, Inc. used under license Exceptional Reliability • Error Free SEU immune fabric configuration • No Scrubbing required • All SoC Memory SEU Protected • Built-in error detection and correction • SEU tolerant implementation • Devices deployed in safety critical and mission critical systems SRAM Configuration Failures Alpha / Neutron particles strike routing matrix ® ™ Intellectual Property Microsemi enhances your design productivity by providing an extensive suite of proven and optimized IP Cores for use with Microsemi FPGAs. Our extensive suite of IP Cores covers all key markets and applications. Our Cores are organized as either Microsemi developed DirectCores or third party developed CompanionCores. Most DirectCores are available for free within our Libero tool suite and include common communications interfaces, peripherals and processing elements. http://www.microsemi.com/products/fpga-soc/design-resources/ip-cores Flash FPGA No Error 5 SRAM FPGA Functional Failure Functionality DirectCore Examples Functionality CompanionCores Examples Connectivity UART,16550, 429, PCI, JESD204B Connectivity CAN, CANFD, PCIE, VME DSP CIC,FFT,FIR,CORDIC, RS DSP FFT, JPEG, RS, DVBMOD Memory Controller FIFO, DDR, QDR, SDR, MemCtrl, MMC Memory Controller SDRAMDDR, Flash, SD Processor 8051, 8051s, ARM7TDMI Processor 80188, 80186, LEON3, 6809 Ethernet MII, RGMII,GMII, SGMII Security Security DES, 3DES, AES, SHA MD5, ARC4, RNG, ZUC, AES, SHA, 802.1ae (MACSec) 6 SmartFusion2 Product Family SmartFusion2 Features M2S005 M2S010 M2S025 M2S050 M2S060 M2S090 M2S150 Maximum Logic Elements (4LUT + DFF) 6,060 12,084 27,696 56,340 56,520 86,184 146,124 Math Blocks (18x18) 11 22 34 72 72 84 240 Fabric Interface Controllers (FICs) Logic/DSP 1 PLLs and CCCs 2 1 2 Security AES256, SHA256, RNG 8 AES256, SHA256, RNG, ECC, PUF Cortex-M3 + instruction Cache Yes eNVM (K Bytes) 128 256 512 eSRAM (K Bytes) 64 eSRAM (K Bytes) Non-SECDED 80 CAN, 10/100/1000 Ethernet, HS USB 1 Each MSS 2 6 Multi-Mode UART, SPI, I2C,Timer 2 Each LSRAM 18K Blocks 10 21 31 69 109 uSRAM 1K Blocks 11 22 34 72 112 240 Total RAM (K bits) 191 400 592 1,314 2,074 4,488 Fabric Memory DDR Controllers (count × width) High Speed User I/O 1×18 SERDES Lanes 0 4 PCIe End Points 0 1 123 2×36 1×18 2x36 8 4 16 2 157 139 4 MSIO (3.3V) 115 MSIOD (2.5V) 28 40 62 40 DDRIO (2.5V) 66 70 176 76 Total User I/Os 209 233 236 267 271 377 309 387 292 106 176 425 574 I/Os Per Package Package Options Package Type FCS(G)325 VF(G)256 FCS(G)536 Pitch (mm) 0.5 0.8 0.5 Length x Width (mm) Device 11x11 I/O Lanes 14x14 I/O Lanes VF(G)400 TQ(G)144 FG(G)484 FG(G)676 FG(G)896 FC(G)1152 0.5 1.0 1.0 1.0 1.0 0.8 16x16 I/O FCV(G)484 Lanes 17x17 I/O Lanes 19x19 I/O Lanes 20x20 I/O Lanes 23x23 I/O Lanes 27x27 I/O Lanes 31x31 I/O Lanes 35x35 I/O Lanes M2S005 (S) — — 161 — — — 171 — — — 84 — 209 — — — — — — — M2S010 (S/T/TS) — — 138 2 — — 195 4 — — 84 — 233 4 — — — — — — M2S025 (T/TS) 180 2 138 2 — — 207 4 — — — — 267 4 — — — — — — M2S050 (T/TS) 200 2 — — — — 207 4 — — — — 267 4 — — 377 8 — — M2S060 (T/TS) 200 2 — — — — 207 4 — — — — 267 4 387 4 — — — — M2S090 (T/TS) 180 4 — — — — — — — — — — 267 4 425 4 — — — — M2S150 (T/TS) — — — — 293 4 — — 248 4 — — — — — — — — 574 16 Note: 090 FCSG325 is 11x13.5 package dimension Highlighted devices can migrate vertically in the same package Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information.Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. 7 Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 email: [email protected] www.microsemi.com Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; Enterprise Storage and Communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at www.microsemi.com. ©2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. SF2-02-16