APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 1. Introduction This application note is a guide for migrating to the Macronix MX30LF2G28AB from the Toshiba® TC58NVG1S3E 2Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Macronix MX30LF2G28AB Vcc voltage range 2.7V ~ 3.6V Bus Width x8 Operating Temperature -40°C ~ 85°C Interface ONFI 1.0 Standard Block Size 128KB+7KB Page Size 2KB+112B ECC Requirement 8b/540B OTP size 30 pages Guaranteed Good blocks at Block 0 shipping Unique ID ONFI standard ID Code C2h/DAh/90h/95h/07h ONFI signature 4Fh/4Eh/46h/49h Data Retention 10 Years 48-TSOP (12x20mm) Package 63-VFBGA (9x11mm) Toshiba TC58NVG1S3E 2.7V ~ 3.6V x8 -40°C ~ 85°C *1 Toggle Mode NAND 128KB+4KB 2KB+64B 1b/528B Block 0 98h/DAh/00h/11h/04h Not Specified 48-TSOP (12x20mm) 63-VFBGA (9x11mm) Note: 1. Operating temperature range of TC58NVG1S3ETA00 (48-TSOP) is 0°C ~ 70°C. P/N: AN0310 1 Ver.1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 3. Performance Table 3-1 and Table 3-2 show MX30LF2G28AB and TC58NVG1S3E Read/Write performance. Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Read function Macronix MX30LF2G28AB Toshiba TC58NVG1S3E Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Function Performance (Program and Erase) Write Function Macronix MX30LF2G28AB Page Program time (tPROG) 300us (typ.)/600us (max.) Block Erase time (tERASE) 1ms (typ.)/3.5ms (max.) NOP 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 Toshiba TC58NVG1S3E 300us (typ.)/700us (max.) 2.5ms (typ.)/10ms (max.) 4 (max.) Not Specified Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Sequential Read Current (ICC1) Program Current (ICC2) Erase Current (ICC3) Standby Current – CMOS Macronix MX30LF2G28AB 20mA (typ.)/30mA (max.) 20mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) Toshiba TC58NVG1S3E 30mA (max.) 30mA (max.) 30mA (max.) 50uA (max.) Table 4-2: Input / Output Voltage DC Characteristic Macronix MX30LF2G28AB Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) Output Low Voltage (VOL) 0.2V (max.) Output High Voltage (VOH) VCC-0.2V (min.) P/N: AN0310 2 Toshiba TC58NVG1S3E -0.3V (min.) / 0.2Vcc (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) 0.2V (max.) Vcc-0.2V (min.) Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Toshiba® devices. TC58NVG1S3E can be compared by the MX30LF2G28AB without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the pin is designated “DNU” (Do Not Use) on the MX30LF2G28AB-TI. A DNU pin should not be connected to any signal or power trace on the board. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF2G28AB 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 DNU VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 TC58NVG1S3E 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 Pin38: DNU (Do Not Use) Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Toshiba MX30LF2 MX30LF2G28AB 8AB-TI TC58NVG1S3ETAI0 pin #25 VSS* NC pin #34 #34 VCC* #38 pin #3 8 DNU* #39 pin #3 9 VCC* #48 pin #4 8 VSS* Part Name 1 1 NC 2 NC 1 NC 1 NC Notes: 1. May not be connect internally (designated for ONFI compatibility). 2. DNU (Do Not Use) pin should be kept floating (DNU pin should not be connected to any signal or power trace on the board). P/N: AN0310 3 Ver. 1, Jun. 11, 2014 NC NC NC NC I/O7 I/O6 I/O5 I/O4 NC NC NC VCC VSS NC NC NC I/O3 I/O2 I/O1 IO0 NC NC NC NC APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF2G28AB 1 2 3 A NC NC B NC 4 5 6 7 TC58NVG1S3E 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC* 1 RE# CLE NC NC NC D NC RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC NC F NC NC NC NC NC NC NC NC NC NC VSS* 1 G DNU VCC* 1 DNU NC NC NC G NC NC NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss F 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5: DNU Note: 1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Toshiba MX30LF2 MX30LF2G28ABG28AB-XKI XKI TC58NVG1S3EBAI4 ball D3 VCC* 1 NC ball F7 VSS* 1 NC ball G4 VCC* ball G5 DNU* Part Name 1 2 NC NC Notes: 1. May not be connect internally (designated for ONFI compatibility). 2. DNU (Do Not Use) pin should be kept floating (DNU pin should not be connected to any signal or power trace on the board). P/N: AN0310 4 Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 6. Command Set Basic command sets, status checking methods, and Read and Write operation commands are similar, but the devices have different command sequences when accessing the Cache Read function and Two Plane Block Erase. Table 6-1: Command Table Macronix MX30LF2G28AB Command Random Data Input Serial Data Input Random Data Output Read Mode Copy Back Read Cache Read Begin Cache Read End Read ID Reset Page Program Cache Program Copy Back Cache Program Copy Back Cache Program End Block Erase Read Status Read Status for 2 Plane ERS/PGM Read Parameter Page (ONFI) Unique ID Read (ONFI) Set Feature (ONFI) Get Feature (ONFI) Status Enhance Read (ONFI) 1st Cycle 85h 2nd Cycle - - - 05h 00h 00h 3Fh 90h FFh 80h 80h 60h 70h ECh EDh EFh EEh 78h E0h 30h 31h 10h 15h D0h - Toshiba TC58NVG1S3E 1st Cycle 2nd Cycle 85h 80h 05h 00h 00h 31h 3Fh 90h FFh 80h 80h 8Ch 8Ch 60h 70h 71h - E0h 30h 3Ah 10h 15h 15h 10h D0h - Table 6-2: Two-Plane Command Table Command 2 Plane Program 2 Plane Cache Program 2 Plane Copy Back Prgm 2 Plane Block Erase P/N: AN0310 Macronix MX30LF2G28AB 1st 2nd 3rd 4th Cycle Cycle Cycle Cycle 80h 11h 80h 10h 80h 11h 80h 15h 60h D1h 60h D0h 5 1st Cycle 80h 80h 85h 60h Toshiba TC58NVG1S3E 2nd 3rd 4th Cycle Cycle Cycle 11h 81h 10h 11h 81h 15h 11h 80h 10h 60h D0h - Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 6-1 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-2 shows that Status output content provided by the Read Status command (70h) is compatible. Table 6-3 shows that Two Plane Operation Status output provided by the Enhance Read Status command (78h/71h) shows different content for Two-Plane operations. Table 6-2: Status Output Status Output Macronix MX30LF2G28AB SR[0] SR[1] SR[2] SR[3] SR[4] SR[5] SR[6] SR[7] Chip PGM/ERS/READ status: Pass/Fail Cache Program status: Pass/Fail Reserved Reserved Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect Table 6-3: Two Plane Operation Status Output Status Output Macronix MX30LF2G28AB SR[0] SR[1] SR[2] SR[3] SR[4] SR[5] SR[6] SR[7] P/N: AN0310 Selected Plane PGM/ERS/READ status: Pass/Fail Cache Program status: Pass/Fail Reserved Reserved Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect 6 Toshiba TC58NVG1S3E Chip PGM/ERS status: Pass/Fail Cache Program status: Pass/Fail Reserved Reserved Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect Toshiba TC58NVG1S3E Chip PGM/ERS status: Pass/Fail Plane 0 status 1: Pass/Fail Plane 1 status 1: Pass/Fail Plane 0 status 2: Pass/Fail Plane 1 status 2: Pass/Fail PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Write Protect Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 7. Device Identification The ID of the Macronix MX30LF2G28AB begins with a one-byte Manufacturer Code followed by a four-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs are different, allowing software to identify the device manufacturer and device type (Table 7-1). Table 7-1: Manufacturer and Device IDs ID code Value 1st Byte 2nd Byte bit 1- 0 bit 3 - 2 3rd Byte bit 5 - 4 bit 6 4th Byte th 5 Byte bit 7 bit 1- 0 bit 2 bit 7, 3 bit 5 - 4 bit 6 bit 1- 0 bit 3 - 2 bit 6 - 4 bit 7 P/N: AN0310 Macronix MX30LF2G28AB Toshiba TC58NVG1S3E C2h/DAh/90h/95h/07h 98h/DAh/00h/11h/04h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Sequential Read Cycle Time (tRC) Block Size (exclude Spare Area) Organization Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Reserved Reserved ECC Level Requirement Reserved Page Size (exclude Spare Area) Reserved Reserved Block Size (exclude Spare Area) Reserved Reserved Number of Plane per CE Plane Size Reserved Number of Plane per CE Reserved Reserved 7 Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 8. Power-Up Timing Macronix and Toshiba® power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point, measurement items are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Macronix MX30LF2G28AB 1ms (max.) N/A 10us (max.) Toshiba TC58NVG1S3E N/A 1ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN0310 8 Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB 9. Summary Macronix MX30LF2G28AB and Toshiba® TC58NVG1S3E NAND have similar features and pinouts. While basic Read/Program/Erase commands are similar, more advanced features such as cache access are implemented slightly differently. The TC58NVG1S3E only requires 1-bit ECC and the MX30LF2G28AB requires 8-bit ECC. The firmware will need to be modified from 1-bit ECC to 8-bit ECC as required by the MX30LF2G28AB. Otherwise, device migration may require minimal or no additional firmware modifications other than ECC support. 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet Location Date Issue Revision Website Website Website Website Jun. 3, 2014 Sep. 1, 2012 Sep. 1, 2012 Sep. 1, 2012 Rev. 1.1 Rev. 1.09 Rev. 1.09 Rev. 1.1 MX30LF2G28AB TC58NVG1S3ETAI0 TC58NVG1S3ETA00 TC58NVG1S3EBAI4 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF4G28AB and Toshiba® TC58NVG1S3E product families. Table 11-1: Part Number Cross Reference Density Macronix Part No. Toshiba Part No. MX30LF2G28AB-TI TC58NVG1S3ETAI0 2Gb MX30LF2G28AB-TI TC58NVG1S3ETA00 MX30LF2G28AB-XKI TC58NVG1S3EBAI4 Package 48-TSOP 48-TSOP 63-VFBGA Dimension 12x20mm 12x20mm 9x11x1.0mm 12. Revision History Revision 1.0 P/N: AN0310 Description Initial Release 9 Date Jun. 11, 2014 Ver. 1, Jun. 11, 2014 APPLICATION NOTE Comparing Toshiba® TC58NVG1S3E with MX30LF2G28AB Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0310 10 Ver. 1, Jun. 11, 2014