APPLICATION NOTE Migrating from MX30LF2G(4G)28AB to MX30LF2G(4G)18AC 1. Introduction This application note is a migration guide for migrating Macronix MX30LF2G(4G)28AB to MX30LF2G(4G)18AC 2Gb(4Gb) SLC NAND Flash. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 8. Newer versions of the datasheets may override the contents of this document. 2. General Features Both flash device families have similar features and functions as shown in Table 2-1. Feature differences are highlighted in Bold Italic type in the table. Table 2-1. Key Features Comparison Part Name MX30LF2G(4G)28AB MX30LF2G(4G)18AC 2.7V-3.6V 2.7V-3.6V x8 x8 -40°C to 85°C -40°C to 85°C ONFI 1.0 Compliant ONFI 1.0 Compliant Page Size (2K+112)B (2K+64)B Block Size (128K+7K)B (128K+4K)B ECC Requirement 8bit/540B 4bit/528B OTP 30 Pages 30 Pages ONFI Standard ONFI Standard N/A Yes Guaranteed Good Blocks at shipping Block#0 Block#0 Data Retention 10 Years 10 Years 100K Cycles 100K Cycles 48TSOP (12x20mm) 63-VFBGA (9x11mm) 48TSOP (12x20mm) 63-VFBGA (9x11mm) Voltage Bus Width Operating Temperature Interface Unique ID Block Protection Endurance Package P/N: AN0306 1 REV. 3, NOV. 25, 2014 APPLICATION NOTE 3. Electrical Performance Both flash device families have similar performance as shown in Table 3-1. Performance differences are highlighted in Bold Italic type in the table. Table 3-1. Key Performance Comparison Part Name Performance MX30LF2G(4G)18AC Typ. Max. Min. Typ. Max. Random (tR) - - 25us - - 25us Cache Read Busy time - 2us 25us - 3.5us 25us 20ns - - 20ns - - Page Program - 300us 600us - 300us 600us Program Time Cache Program Busy time - 3us 600us - 5us 600us Erase Time Block - 1ms 3.5ms - 1ms 3.5ms Standby (TTL) - - 1mA - - 1mA Standby (CMOS) - 10uA 50uA - 10uA 50uA Active Read - 20mA 30mA - 20mA 30mA Active Program - 20mA 30mA - 20mA 30mA Active Erase - 15mA 30mA - 15mA 30mA Power-up Current (Including POR Current) - - 30mA - - 50mA Input Leakage - - +/- 10uA - - +/- 10uA Output Leakage - - +/- 10uA - - +/- 10uA NOP - - 4 cycles - - 4 cycles Access Time Sequential Current Consumption Partial-Page Programs P/N: AN0306 MX30LF2G(4G)28AB Min. 2 REV. 3, NOV. 25, 2014 APPLICATION NOTE 4. Command Set Command sets are the same with the addition of the “Block Protection Status Read” command which is highlighted in Bold Italic type in Table 4-1. Table 4-1. Command Set Part Name Command Description MX30LF2G(4G)18AC 1st cmd Cycle 2nd cmd Cycle 1st cmd Cycle 2nd cmd Cycle Read 00h 30h 00h 30h Random Data Input 85h - 85h - Random Read Data Output 05h E0h 05h E0h Cache Read Random 00h 31h 00h 31h Cache Read Sequential 31h - 31h - Cache Read End 3Fh - 3Fh - Read ID 90h - 90h - Parameter Page Read (ONFI) ECh - ECh - Read Unique ID (ONFI) EDh - EDh - Get Features (ONFI) EEh - EEh - Set Features (ONFI) EFh - EFh - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h 80h 15h Block Erase 60h D0h 60h D0h Status Read 70h - 70h - Status Enhanced Read (ONFI) 78h - 78h - - - 7Ah - Block Protection Status Read Two-plane Program (ONFI) 80h-11h-80h-10h 80h-11h-80h-10h Two-plane Cache Program (ONFI) 80h-11h-80h-15h 80h-11h-80h-15h Two-plane Block Erase (ONFI) 60h-D1h-60h-D0h 60h-D1h-60h-D0h Set Feature followed by normal read/program command Set Feature followed by normal read/program command OTP Area Access P/N: AN0306 MX30LF2G(4G)28AB 3 REV. 3, NOV. 25, 2014 APPLICATION NOTE 5. Status Register Comparison Status Register bit functions are the same (Table 5-1). Please refer to the Macronix datasheet for additional details. Table 5-1. Status Register Comparison Part Name SR[0] SR[1] SR[2] MX30LF2G(4G)28AB MX30LF2G(4G)18AC Program/Erase Pass or Fail Cache Program Pass or Fail Not Used Program/Erase Pass or Fail Cache Program Pass or Fail Not Used SR[3] Not Used Not Used SR[4] Not Used Ready/Busy for Internal Controller Program/Erase/Read Operation Ready/Busy Write Protect Not Used Ready/Busy for Internal Controller Program/Erase/Read Operation Ready/Busy Write Protect SR[5] SR[6] SR[7] 6. Package Pin Definition The MX30LF2G(4G)28AB can be replaced by the MX30LF2G(4G)18AC without pin conflicts. Because the only difference is the PT (Protection) pin #38 of the MX30LF2G(4G)18AC. 48-TSOP (or ball G5 of the 63-VFBGA) (which has an internal weak pull-down) the user does not need to do anything if the protection feature is not used. Package physical dimensions are the same. For detailed information, please refer to the individual datasheets. Table 6-1. Package Pin Definition P/N: AN0306 Part Name MX30LF2G(4G)28AB MX30LF2G(4G)18AC 48-TSOP pin 38 63-VFBGA ball G5 DNU PT (Protection) 4 REV. 3, NOV. 25, 2014 APPLICATION NOTE 7. Device Identification The ID codes of the MX30LF2G(4G)28AB and MX30LF2G(4G)18AC are identical except for the last byte which is used to indicate the ECC requirement. Please note that although the two devices share the same code of “1” for the Spare Area Size (4th Byte, Bit 2), the MX30LFxG28AB’s Spare Area Size is 28 Bytes per 512 bytes, whereas the MX30LFxG18AC’s Spare Area size is 16 bytes per 512 bytes. Firmware that uses a non-ONFI detection method may need to be modified to recognize the smaller spare area of the MX30LFxG18AC device. Table 7-1. Device Identification Part Name 2Gb 4Gb 1st Byte 2nd Byte ID Code 3rd Byte ID Definition 4th Byte 5th Byte MX30LFxG28AB C2h/DAh/90h/95h/07h C2h/DCh/90h/95h/57h Manufacturer ID Device ID Number of Die per CE Cell Structure Number of Concurrently Programmed Pages Interleaved Programming between multiple devices Cache program Page Size Spare Area Size (28-byte per 512byte), bit2=1 Sequential Read Cycle Time (bit7, bit3=1,0) Block Size (Excluding spare area) Organization ECC level requirement, 8-bit ECC required (bit1:0=11b) Plane number Plane Size (Excluding spare area) Reserved MX30LFxG18AC C2h/DAh/90h/95h/06h C2h/DCh/90h/95h/56h Manufacturer ID Device ID Number of Die per CE Cell Structure Number of Concurrently Programmed Pages Interleaved Programming between multiple devices Cache program Page Size Spare Area Size (16-byte per 512byte), bit2=1 Sequential Read Cycle Time (bit7, bit3= 1,0) Block Size (Excluding spare area) Organization ECC level requirement, 4-bit ECC required (bit1:0=10b) Plane number Plane Size (Excluding spare area) Reserved 8. Reference Table 8-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed specification, please contact Macronix Sales and distributors. Table 8-1. Datasheet Versions Datasheet P/N: AN0306 Location Date Issued Revision MX30LFxG28AB Website Jun. 2014 Rev. 1.1 MX30LFxG18AC Website Oct. 2014 Rev. 1.0 5 REV. 3, NOV. 25, 2014 APPLICATION NOTE 9. Summary The Macronix MX30LFxG28AB and MX30LFxG18AC NAND flash share the same basic Read, Program, and Erase commands and have compatible pin-outs. The newly defined “PT” function on pin-38 of the MX30LFxG18AC can be left floating if the function is not needed or used. Migrating to the MX30LFxG18AC may require firmware modifications to accommodate differences in spare area sizes and ECC requirements 10. Part Number Cross-Reference Table 10-1. Part Number Cross Reference Bus Width Voltage Density 2G x8 3V 4G Package 48-TSOP 63-VFBGA 48-TSOP 63-VFBGA Part Number Part Number MX30LF2G28AB-TI MX30LF2G28AB-XKI MX30LF4G28AB-TI MX30LF4G28AB-XKI MX30LF2G18AC-TI MX30LF2G18AC-XKI MX30LF4G18AC-TI MX30LF4G18AC-XKI 11. Revision History Table 11-1. Revision History Revision No. REV. 1 REV. 2 REV. 3 P/N: AN0306 Description Initial Release of Advanced Information Version Correct the issuing date 1. Revised some timing spec to align with production datasheet 2. Defined ID byte#4 of MX30LFxG18AC to align with production datasheet 3. Revised the datasheet version of MX30LFxG18AC as Rev 1.0. Also removed title of "Advanced Information" 6 Page ALL 6 Date Jun. 20, 2014 Jul. 17, 2014 2 5 Nov. 25, 2014 5 REV. 3, NOV. 25, 2014 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applica- tions only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liabil- ity arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. P/N: AN0306 7 REV. 3, NOV. 25, 2014