APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 1. Introduction This application note serves as a guide to compare Micron N25Q00A with Macronix MX66L1G45G 3V 1Gb serial NOR flash. The document does not provide detailed information on each individual device, but highlights the similarities and differences between them. The comparison covers the general features, performance, command codes, and other differences. If common features are used in standard traditional modes, they may need only minimal software modification. Minor pinout and timing differences are reviewed as well. The information provided in this document is based on datasheets listed in Section 9. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1 and 2-2. Table 2-1: Feature Comparison Type / Function Macronix MX66L1G45G Micron N25Q00A VCC Voltage Range 2.7V-3.6V 2.7V-3.6V Normal Read Clock Frequency 66MHz 54MHz (1) Maximum STR Clock Frequency 166MHz 108MHz Maximum DTR Clock Frequency 83MHz 54MHz Configurable Dummy Cycles YES YES Sector Size 4KB/32KB/64KB 4KB/64KB Program Buffer Size 256Byte 256Byte Security OTP 512Byte 64Byte (3) XIP / Performance Enhanced Mode YES YES (3) XIP / Performance Enhanced Mode Set at Power-on YES YES Program/Erase Suspend & Resume YES YES Wrap Around Read Mode YES YES Adjustable Output Driver YES YES Deep Power Down YES S/W Reset Command YES YES High Voltage Accelerated Programming Option YES HOLD#/RESET# Pin Reset# Hold#/Reset# Block Protection Mode (BP bits) Top/Bottom Top/Bottom (2) Individual Sector Protection (Volatile) YES YES Program/Erase Cycles 100K 100K Notes: 1. Maximum clock frequency with default dummy cycles shown in Table 2-2. 2. Please see App Note section 4-4 for detailed comparison of Individual Sector Protection. 3. Macronix supports 1-4-4 and 4-4-4 mode XIP; Micron supports XIP in all fast read modes. P/N: AN0309 1 Ver.1,Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G Both devices support Double Transfer Rate (DTR) mode. While the Micron device supports DTR use with all Read modes, Macronix only supports DTR use in the Fast DTR Read (1-1-1), Dual I/O DTR Read ( 2DTRD = 1-2-2), and Quad I/O DTR Read (4DTRD SPI = 1-4-4) modes (Table 2-2). Table 2-2: Read Performance Macronix MX66L1G45G (1) Read Mode Default Dummy Cycles Max Speed @ Default (2) Dummy Cycles Micron N25Q00A Default Dummy Cycles Max Speed @ Default Dummy Cycles Fast Read 8 133MHz 8 108MHz (1-1-1) Dual Output Read 8 133MHz 8 108MHz (DREAD = 1-1-2) Dual I/O Read 4 84MHz 8 108MHz (2READ = 1-2-2) Dual Peripheral Interface 8 108MHz (2-2-2) Quad Output Read 8 133MHz 10 108MHz (QREAD = 1-1-4) Quad I/O SPI Read 6 84MHz 10 108MHz (4READ SPI = 1-4-4) Quad I/O QPI Read 6 84MHz 10 108MHz (4READ QPI= 4-4-4) Fast DTR Read 8 66MHz 6 54MHz (1-1-1) Dual Output DTR Read 6 54MHz (1-1-2) Dual I/O DTR Read 4 52MHz 6 53MHz ( 2DTRD = 1-2-2) Quad Output DTR Read 6 53MHz (1-1-4) Quad I/O SPI DTR Read 6 52MHz 8 48MHz ( 4DTRD SPI = 1-4-4) Quad I/O QPI DTR Read 6 52MHz 8 48MHz ( 4DTRD QPI = 4-4-4) Notes: 1. In the x-y-z notation used in this applications note, x specifies the number of channels for the command, y specifies the number of channels for the address, and z is the number of channels for data. 2. Higher clock rates can be achieved with increased number of dummy cycles (see Macronix datasheet). P/N: AN0309 2 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 3. Package and Pinout Both devices are available in 16-pin SOP and 24-BGA packages with similar footprints. Pinout definitions are identical with the two exceptions shown in Table 3-2. Where Macronix has a NC/SIO3 pin, Micron has either a HOLD#/DQ3 or a RESET#/DQ3 pin. If the Micron device has a HOLD# pin, but the HOLD# function is not used, then the devices are pin compatible. Macronix does not support the VPP (10V Fast Programming Voltage) function available on Micron’s W#/VPP/DQ2 pin. This function is normally only used on external programmers to accelerate Program/Erase operations and is generally not used for “in-circuit” programming. Table 3-1: Packages Packages 16-SOP (300mil) 24-Ball BGA (6mmx8mm with 5x5 ball array) Macronix MX66L1G45G YES YES Micron N25Q00A YES YES Figure 3-1: 16- PIN SOP Pinout Comparison 16-PIN SOP (300mil) Macronix MX66L1G45GMI Micron N25Q00AAx3GSF Macronix MX66L1G45GMI Micron N25Q00AAx3GSF NC/SIO3 VCC RESET# NC DNU DNU CS# SO/SIO1 HOLD#/DQ3 VCC DNU DNU DNU DNU S# DQ1 SCLK SI/SIO0 NC NC DNU DNU GND WP#/SIO2 C DQ0 DNU DNU DNU DNU VSS W#/ VPP /DQ2 Table 3-2: 16-SOP Pin Definition Comparison Package Pin Macronix MX66L1G45G Pin #1 NC/SIO3 HOLD#/DQ3 HOLD# not supported by Macronix. Dedicated Micron part numbers offer RESET# instead of HOLD#. NC means “No Connect” Pin #3 RESET# DNU Macronix RESET# pin has internal pull up. NC DNU WP#/SIO2 W#/ VPP /DQ2 Pin #5, 13, & 14 Pin #9 P/N: AN0309 Micron N25Q00A Comments NC means “No Connect” DNU means “Do Not Use” Macronix does not support VPP 3 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G Figure 3-2: 24-BGA (6x8mm with 5x5 Ball Array) MX66L1G45GXD N25Q00AAx3G12 5 NC NC NC NC NC 5 NC NC NC NC NC 4 RESET# VCC WP# SIO2 NC SIO3 NC 4 NC VCC WP#/ VPP/ DQ2 HLD# DQ3 NC 3 NC GND NC SI SIO0 NC 3 NC VSS NC DQ0 NC 2 NC SCLK CS# SO SIO1 NC 2 NC C S# DQ1 NC NC NC NC NC 1 NC NC NC NC B C D E B C D E 1 A A Table 3-3: 24-BGA Pin Definition Comparison Package Ball Macronix MX66L1G45G Ball D4 NC/SIO3 HOLD#/DQ 3 Ball A4 RESET# NC Ball C4 WP#/SIO2 W#/ /DQ2 P/N: AN0309 Micron N25Q00A VPP Comments HOLD# not supported by Macronix. Dedicated Micron part numbers offer RESET# instead of HOLD#. NC means “No Connect” Macronix RESET# pin has internal pull up. NC means “No Connect” Macronix does not support VPP 4 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 4. Key Feature and Operational Differences 4-1 Status Register and Configuration Register Differences Both devices use status and configuration registers to control device behavior and report status. The registers and bits used are similar but not identical. Micron also has Non-Volatile registers not shown. Both the Micron and Macronix devices use BP[3:0] bits to select the same memory areas for protection. The N25Q00A Block Protection bits BP[3:0] are located in Status Register (bits 6 and [4:2]). The Top/Bottom bit is located in Status Register bit 5 and selects whether block protection starts at the top or bottom of memory. The BP[3:0] and Top/Bottom bits are nonvolatile and reprogrammable. The MX66L1G45G Block Protection bits BP[3:0] are located in Status Register bits [5:2]. The top/bottom starting point is controlled by the TB bit, which is located in Configuration Register bit 3. The default setting of the TB bit starts block protection at the top of memory. If the ‘bottom’ starting point is selected, it can never be returned to the ‘top’ starting point. The BP[3:0] bits are all nonvolatile and reprogrammable. The TB bit is nonvolatile and one-time-programmable. Table 4-1: Status Register Bits Register Bit Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Macronix MX66L1G45G WIP; 1=write operation WEL; 1=write enable BP0; BP protection BP1; BP protection BP2; BP protection BP3; BP protection QE; 1=Quad mode enable SRWD; 1=SR write disable Micron N25Q00A WIP; 1=write operation WEL; 1=write enable BP0; BP protection BP1; BP protection BP2; BP protection T/B; Top/Bottom Protect BP3; BP protection SRWD; 1=SR write disable Table 4-2: Configuration Register/ Enhanced Volatile Configuration Register Register Bit Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 P/N: AN0309 Macronix MX66L1G45G ODS0 (Output Driver Strength) ODS1 (Output Driver Strength) ODS2 (Output Driver Strength) T/B; Top/Bottom Protect PBE; 1=Enable Preamble bit 4-BYTE; 1=4Byte address DC0 (Dummy Cycle 0) DC1 (Dummy Cycle 1) 5 Micron N25Q00A ODS0 (Output Driver Strength) ODS1 (Output Driver Strength) ODS2 (Output Driver Strength) Vpp accelerator; 1=disabled Reset/Hold; 1=Enable Reserved DPI protocol; 1=disable QPI protocol; 1=disable Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G Table 4-3: Macronix Security Register vs. Micron Flag Status Register Register Bit Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Macronix MX66L1G45G Secured OTP Indicator; 1=factory lock LDSO; 1=OTP lock down PSB (Program/Suspend bit) ESB (Erase/Suspend bit) Reserved P_FAIL; 1=Program fail E_FAIL; 1=Erase fail WPSEL; 1=Individual WP Micron N25Q00A Address; 1=4-Byte address Protection PSB (Program/Suspend bit) Vpp Error; 1=disabled (default) P_FAIL; 1=Program fail E_FAIL; 1=Erase fail Erase Suspend; 1=suspend PGM/ERS controller;1=ready 4-2 QPI Differences Micron’s Quad I/O mode is entered by setting a bit in the Nonvolatile Configuration Register, which remembers this mode after power cycles, or by setting a bit in the Enhanced Volatile Configuration Register and is reset after a power cycle. The MX66L1G45G requires an EQIO (35h) command to enter the equivalent QPI mode. This mode can be terminated by a RSTQIO (F5h) command or by a power cycle or software reset. 4-3 XIP Differences The XIP (eXecute In Place) feature (Macronix refers to this as Performance Enhance Mode) is only used during Fast Read operations and eliminates the need to input read commands prior to entering an address and reading data. This is an overhead reduction feature that increases data throughput. Both devices offer this feature, but entry and exit methods are different. The MX66L1G45G enters XIP mode whenever all four bits of the first and second dummy cycles of a FREAD instruction are not equal and will exit XIP mode if any of the bits of the first and second dummy cycles are equal. Macronix only supports XIP in Quad I/O (1-4-4) and QPI (4-4-4) modes. Micron supports XIP in all Fast Read I/O modes. 4-4 Individual Sector/Block Protection Differences Both devices have the ability to protect individual 64KB sectors/blocks of memory. The methods used are independent of the nonvolatile BP bit configuration in the Status Register. With the Micron flash, it is possible to use both methods of write protection (BP bits and Individual Sector Protection) simultaneously, and the protected area is the combination of the two. When using the Macronix flash, either BP bit Protection or Individual Block Protection can be selected exclusively, with the default being the use of the BP bits. The N25Q00A has one Lock Register for each 64KB sector to control the sector’s program/erase protection status. The protection can be turned on or off at any time unless the sector’s Lock Register has been locked by the application. Once locked, its associated sector will remain in the protected or unprotected state until the next power cycle or reset. All sectors not protected by the Status Register BP configuration will be unprotected after power up and all Lock Registers will be unlocked. P/N: AN0309 6 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G The MX66L1G45G has one volatile protection register for each of the top sixteen 4KB sectors, bottom sixteen 4KB sectors, and 2046 middle 64KB blocks of memory. These protection registers can only be used after permanently disabling the Status Register BP protection bits. This is done by executing the WPSEL instruction once. Please note that this irreversible and the individual sector/block protection method will be permanently selected. After permanently selecting the individual sector/block protection method for the MX66L1G45G, all sectors and blocks will be locked by default on power up. Sectors/blocks must be unlocked before they can be programmed or erased. Unlocking sectors/blocks can be done on an individual basis with the SBULK (Single Block Unlock) command or on all sectors/blocks with the GBULK (Global Block Unlock) command. Sectors and blocks can be relocked as necessary with the SBLK (Single Block Lock) command or GBLK (Global Block Lock) command. Since the smallest individual sector protection size in the N25Q00A is 64KB, if an application is currently locking/unlocking the top and/or bottom 64KB sector(s), it will need to lock/unlock each of the 16 top and/or bottom 4KB sectors in the MX66L1G45G for equivalent results. 4-5. Chip Read and Erase Differences The Micron N25Q00A only supports the Die Erase function, which means users have to execute four Die Erase Commands (once in each die) to finish a chip erase operation. In the meantime, The Macronix MX66L1G45G device looks and works like a monolithic 1Gb die and only needs one CE command with no address required. Similarly, because Micron treats its four die solution as four independently addressable arrays, extra steps may be required when using the Micron flash during Reads which are not required for the Macronix flash. For example, per the Micron datasheet "After any READ command is executed, the device will output data from the selected address in the die. After a die boundary is reached, the device will start reading again from the beginning of the same 256Mb die. A complete device reading is completed by executing READ four times.." Macronix has no such requirement: “the whole memory can be read out with a single READ instruction. The address counter rolls over to 0 when the highest address has been reached." P/N: AN0309 7 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 5. Performance Tables 5-1 and 5-2 show that the two devices have similar AC and DC performance. Table 5-1: AC Parameter Comparison Symbol Macronix Micron tCH tCH tCL tCL tCLQV Tclqv Parameter Clock High Time Clock Low Time Clock Low to Output Valid (STR mode) Output Hold Time Data In Setup Time Data In Hold Time VCC(min) to CS# low tCLQX tDVCH tCHDX tVSL tCLQX tDVCH tCHDX tVTW Page Program Time (256 Bytes) tPP tPP Erase 4KB Subsector/Sector tSE Condition min min max @10pF max @15pF max @30pF min. min min min max typ max typ max Erase 32KB Sector tBE32 typ max Erase 64KB Sector/Block tBE tSE typ max Bulk Erase / Chip Erase tCE tBE typ max Notes: 1. Calculated with Single Die Erase cycle time (32MB) x4. tSSE Macronix MX66L1G45G 45% fTSCLK 45% fTSCLK 6ns 8ns 1ns 2ns 4ns 1500us 0.6ms Micron N25Q00A 4ns 4ns 6ns 8ns 1ns 2ns 3ns 150us 0.5ms 3ms 85ms 400ms 380ms 2s 680ms 4s 480s 1200s 5ms 250ms 800ms 700ms 3s (1) 960s (1) 1920s Table 5-2: DC Parameter Comparison Parameter Leakage Current Standby Current VCC Read Current (Fast Read) Symbol Macronix Micron ILI/ILO ILI/ILO ISB1 ICC1 ICC1 ICC3 Condition max typ max max @ 108MHz (Quad I/O) max @ 104MHz (Quad I/O) max @ 84MHz max @ 54MHz VCC Program Current VCC Write Status Register Current VCC Erase Current P/N: AN0309 ICC2 ICC3 ICC4 ICC5 max max ICC4 ICC6 max 8 Macronix MX66L1G45G +/- 4uA 60uA 200uA Micron N25Q00A +/- 2uA 200uA - 15mA 40mA - 30mA - 25mA 6mA 20mA 40mA 20mA 25mA 20mA Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 6. Command Code Both devices use the same basic command set, but there are a few minor differences highlighted in Table 6-1. Table 6-1: Command Code Comparison Instruction Type Read ID Read (STR) Read (DTR) Write Register P/N: AN0309 Instruction RDID RDSFDP READ FAST_READ DOFR DIOFR QOFR QIOFR FAST_READ DOFR DIOFR QOFR QIOFR WREN WRDI PP 4PP SE BE 32K SE 64K CE RDSR RDEAR WREAR WRSR RDSCUR WRSCUR RDLR WRLR RFSR CLFSR RDCR - Description Read Identification Read Serial Flash Discoverable P. Table Read Data Bytes (3B/4B) Read Data Bytes at Higher Speed (3B/4B) Dual Output Fast Read (3B/4B) Dual Input/Output Fast Read (3B/4B) Quad Output Fast Read (3B/4B) Quad Input/Output Fast Read (3B/4B) Read Data Bytes at Higher Speed Dual Output Fast Read Dual Input/Output Fast Read Quad Output Fast Read Quad Input/Output Fast Read Write Enable Write Disable Page Program (3B/4B) Dual Input Fast Program (1-1-2) Dual I/O Fast Program (1-2-2) Quad Page Program (1-4-4) Sector Erase 4KK Block Erase 32KB Block Erase 64KB Single Die Erase (32MB) Chip Erase (1Gb) Read Status Register Read Extended Address Register Write Extended Address Register Write Status Register Read Security Register Write Security Register Read Lock Register Write to Lock Register Read Flag Status Register Clear Flag Status Register Read Non-volatile Configuration Register Write Non-volatile Configuration Register Read Volatile Configuration Register Write Volatile Configuration Register Read Enhance Volatile Configuration Register Write Enhance Volatile Configuration Register 9 Macronix MX66L1G45G 9Fh 5Ah 03h / 13h 0Bh / 0Ch 3Bh / 3Ch BBh / BCh 6Bh / 6Ch EBh /ECh 0Dh BDh EDh 06h 04h 02h / 12h 38h 20h 52h D8h 60 / C7h 05h C8h C5h 01h 2Bh 2Fh 2Dh 2Ch 15h - Micron N25Q00A 9Eh/9Fh 5Ah 03h / 13h 0Bh / 0Ch 3Bh / 3Ch BBh / BCh 6Bh / 6Ch EBh /ECh 0Dh 3Dh BDh 6Dh EDh 06h 04h 02h / 12h A2h D2h 32h 20h D8h C4h 05h C8h C5h 01h E8h E5h 70h 50h B5h B1h 85h 81h 65h 61h Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G Table 6-1: Command Code Comparison - Continued Instruction Type QPI OTP Others Instruction EQIO RSTQIO QPIID ENSO EXSO ROTP POTP PGM/ERS Suspend PGM/ERS Resume RSTEN RST EN4B EX4B DP RDP Description Enable QPI Reset (Exit) QPI QPI ID Read Enter Secured OTP Exit Secured OTP Read OTP Area Program OTP Area Program or Erase Suspend Program or Erase Resume Reset Enable Reset Memory Enter 4-Byte Mode Exit 4-Byte Mode Deep Power Down Release from Deep Power Down Macronix MX66L1G45G 35h F5h AFh B1h C1h B0h 30h 66h 99h B7h E9h B9h ABh C0h SBL Set Burst Length Note 1: Micron uses their Volatile Configuration Register to control this function. Micron N25Q00A AFh 4Bh 42h 75h 7Ah 66h 99h B7h E9h Note 1 7. Manufacturer and Device ID Table 7-1: Manufacturer and Device ID Comparison Command Type Manufacture ID Device ID Macronix MX66L1G45G C2h Micron N25Q00A 20h Memory Type 20h BAh Memory Capacity 1Bh N/A 21h 17 Bytes Unique ID 8. Summary The Macronix MX66L1G45G and Micron N25Q00A have similar commands, functions, and features. The devices are command compatible for basic read, program, and erase (4KB and 64KB) operations. The devices are essentially pin compatible if the HOLD# function is not used. A more detailed analysis should be done if “special” functions such as: XIP or Individual Sector Write Protection is used. If common features are used in standard traditional modes, they may need only minimal software modification primarily due to differences in register bit settings. P/N: AN0309 10 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G 9. References Table 9-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com/. Table 9-1: Datasheet Version Datasheet MX66L1G45G, 3V, 1Gb, v0.0.pdf n25q_1gb_3V_65nm.pdf Location Macronix Website Micron Website Date Issued Dec. 2013 Sept. 2013 Version 0.0 K 10. Appendix Table 10-1 shows the basic part number and package information cross reference between Macronix MX66L1G45G and Micron N25Q128 parts. Table 10-1: Part Number Cross Reference Macronix Part No. MX66L1G45GMI-10G MX66L1G45GMI-10G MX66L1G45GMI-10G MX66L1G45GMI-10G MX66L1G45GXDI-10G MX66L1G45GXDI-10G MX66L1G45GXDI-10G MX66L1G45GXDI-10G Micron Part No. N25Q00AA13GSF40 N25Q00AA23GSF40 N25Q00AA33GSF40 N25Q00AA43GSF40 N25Q00AA13G1240 N25Q00AA23G1240 N25Q00AA33G1240 N25Q00AA43G1240 Package 16-SOP 16-SOP 16-SOP 16-SOP 24-BGA 24-BGA 24-BGA 24-BGA Dimension 300 mil 300 mil 300 mil 300 mil 8 x 6 mm 8 x 6 mm 8 x 6 mm 8 x 6 mm Note Hold# pin, Micron XIP Hold# pin, Basic XIP Reset# pin, Micron XIP Reset# pin, Basic XIP Hold# pin, Micron XIP Hold# pin, basic XIP Reset# pin, Micron XIP Reset# pin, basic XIP 11. Revision History Revision 1.0 P/N: AN0309 Description Initial Release Date January 20, 2014 11 Ver.1, Jan.20, 2014 Macronix Proprietary APPLICATION NOTE Comparing Micron N25Q00A with Macronix MX66L1G45G Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0309 12 Ver.1, Jan.20, 2014