MBRB20200CTG, SBRB20200CTT4G SWITCHMODE Power Rectifier Dual Schottky Rectifier This device uses the Schottky Barrier technology with a platinum barrier metal. This state−of−the−art device is designed for use in high frequency switching power supplies and converters with up to 48 V outputs. They block up to 200 V and offer improved Schottky performance at frequencies from 250 kHz to 5.0 MHz. http://onsemi.com SCHOTTKY BARRIER RECTIFIER 20 AMPERES, 200 V Features 200 V Blocking Voltage Low Forward Voltage Drop Guardring for Stress Protection and High dv/dt Capability (10,000 V/ms) Dual Diode Construction − Terminals 1 and 3 Must be Connected for D2PAK CASE 418B Parallel Operation at Full Rating AEC−Q101 Qualified and PPAP Capable SBRB Prefix for Automotive and Other Applications Requiring 1 3 Unique Site and Control Change Requirements All Packages are Pb−Free* 4 Mechanical Characteristics: Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 Weight: 1.7 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Rating: Human Body Model = 3B Machine Model = C MARKING DIAGRAM AY WW B20200G AKA A Y WW B20200 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 7 1 Publication Order Number: MBRB20200CT/D MBRB20200CTG, SBRB20200CTT4G MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (At Rated VR, TC = 134C) Per Leg Per Device IF(AV) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = +137C) Per Leg IFRM Nonrepetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 1.0 A Storage Temperature Range Tstg −65 to +175 C Operating Junction Temperature TJ −65 to +150 C dv/dt 10,000 V/ms A 10 20 A 20 Voltage Rate of Change (Rated VR) 150 A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Characteristic Thermal Resistance, Junction−to−Case Symbol Value Unit RqJC 2.0 C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 1) (IF = 10 A, TC = 25C) (IF = 10 A, TC = 125C) (IF = 20 A, TC = 25C) (IF = 20 A, TC = 125C) VF Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TC = 25C) (Rated dc Voltage, TC = 125C) IR 0.9 0.8 1.0 0.9 1.0 50 V mA DYNAMIC CHARACTERISTICS (Per Leg) Capacitance (VR = −5.0 V, TC = 25C, Frequency = 1.0 MHz) CT pF 500 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. ORDERING INFORMATION Package Shipping† MBRB20200CTG D2PAK (Pb−Free) 50 Units / Rail MBRB20200CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel SBRB20200CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MBRB20200CTG, SBRB20200CTT4G 10,000 70 50 TJ = 150C 1,000 TJ = 150C IR , REVERSE CURRENT ( A) IF, INSTANEOUS FORWARD CURRENT (AMP) 100 20 TJ = 125C 10 7 TJ = 100C 5 TJ = 25C 2 TJ = 125C 100 TJ = 100C 10 1 0.1 TJ = 25C 1 0.2 0.4 0.6 0.8 vF, INSTANTANEOUS VOLTAGE (V) 0.01 1 0 10 28 dc 24 IPK IAV 20 = 20 16 12 8 4 0 0 5 10 15 20 25 30 35 IF(AV), AVERAGE FORWARD CURRENT (AMPS) SQUARE WAVE 32 60 80 100 120 140 25 20 15 dc SQUARE WAVE 10 5 0 110 120 130 140 TC, CASE TEMPERATURE (C) Figure 3. Forward Power Dissipation Figure 4. Current Derating, Case 90 100 150 160 500 RqJA = 16C/W RATED VOLTAGE 16 TJ = 25C 400 dc SQUARE WAVE 8 180 200 RATED VOLTAGE RqJC = 2C/W IF(AV), AVERAGE FORWARD CURRENT (A) 20 12 160 Figure 2. Typical Reverse Current (Per Leg) C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (WATTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) TJ = 125C 36 40 VR, REVERSE CURRENT (V) Figure 1. Typical Forward Voltage (Per Leg) 40 20 4 300 200 100 0 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (C) 150 175 1 2 5 10 20 50 VR, REVERSE VOLTAGE (V) Figure 5. Current Derating, Ambient Figure 6. Typical Capacitance (Per Leg) http://onsemi.com 3 70 100 MBRB20200CTG, SBRB20200CTT4G PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K J G D M T B M N R P U L M W H 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE DIM A B C D E F G H J K L M N P R S V L L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB20200CTG, SBRB20200CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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