MBRB2545CT D

MBRB2545CTG,
SBRB2545CTG
SWITCHMODE
Power Rectifier
D2PAK Surface Mount Power Package
The D2PAK Power Rectifier is a state−of−the−art device that
employs the Schottky Barrier principle with a platinum barrier metal.
Features
•
•
•
•
•
•
•
•
•
•
Center−Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
175°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Short Heat Sink Tab Manufactured − Not Sheared
Similar in Size to the Industry Standard TO−220 Package
AEC−Q101 Qualified and PPAP Capable
SBRB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 45 VOLTS
D2PAK
CASE 418B
STYLE 3
1
4
3
Mechanical Characteristics
•
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Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V)
MARKING DIAGRAM
AY WW
B2545G
AKA
A
Y
WW
B2545
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. 12
1
Publication Order Number:
MBRB2545CT/D
MBRB2545CTG, SBRB2545CTG
MAXIMUM RATINGS (Per Leg)
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
45
V
Average Rectified Forward Current
(Rated VR, TC = 164°C) Total Device
IF(AV)
15
30
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 160°C)
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz)
IRRM
1.0
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature (Note 1)
TJ
−65 to +175
°C
dv/dt
10,000
V/ms
Voltage Rate of Change (Rated VR)
A
30
A
150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS (Per Leg)
Symbol
Characteristic
Thermal Resistance,
Junction−to−Case
Junction−to−Ambient (Note 2)
Value
Unit
°C/W
1.5
50
RqJC
RqJA
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Diode)
Characteristic
Symbol
Condition
Min
Typ
Max
Unit
VF
Instantaneous Forward Voltage
(Note 3)
IF = 15 Amp, TJ = 25°C
IF = 15 Amp, TJ = 125°C
IF = 30 Amp, TJ = 25°C
IF = 30 Amp, TJ = 125°C
−
−
−
−
−
0.50
−
0.65
0.62
0.57
0.82
0.72
V
IR
Instantaneous Reverse Current
(Note 3)
VR = 45 Volts, TJ = 25°C
VR = 45 Volts, TJ = 125°C
−
−
−
9.0
0.2
25
mA
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
ORDERING INFORMATION
Package
Shipping†
D2PAK
50 Units / Rail
SBRB2545CTG
D2PAK
(Pb−Free)
50 Units / Rail
MBRB2545CTT4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
SBRB2545CTT4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
Device
MBRB2545CTG
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
MBRB2545CTG, SBRB2545CTG
200
100
TJ = 125°C
10
150°C
1.0
25°C
0.1
0
0.2
0.4
0.6
40
20
10
4.0
2.0
1.0
0.4
0.2
0.1
0.04
0.02
0.01
0.004
0.002
0.8
1.0
1.2
1.4
1.6
1.8
(RESISTIVE LOAD)
20
(CAPACITIVE
LOADS)
IPK
=p
IAV
DC
5
10
IPK
= 20
IAV
4
0
0
25°C
0
10
20
30
40
Figure 2. Typical Reverse Current, Per Leg
24
8
75°C
Figure 1. Typical Forward Voltage, Per Leg
TJ = 125°C
12
100°C
VR, REVERSE VOLTAGE (VOLTS)
SQUARE WAVE
16
125°C
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
32
28
TJ = 150°C
IR , REVERSE CURRENT (mA)
100
IF(AV), AVERAGE FORWARD CURRENT (A)
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1000
4
8
12
16
20
24
28
32
IF, AVERAGE FORWARD CURRENT (AMPS)
36
40
26
DC
24
22
20
18 SQUARE
16
14
12
10
8
6
4
2
0
145
150
155
160
165
TC, CASE TEMPERATURE (°C)
170
Figure 4. Current Derating, Case
per Leg
Figure 3. Typical Forward Power Dissipation
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3
50
175
MBRB2545CTG, SBRB2545CTG
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
−B−
V
W
4
1
2
A
S
3
−T−
SEATING
PLANE
K
J
G
D
M
T B
M
N
R
P
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
U
L
M
W
H
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
MBRB2545CTG, SBRB2545CTG
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBRB2545CT/D