NCP4350 Supervisory IC for Desktop Power Supply Monitoring The NCP4350 provides all the necessary functions to monitor and control a multi-output power supply providing fault protection shutdown signals, and On/Off control. The NCP4350 provides the ability to monitor the status of the +5 Vdc, +12 Vdc (A and B outputs), and +3.3 Vdc output (voltage and current). The controller has built in delay to prevent tripping during transient conditions to eliminate false shutdowns. OVP/UVP (OverVoltage/UnderVoltage Protection) monitors 3.3V, 5V, and dual 12V to protect the power supply, FPOB output goes high when one of these supply voltages exceed their limits. OCP (OverCurrent Protection) monitors 3.3V, 5V, and dual 12V output current. Overcurrent limit is adjustable by IREF and current protection resistor. The PGI (Power Good Input) and OTP (OverTemperature Protection) input pin provides the flexibility for design protection circuit. The PGO (Power Good Output) signal gives personal computer notice when the output supplies are ready or power supply is going to shutdown or fail, therefore it can provide a reliable power supply environment. http://onsemi.com MARKING DIAGRAM NCP4350DG AWLYWW SOIC-16 D SUFFIX CASE 751B 1 A WL Y WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Device PIN CONNECTIONS Features •Individual Overvoltage and Undervoltage Monitoring for +3.3V, +5V, +12VA, +12VB Outputs and Lockout •Individual Overcurrent Monitoring for +3.3V, +5V, +12VA, +12VB Outputs and Lockout •Fault Output with 5 mA of Sink Capability •Remote On/Off •Power Good Output Signal with 5 mA of Sink Capability •Built-in Delays for OVP, UVP, and Overload to avoid False Tripping •Low Power Consumption 10 mW at VCC = 5V Typical •Overtemperature Input •Wide Power Supply Range (4 V - 16 V) PGI 1 16 PGO GND 2 15 VCC FPOB 3 14 VS5 PSONB 4 13 VS33 IS12A 5 12 VS12A RI 6 11 IS33 IS12B 7 10 IS5 VS12B 8 9 OTP (Top View) ORDERING INFORMATION Typical Applications •ATX Computers Device Package Shipping{ NCP4350DR2G SOIC-16 (Pb-Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 September, 2007 - Rev. 0 1 Publication Order Number: NCP4350/D NCP4350 Internal VCC 170 mA Remote On/Off Delay 38 ms (typ) Vref (1.25 V) On OTP + OTP VS33 + - 0.8 V - 2.0 V Fault (FPOB) POR UN + OV - 4 ms One Shot UV Fault Delay 1 ms (typ) VS5 PSONB R Q S Q + UN + - VS12A + - VS12B OV OV Fault Delay 14 ms (typ) UN Q S Q Reset Dominate + - OV + - UN + - OV UV/OL Blanking 75 ms (typ) PGO PWR Good Delay 300 ms (typ) Vref IS33 R + IREF x 8 IS5 + 20 ms OCP IREF x 8 IS12A + IREF x 8 Vref IS12B + IREF x 8 + - IREF x 8 Buffer IREF x 8 Vref 1.25 V ±3% Bandgap Reference Internal Power GND PGI RI Figure 1. Detailed Block Diagram http://onsemi.com 2 +VCC NCP4350 PIN DESCRIPTION Pin Pin# PGI 1 The pin is used for a power good input signal. Description GND 2 Ground FPOB 3 This is an open drain output for Fault protection shutdown. PSONB 4 This pin is used for a REMOTE on/off switch input and acts as a reset signal after a fault condition. IS12A 5 This pin is an input to the +12 VA output current monitoring comparator. RI 6 A resistor to ground sets the IREF current for overcurrent monitoring. IS12B 7 This pin is an input to the +12 VB output current monitoring comparator. VS12B 8 This pin is an input to the +12 VB output voltage monitoring comparator. OTP 9 Overtemperature or external protection input. IS5 10 This pin is an input to the +5 V output current monitoring comparator. IS33 11 This pin is an input to the +3.3 V output current monitoring comparator. VS12A 12 This pin is an input to the +12 VA output voltage monitoring comparator. VS33 13 This pin is an input to the +3.3 V output voltage monitoring comparator. VS5 14 This pin is an input to the +5 V output voltage monitoring comparator. +VCC 15 This is the input pin for VCC. PGO 16 This pin provides an open drain power good output signal. +16 V OTP L12V +12 V RECT IS12B L5V TRANSFORMER SYNC RECT + DRV W2 +12 VB W1 +12 VA IS12A R12VA R12VB +5 V L33V +3.3 V SYNC RECT + DRV R5V OTP VS12A VS12B VS5 VS33 R33V IS5V IS33V IS12B IS12A IS33 IS5 OTP GND RI PGO PGO +VCC FPOB PSONB PGI L+5VSTBY PSONB +5 Vstandby R1 R2 R3 4 3 1 2 1 2 1 2 4 3 4 3 Figure 2. Typical Application http://onsemi.com 3 NCP4350 MAXIMUM RATINGS Rating Symbol Value Unit VCC -0.3 to 16 100 V mA Maximum Voltage Current VS12A VS12B IS12A IS12B -0.3 to 16 100 V mA Maximum Voltage Current PGI PSONB OTP VS33 IS33 -0.3 to 5.5 100 V mA Maximum Voltage VRI 2.0 V IPGO IFPOB 5.0 mA VOHPGO, VOHFPOB VS5 IS5 7.5 V IREF 100 mA Maximum Junction Temperature TJMAX 150 °C Storage Temperature Range TSMAX -65 to 150 °C Lead Temperature (Soldering, 10s) TLMAX 300 °C PD TBD W Power Supply Input Current Power Good Output and FPOB Sink Current Maximum Voltage Output Current from RI Total Power Dissipation Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pins 1-16: Human Body Model 2000V per Mil-Std-883, Method 3015. Machine Model Method 200V 2. This device contains Latch-up protection and exceeds ±100ma per JEDEC Standard JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Rating Min Typ Max Unit VCC Operating Supply Voltage 4.0 16 V IREF Output Current from RI 12.5 62.5 mA 0 105 °C TJ Operating Junction Temperature Range http://onsemi.com 4 NCP4350 ELECTRICAL CHARACTERISTICS (VCC = 12V, for typical values TJ = 25°C, for min/max values, TJ = 0°C to +105°C, Max TJ = 150°C, RI =33 kW, unless otherwise noted.) Rating Min Typ Max Unit - 1.5 2.0 mA 3.8 3.9 4.0 V - 40 - mV 5.6 5.8 6.0 V - 60 - mV 13.5 13.85 14.2 V - 130 - mV 2.8 2.9 3.0 V - 30 - mV 4.2 4.4 4.6 V - 45 - mV 10.3 10.65 11.0 V - 100 - mV Low Level Output Voltage Fault (ISink = 5 mA) 0.4 V ILFAULT Leakage Current (VDS= 5V) 10 mA VTHPGI Input Voltage Threshold 1.32 V VOLPGO Low Level Output Voltage (ISink = 5 mA) 0.4 V Leakage Current (VDS = 5V) 10 mA 0.8 V Symbol ICC Operating Supply Current (VCC = 16V, FPOB↓ and PGO↑) Overvoltage/Undervoltage Protection V33OVP V33OVPHYS V5OVP V5OVPHYS V12OVP (A and B) V12OVPHYS (A and B) V33UVP V33UVPHYS V5UVP V5UVPHYS V12UVP (A and B) V12UVPHYS (A and B) +3.3V Output Overvoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) +5 V Output Overvoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) +12V Output Overvoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) +3.3V Output Undervoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) +5 V Output Undervoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) +12V Output Undervoltage Threshold (includes VIO) TJ =0°C to +105°C Hysteresis (Note 3) Interface I/O VOLFPOB ILPGO 1.18 VOLPSONB Low Level Input Voltage VOHPSONB High Level Input Voltage 2.0 VPSONBHYS PSONB Input Hysteresis 300 PSONBVIH Open Circuit Voltage (IIN = 0 mA) 2.5 Input Pull-up Current (VPSONB = 0V) 120 ILPSONB 1.25 V - 170 - mV 5.25 V 220 mA Current Monitoring Comparators IS12AVIO Input Offset Voltage 12VA Comparator, TJ = +25°C -4.0 4.0 mV IS12BVIO Input Offset Voltage 12VB Comparator, TJ = +25°C -4.0 4.0 mV IS33VIO Input Offset Voltage 33V Comparator, TJ = +25°C -4.0 4.0 mV IS5VIO Input Offset Voltage 5V Comparator, TJ = +25°C -4.0 4.0 mV AVOL IIB IREFGAIN Voltage Gain (Note 3) 50 Input Bias Current (VIS12x = 12V, VIS5 = 5V, VIS33 = 3.3V) The Gain of the IREF signal, RI=33 k ±0.1%, IREF = 1.25/RI, TJ=+25°C http://onsemi.com 5 7.68 200 V/mV 300 500 8.0 8.32 nA NCP4350 ELECTRICAL CHARACTERISTICS (VCC = 12V, for typical values TJ = 25°C, for min/max values, TJ = 0°C to +105°C, Max TJ = 150°C, RI =33 kW, unless otherwise noted.) Symbol Rating Min Typ Max Unit Time delay On/Off PSONB (PGO↓) 50% of the pull up voltage (PSONB>VOHPSONB, Rpull-up FPOB =1k, Vpull-up = +5 V) 24 38 62 msec TdlyFOP Time delay between PGO↓ and FPOB↑ 2.0 4.0 8.0 msec TdlyOV Time delay from an OV to FPOB↑ and PGO↓ 50% of the pull up voltage (PSONB<VOLPSONB, Rpull-up FPOB =1k, Vpull-up = +5 V) 9.0 14 19 msec TdlyUV Time delay from an UV to FPOB↑ and PGO↓ 50% of the pull up voltage (PSONB<VOLPSONB, Rpull-up FPOB =1k, Vpull-up = +5 V) 0.5 1.0 2.0 msec Time delay PGI↑ to PGO↓ (PSONB<VOLPSONB, Rpull-up PGO =1k, Vpull-up = +5 V) 100 300 438 msec TdllySTART Time delay on start-up UV, OC, OTP lockout 45 75 130 msec TdelayOTP Time delay from an OTP↑ to FPOB↑ and PGO↓ 50% of the pull up voltage (PSONB<VOLPSONB, Rpull-up FPOB and PGO =1k, Vpull-up = +5 V) OTP↓ 0.5 1.0 2.0 msec TdlyOCP Time delay from an OCP to FPOB↑ and PGO↓ 50% of the pull up voltage (PSONB<VOLPSONB, Rpull up FPOB and PGO =1k, Vpull-up = +5 V) 11 20 32 msec TdlyPGI Time delay from PSONB↓ to PGO↑ 10-90% of the pull up voltage (PGI>VTHPGI, Rpull-up PGO=1k, Vpull-up = +5V) 124 338 500 msec 1.18 1.25 1.32 V Delay Characteristics TdlyPSONB TdlyPGO Overtemperature Input VOTP VOTPHYS Voltage threshold for OTP↓(PGO↓, FPOB↑, PSONB < VOLPSONB, Rpull-up FPOB and PGO =1k, Vpull-up = +5 V) Overtemperature Comparator Hysteresis (Note 3) 50 3. Guaranteed by design. http://onsemi.com 6 mV NCP4350 6.0V 4.0V 2.0V 0V V(PSONB:OUT) 5.0V 2.5V 0V V(PGI:OUT) 6.0V 4.0V 2.0V 0V V(OTP:OUT) 6.0V 4.0V 2.0V 0V V(OVP:OUT) 5.0V 2.5V 0V V(FPOB:3) 5.0V SEL>> 0V 0s 50ms 100ms 150ms 200ms 250ms 300ms 350ms 400ms 450ms 300ms 350ms 400ms 450ms V(PGO:3) Time Figure 3. PSONB ON/OFF 6.0V 4.0V 2.0V 0V V(PSONB:OUT) 5.0V 2.5V 0V V(PGI:OUT) 6.0V 4.0V 2.0V 0V V(OTP:OUT) 6.0V 4.0V 2.0V 0V V(OVP:OUT) 5.0V 2.5V 0V V(FPOB:3) 5.0V SEL>> 0V 0s 50ms 100ms 150ms 200ms 250ms V(PGO:3) Time Figure 4. AC Turn-On - UVP, OVP, OCP, OTP Fault http://onsemi.com 7 NCP4350 6.0V 4.0V 2.0V 0V V(PSONB:OUT) 5.0V 2.5V 0V V(PGI:OUT) 6.0V 4.0V 2.0V 0V V(OTP:OUT) 6.0V 4.0V 2.0V 0V V(OVP:OUT) 5.0V 2.5V 0V V(FPOB:3) 5.0V SEL>> 0V 0s 50ms 100ms 150ms 200ms 250ms 300ms 350ms 400ms 450ms 350ms 400ms 450ms V(PGO:3) Time Figure 5. PSONB Turn-On - AC Turn-Off 6.0V 4.0V 2.0V 0V V(PSONB:OUT) 5.0V 2.5V 0V V(PGI:OUT) 6.0V 4.0V 2.0V 0V V(OTP:OUT) 6.0V 4.0V 2.0V 0V V(OVP:OUT) 5.0V 2.5V 0V V(FPOB:3) 5.0V SEL>> 0V 0s 50ms 100ms 150ms 200ms 250ms 300ms V(PGO:3) Time Figure 6. AC Turn-On with OTP, UVP or OCP Fault http://onsemi.com 8 NCP4350 TABLE 1: ASIC TRUTH TABLE PGI PSONB (REMOTE) UVP,OVP,OCP FPOB (FAULT) PGO <1.25V(L) <1.25V(L) L No L L L Yes L L >1.25V(H) L No L H >1.25V(H) L Yes H L Overload Current Monitoring Output Voltage Sensing In ATX power supplies the output power must be monitored and limited. In the present ATX specification the +3.3 V and +5 V outputs have a very relaxed tolerance for the over current limit set point. As a result customers typically use the dc resistance in the output filter inductor. If very accuracy current sensing is required, as is the case for the +12 V outputs, a precision current shunt is used. Four output voltage sense lines are provided +3.3V, +5.0V, +12VA, +12VB. Each of the sensed input signals is inputted into an undervoltage (UVP) and overvoltage (OVP) comparators. In the event of an output fault (OVP or UVP) the fault trigger signal is delayed and then latch. The delay has been added to prevent the Latch from being set during output transient conditions. During start-up the UVP, OTP and OCP comparators output are ignored. IL VL RL R Power Good Input Vout Vsense The Power Good input (PGI) can be used to monitor an additional logic event, for example the temperature inside an ATX power supply. When the input voltage at the PGI is below the threshold 1.25 V, the Power Good Output (PGO) signal remains in a low state, even if all of the voltage and current sensed inputs are within the voltage and current limits. VS VR IS + OUT I3 8xIREF PSONB The PSONB input is active low and is used to turn on/off the primary side controller. The PSONB signal can also be used to reset the PGO output after a fault a condition has occurred. When the PSONB signal is low (the external connection), the Fault signal between the monitoring controller and the power supply is enabled (FAULT will be low, no Fault). In order to reset the Fault latch a minimum width pulse should be applied to the PSONB input, the pulse should be greater than 38 msec (typical). The circuit operates as shown, when the load current increases the voltage drop across the inductor, or current shunt, in series (the dc resistance) with the output increases reducing the voltage at the negative input of the overcurrent comparator. The voltage at the positive input to the comparator is set by the IREF current source, if the voltage at the negative input to the comparator is less than the voltage at the positive input to the comparator; the comparator output goes high indicating an overload condition. The overload trip level can be determined by the following relationships: VR + 8 R+ I REF Power Good Output The Power Good (PGO) signal is intended to warn the motherboard that the output voltage or current of at least one of the four outputs is out of tolerance. The PGO signal is delayed by 300 msec (typical) to avoid false tripping due to transient conditions. The PGO output is capable of sinking 5 mA of current. R RL @ IL IREF @ 8 Example: RI = 33 kW RL = 0.002 W R = 150 W FPOB Output I REF + In a typical application (refer to Figure 2) the Fault pin is activated (high level) when any one of four outputs is out of range, or there is an output overload condition. The Fault output is the link between the output monitoring circuits and the primary PWM. The Fault output is capable of sinking 5 mA of current. V REF + 1.25V RI 33k I L + I REF @ 8 @ R + 37.87mA @ 8 @ 150 + 22.72Adc 0.002 RL This calculation neglects input voltage offset, biases currents, and other tolerances. http://onsemi.com 9 NCP4350 PACKAGE DIMENSIONS SOIC-16 D SUFFIX CASE 751B-05 ISSUE J -A- 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C -T- SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 S The product described herein (NCP4350), may be covered by U.S. patents including 6,373,734. There may be other patents pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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